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TSB12LV32PZG4

Texas Instruments

TSB12LV32PZG4 by Texas Instruments

TSB12LV32PZG4 by Texas Instruments is a Serial Communication Controller with 3.6V max supply voltage, 50 MBps data transfer rate, and 60 MHz clock frequency. Ideal for IEEE1394 communication protocol applications due to its low profile design and 3.3V nominal voltage.

Median Price

$12.892

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Digiode

USA . 2,686 parts In-Stock

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Vyrian

USA . 9,599 parts In-Stock

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Sea View Technologies

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Bristol Electronics

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LIBRA Elektronik GmbH

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EMSNET

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Semi Source

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Distributors (Availability)

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Corphita

USA . 4,877 parts In-Stock

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$12.213

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Component Stockers USA

USA . 51 parts In-Stock

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$13.360

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Parana Technologies

USA . 1,513 parts In-Stock

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ChromeModa Solutions

Germany . 3,474 parts In-Stock

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$40.716

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$33.387

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IDEA Electronic Components Group

UK . 1,981 parts In-Stock

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DigiPath Technology Company

USA . 2,038 parts In-Stock

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Microchip USA

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Overview

Unlock seamless communication and connectivity with the TSB12LV32PZG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their products. The TSB12LV32PZG4 falls under the category of Serial Communication Controllers, offering high-speed data transfer rates of up to 50 MBps. With a maximum supply voltage of 3.6V and low power mode feature, this product is perfect for various applications requiring efficient serial communication. Experience the value and benefits of this innovative technology in your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and resistance to external elements, ensuring the product's longevity and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and enhancing the overall design of electronic systems.

Maximum Supply Voltage: 3.6 V

Operating within a safe voltage range ensures the stability and longevity of the product, leading to improved performance and reliability.

Address Bus Width: 7

A wider address bus allows for efficient data handling and processing, enabling the controller to manage larger volumes of information effectively.

Package Shape: SQUARE

The square shape offers a compact design, making it suitable for space-constrained applications where efficiency and compactness are essential.

Maximum Data Transfer Rate: 50 MBps

High data transfer rate supports fast and reliable communication, facilitating seamless data exchange between devices and enhancing overall system performance.

Maximum Operating Temperature: 70 °C

Operating reliably at high temperatures ensures the product's stability and functionality in various environmental conditions, making it suitable for a wide range of applications.

Power Supplies (V): 3.3,3.3/5

Compatibility with multiple power supply voltages offers flexibility in system integration and operation, making it adaptable to different power requirements.

Communication Protocol: IEEE1394

Support for a widely used communication protocol ensures compatibility with various devices, enabling seamless data exchange and interoperability within a network.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, contributing to energy efficiency and reliable operation in electronic systems.

Technical Specifications

Serial Communication Controllers TSB12LV32PZG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

7

Boundary Scan:

NO

Bus Compatibility:

68000; COLDFIRE

Maximum Clock Frequency:

60 MHz

Communication Protocol:

IEEE1394

Maximum Data Transfer Rate:

50 MBps

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

TSB12LV32PZG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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