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TSB12LV01BIPZTEP

Texas Instruments

TSB12LV01BIPZTEP by Texas Instruments

TSB12LV01BIPZTEP by Texas Instruments is a Serial Communication Controller with 8-bit address bus width, 50 MBps data transfer rate, and 49.152 MHz clock frequency. Ideal for industrial applications requiring high-speed serial I/O communication control in compact spaces due to its thin profile, fine pitch flatpack package style.

Median Price

$14.620

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 95 parts In-Stock

1+ parts

-

100+ parts

$14.620

1k+ parts

-

10k+ parts

-

95

-

$14.620

-

-

Rochester

USA . 77 parts In-Stock

1+ parts

-

100+ parts

$12.660

1k+ parts

$11.330

10k+ parts

$10.660

77

-

$12.660

$11.330

$10.660

Verical

USA . 77 parts In-Stock

1+ parts

-

100+ parts

$15.825

1k+ parts

$14.162

10k+ parts

$13.325

77

-

$15.825

$14.162

$13.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,179 parts In-Stock

1+ parts

$13.357

100+ parts

-

1k+ parts

-

10k+ parts

-

1,179

$13.357

-

-

-

Vyrian

USA . 4,506 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,506

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 120 parts In-Stock

1+ parts

$12.654

100+ parts

-

1k+ parts

-

10k+ parts

-

120

$12.654

-

-

-

Vigor

Singapore . 95 parts In-Stock

1+ parts

$13.500

100+ parts

-

1k+ parts

-

10k+ parts

-

95

$13.500

-

-

-

Parana Technologies

USA . 1,169 parts In-Stock

1+ parts

$34.700

100+ parts

-

1k+ parts

-

10k+ parts

-

1,169

$34.700

-

-

-

Microchip USA

USA . 313 parts In-Stock

1+ parts

$37.800

100+ parts

$37.260

1k+ parts

$36.990

10k+ parts

$36.720

313

$37.800

$37.260

$36.990

$36.720

IDEA Electronic Components Group

UK . 2,173 parts In-Stock

1+ parts

$38.989

100+ parts

$37.040

1k+ parts

$35.090

10k+ parts

-

2,173

$38.989

$37.040

$35.090

-

ChromeModa Solutions

Germany . 545 parts In-Stock

1+ parts

$38.989

100+ parts

$31.971

1k+ parts

-

10k+ parts

-

545

$38.989

$31.971

-

-

DigiPath Technology Company

USA . 2,057 parts In-Stock

1+ parts

-

100+ parts

$35.152

1k+ parts

-

10k+ parts

-

2,057

-

$35.152

-

-

Kepictronics

USA . 810 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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810

-

-

-

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Perfect Parts

USA . 284 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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284

-

-

-

-

Overview

Unlock seamless communication with the TSB12LV01BIPZTEP by Texas Instruments. Crafted with precision and expertise, this Serial Communication Controller offers unparalleled quality and reliability. Perfect for a wide range of applications, this product boasts a high data transfer rate of up to 50 MBps and a maximum clock frequency of 49.152 MHz. With its advanced technology and industrial-grade temperature grade, customers can trust in the value and performance that this innovative solution brings to their projects. Elevate your communication systems with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability, making this product suitable for harsh operating environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6 V ensures compatibility with a wide range of power sources while maintaining efficient performance.

Address Bus Width: 8

An address bus width of 8 allows for efficient communication with peripheral devices and enhances data transfer capabilities.

Package Shape: SQUARE

The square package shape provides ease of handling and alignment during installation, ensuring proper placement on the PCB.

Power Supplies (V): 3.3,3.3/5

Support for multiple power supply voltages (3.3 V and 3.3/5 V) offers flexibility in system design and compatibility with various power sources.

No. of Terminals: 100

Having 100 terminals allows for a wide range of input/output connections, enabling versatile connectivity options for peripheral devices.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The combination of flatpack, thin profile, and fine pitch package styles offers compact and space-saving design characteristics, ideal for applications with size constraints.

Minimum Supply Voltage: 3 V

With a minimum supply voltage of 3 V, the product ensures reliable operation even under lower power conditions, enhancing overall system performance.

Maximum Operating Temperature: 85 °C

Operating efficiently at a maximum temperature of 85°C allows for reliable performance in high-temperature environments, ensuring sustained functionality.

Maximum Data Transfer Rate: 50 MBps

The high data transfer rate of 50 MBps facilitates fast and efficient communication between devices, improving overall system speed and responsiveness.

Minimum Operating Temperature: -40 °C

The product can operate at temperatures as low as -40°C, making it suitable for use in cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and robust connections.

Terminal Position: QUAD

Quad terminal positioning offers stable and secure connections on the PCB, minimizing the risk of signal interference or disconnection.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2 mm, the product allows for low-profile PCB design, saving space and enabling compact system integration.

Width: 14 mm

The 14 mm width provides a compact form factor, making the product suitable for applications where space is limited or layout constraints exist.

External Data Bus Width: 32

A wide external data bus width of 32 enhances data processing capabilities and allows for high-speed communication between the controller and external devices.

Maximum Clock Frequency: 49.152 MHz

Operating at a maximum clock frequency of 49.152 MHz ensures fast and efficient data processing, enabling rapid communication and data transfer.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the product can withstand soldering processes without compromising its performance or reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and solder joint integrity, contributing to the product's overall quality and durability.

Length: 14 mm

The 14 mm length contributes to the compactness of the product, making it suitable for applications where space-saving solutions are essential.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, the product is built to withstand harsh environmental conditions and operate reliably in rugged settings.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

As a serial IO/communication controller, this product enables seamless data communication and control between various devices, enhancing system functionality and interoperability.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation and reliable performance in diverse applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure attachment to the PCB, reducing the risk of disconnection or signal loss, and ensuring stable electrical connections.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V allows for consistent performance and compatibility with standard power sources, simplifying system integration and design.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, the product offers precise and compact terminal spacing, enabling high-density mounting and efficient PCB layout design.

Moisture Sensitivity Level (MSL): 3

Having an MSL of 3 indicates that the product is sensitive to moisture but can withstand standard PCB assembly processes, ensuring reliability and performance in typical operating conditions.

Technical Specifications

Serial Communication Controllers TSB12LV01BIPZTEP attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

8

Boundary Scan:

NO

Maximum Clock Frequency:

49.152 MHz

Maximum Data Transfer Rate:

50 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

TSB12LV01BIPZTEP Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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