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TSB12LV21AIPGF

Texas Instruments

TSB12LV21AIPGF by Texas Instruments

TSB12LV21AIPGF by Texas Instruments is a Serial Communication Controller with 32-bit Address Bus Width and 50 MHz Max Clock Frequency. It is used in LAN applications, supports PCI bus compatibility, and operates at industrial temperature grade.

Median Price

$14.550

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,218 parts In-Stock

1+ parts

-

100+ parts

$12.590

1k+ parts

$11.260

10k+ parts

$10.600

3,218

-

$12.590

$11.260

$10.600

DigiKey

USA . 3,218 parts In-Stock

1+ parts

-

100+ parts

$14.550

1k+ parts

-

10k+ parts

-

3,218

-

$14.550

-

-

Verical

USA . 3,200 parts In-Stock

1+ parts

-

100+ parts

$15.738

1k+ parts

$14.075

10k+ parts

$13.250

3,200

-

$15.738

$14.075

$13.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,774 parts In-Stock

1+ parts

$13.290

100+ parts

-

1k+ parts

-

10k+ parts

-

4,774

$13.290

-

-

-

Vyrian

USA . 4,971 parts In-Stock

1+ parts

$13.990

100+ parts

-

1k+ parts

-

10k+ parts

-

4,971

$13.990

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 502 parts In-Stock

1+ parts

$12.591

100+ parts

-

1k+ parts

-

10k+ parts

-

502

$12.591

-

-

-

Vigor

Singapore . 3,218 parts In-Stock

1+ parts

$13.430

100+ parts

-

1k+ parts

-

10k+ parts

-

3,218

$13.430

-

-

-

Parana Technologies

USA . 1,148 parts In-Stock

1+ parts

$67.274

100+ parts

-

1k+ parts

-

10k+ parts

-

1,148

$67.274

-

-

-

DigiPath Technology Company

USA . 668 parts In-Stock

1+ parts

$74.077

100+ parts

$68.151

1k+ parts

-

10k+ parts

-

668

$74.077

$68.151

-

-

ChromeModa Solutions

Germany . 1,979 parts In-Stock

1+ parts

$75.589

100+ parts

$61.983

1k+ parts

-

10k+ parts

-

1,979

$75.589

$61.983

-

-

IDEA Electronic Components Group

UK . 840 parts In-Stock

1+ parts

$75.589

100+ parts

$71.810

1k+ parts

$68.030

10k+ parts

-

840

$75.589

$71.810

$68.030

-

Kepictronics

USA . 115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

115

-

-

-

-

Overview

Experience seamless and efficient serial communication with the TSB12LV21AIPGF by Texas Instruments. Crafted with precision and quality, this device offers unrivaled performance and reliability. Whether you're in the industrial sector or require LAN connectivity, this product is designed to meet your needs. With a maximum data transfer rate of 50 MBps and a maximum clock frequency of 50 MHz, you can trust in its speed and efficiency. Trust Texas Instruments to deliver cutting-edge technology that enhances your operations and boosts productivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and cost during production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage tolerance provides flexibility in power supply options and ensures stable operation.

Address Bus Width: 32

A wide address bus width allows for efficient handling of memory addressing and data transfer, enhancing the product's performance.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style saves space on the PCB, making it suitable for compact designs and densely populated boards.

Maximum Data Transfer Rate: 50 MBps

The high data transfer rate enables fast and reliable communication between devices, making the product suitable for high-speed applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures the product can operate reliably in various environmental conditions, increasing its versatility.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

The peripheral IC type indicates that the product is designed for serial IO and communication control, making it a suitable choice for networking applications.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, contributing to energy efficiency and signal integrity.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage provides a stable power source for the product's operation, ensuring consistent performance and reliability.

Technical Specifications

Serial Communication Controllers TSB12LV21AIPGF attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

32

Boundary Scan:

NO

Bus Compatibility:

PCI

Maximum Clock Frequency:

50 MHz

Maximum Data Transfer Rate:

50 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

NO

No. of Serial I/Os:

1

No. of Terminals:

176

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Trade Compliance

TSB12LV21AIPGF Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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