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TSB12LV01APZ

Texas Instruments

TSB12LV01APZ by Texas Instruments

TSB12LV01APZ by Texas Instruments is a Serial Communication Controller with 100 terminals, operating at 3.3V. It offers a data transfer rate of 50 MBps and supports LAN applications. This CMOS technology device has a low profile flatpack package ideal for commercial temperature grade environments.

Median Price

$12.830

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 39,248 parts In-Stock

1+ parts

-

100+ parts

$11.100

1k+ parts

$9.930

10k+ parts

$9.340

39,248

-

$11.100

$9.930

$9.340

DigiKey

USA . 39,248 parts In-Stock

1+ parts

-

100+ parts

$12.830

1k+ parts

-

10k+ parts

-

39,248

-

$12.830

-

-

Verical

USA . 39,248 parts In-Stock

1+ parts

-

100+ parts

$13.875

1k+ parts

$12.412

10k+ parts

$11.675

39,248

-

$13.875

$12.412

$11.675

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,015 parts In-Stock

1+ parts

$11.723

100+ parts

-

1k+ parts

-

10k+ parts

-

2,015

$11.723

-

-

-

Vyrian

USA . 2,471 parts In-Stock

1+ parts

$12.340

100+ parts

-

1k+ parts

-

10k+ parts

-

2,471

$12.340

-

-

-

Bristol Electronics

USA . 470 parts In-Stock

1+ parts

$12.800

100+ parts

$8.960

1k+ parts

$8.320

10k+ parts

-

470

$12.800

$8.960

$8.320

-

DigiKey Marketplace

USA . 39,248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

39,248

-

-

-

-

Dan-Mar Components

USA . 470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

470

-

-

-

-

Lantek

USA . 16 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16

-

-

-

-

ComSIT Distribution GmbH

Germany . 15 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15

-

-

-

-

R&J Components

USA . 12 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12

-

-

-

-

Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,415 parts In-Stock

1+ parts

$11.106

100+ parts

-

1k+ parts

-

10k+ parts

-

2,415

$11.106

-

-

-

Vigor

Singapore . 39,248 parts In-Stock

1+ parts

$11.850

100+ parts

-

1k+ parts

-

10k+ parts

-

39,248

$11.850

-

-

-

Component Stockers USA

USA . 83,350 parts In-Stock

1+ parts

$12.640

100+ parts

$11.880

1k+ parts

$10.740

10k+ parts

$10.740

83,350

$12.640

$11.880

$10.740

$10.740

Parana Technologies

USA . 1,917 parts In-Stock

1+ parts

$24.438

100+ parts

-

1k+ parts

$25.107

10k+ parts

-

1,917

$24.438

-

$25.107

-

DigiPath Technology Company

USA . 961 parts In-Stock

1+ parts

$26.909

100+ parts

$24.756

1k+ parts

-

10k+ parts

-

961

$26.909

$24.756

-

-

ChromeModa Solutions

Germany . 2,548 parts In-Stock

1+ parts

$27.458

100+ parts

$22.516

1k+ parts

-

10k+ parts

-

2,548

$27.458

$22.516

-

-

IDEA Electronic Components Group

UK . 1,277 parts In-Stock

1+ parts

$27.458

100+ parts

$26.085

1k+ parts

$24.712

10k+ parts

-

1,277

$27.458

$26.085

$24.712

-

GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Perfect Parts

USA . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8

-

-

-

-

Overview

Discover the TSB12LV01APZ by Texas Instruments, a high-quality Serial Communication Controller that offers seamless data transfer at up to 50 MBps. Manufactured by industry leader Texas Instruments, this versatile product is perfect for applications requiring reliable and efficient communication. With its low profile design and nickel palladium gold terminal finish, this controller provides exceptional value and performance. Upgrade your system today with the TSB12LV01APZ and experience the benefits of top-notch technology from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort during production.

Power Supplies (V): 3.3

Operates at a low voltage of 3.3V, making it energy efficient and suitable for various applications.

Maximum Data Transfer Rate: 50 MBps

With a high data transfer rate of 50 MBps, this product enables fast and efficient communication between devices.

Temperature Grade: COMMERCIAL

Designed for commercial use, ensuring reliable performance in standard operating conditions.

Technical Specifications

Serial Communication Controllers TSB12LV01APZ attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Maximum Data Transfer Rate:

50 MBps

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

1

No. of Serial I/Os:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Controllers

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

TSB12LV01APZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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