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TSB12LV21BMPGF

Texas Instruments

TSB12LV21BMPGF by Texas Instruments

TSB12LV21BMPGF by Texas Instruments is a Serial Communication Controller with 32-bit Address Bus, 50 MBps Data Transfer Rate, and 33 MHz Clock Frequency. Ideal for military applications due to its MIL-graded Temperature Range and compatibility with PCI bus.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,240 parts In-Stock

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Digiode

USA . 1,094 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 356 parts In-Stock

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$5.177

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One Stop Electronics

USA . 736 parts In-Stock

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$27.000

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736

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Parana Technologies

USA . 1,659 parts In-Stock

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$54.804

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DigiPath Technology Company

USA . 1,687 parts In-Stock

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$60.346

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ChromeModa Solutions

Germany . 1,157 parts In-Stock

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$61.578

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$50.494

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$61.578

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IDEA Electronic Components Group

UK . 1,103 parts In-Stock

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$61.578

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$58.499

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$55.420

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Corphita

USA . 362 parts In-Stock

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Overview

Unleash the power of seamless serial communication with the TSB12LV21BMPGF by Texas Instruments. As a trusted leader in the industry, Texas Instruments delivers unparalleled quality and reliability. This versatile Serial Communication Controller is perfect for a wide range of applications, offering high-speed data transfer rates and compatibility with PCI buses. Experience the value and benefits of this cutting-edge technology, providing customers with a reliable solution that exceeds expectations. Elevate your projects with the TSB12LV21BMPGF and unlock a world of innovative possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for long-lasting performance.

Surface Mount: YES

Easily integrated into circuit boards for efficient use of space.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply options.

Address Bus Width: 32

High address bus width allows for efficient data transfer and management.

Package Shape: SQUARE

Compact shape for easy installation in tight spaces.

Power Supplies (V): 3.3,5

Compatibility with multiple power supplies for versatile use.

No. of Terminals: 176

Sufficient terminals for connecting various devices and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Sleek and modern design for streamlined circuit board layout.

Minimum Supply Voltage: 3 V

Reliable performance even at low supply voltage levels.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stability in various environments.

Maximum Data Transfer Rate: 50 MBps

Fast data transfer rate for efficient communication.

Minimum Operating Temperature: -55 °C

Ability to operate in extreme cold temperatures without performance issues.

Terminal Position: QUAD

Quad terminal position for secure and stable connections.

Maximum Seated Height: 1.6 mm

Low profile design for space-saving installation.

Width: 24 mm

Compact width for easy integration into circuit boards.

External Data Bus Width: 32

Wide external data bus for efficient data transfer.

Maximum Clock Frequency: 33 MHz

High clock frequency for fast data processing.

Length: 24 mm

Compact length for space-saving installation.

Temperature Grade: MILITARY

Military-grade temperature tolerance for reliable performance in harsh conditions.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Specialized IC type for efficient communication control.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull-wing terminal form for secure and reliable connections.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance.

Bus Compatibility: PCI

Compatible with PCI bus for easy integration into existing systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise and reliable connections.

Technical Specifications

Serial Communication Controllers TSB12LV21BMPGF attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 4.5 TO 5.5 VOLTS

Address Bus Width:

32

Boundary Scan:

NO

Bus Compatibility:

PCI

Maximum Clock Frequency:

33 MHz

Maximum Data Transfer Rate:

50 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

NO

No. of Serial I/Os:

1

No. of Terminals:

176

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Trade Compliance

TSB12LV21BMPGF Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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