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TSB12C01APZR

Texas Instruments

TSB12C01APZR by Texas Instruments

TSB12C01APZR by Texas Instruments is a Serial Communication Controller with 8-bit address bus, 32-bit external data bus width, and 50 MBps max data transfer rate. Ideal for applications requiring high-speed serial I/O communication in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,841 parts In-Stock

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8,841

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Digiode

USA . 4,291 parts In-Stock

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4,291

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Distributors (Availability)

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AZTECH Wire

Italy . 869 parts In-Stock

1+ parts

$7.034

100+ parts

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869

$7.034

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One Stop Electronics

USA . 906 parts In-Stock

1+ parts

$8.000

100+ parts

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906

$8.000

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Parana Technologies

USA . 2,210 parts In-Stock

1+ parts

$42.775

100+ parts

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2,210

$42.775

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ChromeModa Solutions

Germany . 4,790 parts In-Stock

1+ parts

$48.062

100+ parts

$39.411

1k+ parts

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4,790

$48.062

$39.411

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IDEA Electronic Components Group

UK . 64 parts In-Stock

1+ parts

$48.062

100+ parts

$45.659

1k+ parts

$43.256

10k+ parts

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64

$48.062

$45.659

$43.256

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DigiPath Technology Company

USA . 2,267 parts In-Stock

1+ parts

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100+ parts

$43.333

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2,267

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$43.333

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Corphita

USA . 90 parts In-Stock

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90

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Overview

Discover the power of seamless serial communication with the TSB12C01APZR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-quality products that deliver exceptional performance. Ideal for a wide range of applications, this serial communication controller offers unparalleled value and benefits to customers. With a maximum data transfer rate of 50 MBps and a maximum clock frequency of 24.576 MHz, this product provides reliable and efficient communication solutions. Upgrade your systems today with the TSB12C01APZR and experience the difference Texas Instruments can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components of the product.

Surface Mount: YES

Surface mount technology makes the product easy to integrate onto circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating a wide range of applications.

Address Bus Width: 8

Having a wider address bus width allows for more complex addressing schemes, enabling the product to work with larger memory capacities.

Package Shape: SQUARE

The square shape of the package makes it easy to handle and work with during assembly and installation.

No. of Terminals: 100

Having a high number of terminals provides ample connectivity options, allowing for versatile integration into different systems.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures that the product can operate efficiently even with lower power sources.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand a wide range of environmental conditions, making it suitable for various applications.

Maximum Data Transfer Rate: 50 MBps

The high data transfer rate allows for fast and efficient communication, enabling quick data processing and response times.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the product can function in cold environments without any issues.

Terminal Position: QUAD

The quad terminal position provides stability and secure connections, preventing any potential issues with loose connections.

Maximum Seated Height: 1.6 mm

The low seated height allows for a compact design, making it suitable for applications where space is limited.

Width: 14 mm

The compact width of the product makes it easy to integrate into tight spaces or crowded circuit boards.

External Data Bus Width: 32

A wider external data bus width allows for faster data transfer and processing capabilities, enhancing the overall performance of the product.

Maximum Clock Frequency: 24.576 MHz

The high maximum clock frequency enables the product to handle data at high speeds, ensuring efficient operation in demanding applications.

Length: 14 mm

The compact length of the product contributes to its overall small form factor, making it ideal for space-constrained applications.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature ranges makes the product suitable for standard operating environments found in most commercial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The peripheral IC type signifies that the product is designed specifically for serial communication and I/O tasks, ensuring optimal performance in such applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in various operating conditions.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections, making it easier to integrate the product onto circuit boards with confidence.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a common standard in many electronic systems, ensuring compatibility with a wide range of devices and power sources.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting, enabling the product to be used in applications where space is at a premium.

Technical Specifications

Serial Communication Controllers TSB12C01APZR attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

8

Boundary Scan:

NO

Maximum Clock Frequency:

24.576 MHz

Maximum Data Transfer Rate:

50 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

NO

No. of Serial I/Os:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

TSB12C01APZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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