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TSB12LV01A

Texas Instruments

TSB12LV01A by Texas Instruments

TSB12LV01A by Texas Instruments is a Serial Communication Controller with 100 terminals, operating at 3.3V nominal voltage. It supports data transfer rates up to 50 MBps and clock frequencies of 50 MHz, making it ideal for LAN communication applications. The package style is flatpack, low profile, fine pitch with a terminal pitch of 0.5 mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,328 parts In-Stock

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9,328

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Digiode

USA . 2,915 parts In-Stock

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2,915

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ComSIT Distribution GmbH

Germany . 185 parts In-Stock

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185

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Mil-Aero Solutions, Inc.

USA . 14 parts In-Stock

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14

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Distributors (Availability)

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One Stop Electronics

USA . 1,194 parts In-Stock

1+ parts

$7.000

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1,194

$7.000

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AZTECH Wire

Italy . 806 parts In-Stock

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$17.513

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806

$17.513

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Parana Technologies

USA . 1,146 parts In-Stock

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$26.842

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$29.098

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1,146

$26.842

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$29.098

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DigiPath Technology Company

USA . 2,291 parts In-Stock

1+ parts

$29.556

100+ parts

$27.191

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2,291

$29.556

$27.191

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ChromeModa Solutions

Germany . 5,758 parts In-Stock

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$30.159

100+ parts

$24.730

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5,758

$30.159

$24.730

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IDEA Electronic Components Group

UK . 1,675 parts In-Stock

1+ parts

$30.159

100+ parts

$28.651

1k+ parts

$27.143

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1,675

$30.159

$28.651

$27.143

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Corphita

USA . 4,992 parts In-Stock

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Perfect Parts

USA . 2 parts In-Stock

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2

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Overview

Discover the TSB12LV01A by Texas Instruments, a top-quality Serial Communication Controller designed to elevate your communication needs. With a focus on innovation and reliability, Texas Instruments ensures that this product delivers seamless data transfer at a blazing speed of 50 MBps. Perfect for a wide range of applications, this controller offers customers unparalleled value and benefits. Upgrade your system with the TSB12LV01A and experience the advantage of cutting-edge technology in your hands.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body ensures the product is long-lasting and easy to handle.

Surface Mount: YES

Allows for easy installation on circuit boards, making it efficient for manufacturing processes.

Maximum Supply Voltage: 3.6 V

Can handle higher voltages without risk of damage, providing stability in operation.

Address Bus Width: 8

Wide address bus width allows for efficient data communication and processing.

No. of Terminals: 100

Sufficient number of terminals for connecting to other components and peripherals.

Maximum Data Transfer Rate: 50 MBps

High data transfer rate enables fast and reliable communication between devices.

Temperature Grade: COMMERCIAL

Suitable for commercial use in standard temperature conditions, ensuring reliable performance.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

Designed for serial communication control and LAN connectivity, making it versatile for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall efficiency.

Technical Specifications

Serial Communication Controllers TSB12LV01A attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

8

Boundary Scan:

NO

Maximum Clock Frequency:

50 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

50 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

TSB12LV01A Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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