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TSB12C01AIPZ

Texas Instruments

TSB12C01AIPZ by Texas Instruments

TSB12C01AIPZ by Texas Instruments is a Serial Communication Controller with 32-bit External Data Bus, 50 MBps Max Data Transfer Rate, and 24.576 MHz Max Clock Frequency. Ideal for industrial applications requiring high-speed serial I/O communication control in a compact FLATPACK package with low profile and fine pitch design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,001 parts In-Stock

1+ parts

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100+ parts

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6,001

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Digiode

USA . 469 parts In-Stock

1+ parts

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-

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10k+ parts

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469

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 737 parts In-Stock

1+ parts

$7.241

100+ parts

-

1k+ parts

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737

$7.241

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One Stop Electronics

USA . 1,471 parts In-Stock

1+ parts

$35.000

100+ parts

-

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10k+ parts

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1,471

$35.000

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Parana Technologies

USA . 1,230 parts In-Stock

1+ parts

$39.823

100+ parts

-

1k+ parts

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1,230

$39.823

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DigiPath Technology Company

USA . 1,728 parts In-Stock

1+ parts

$43.850

100+ parts

$40.342

1k+ parts

-

10k+ parts

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1,728

$43.850

$40.342

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ChromeModa Solutions

Germany . 5,676 parts In-Stock

1+ parts

$44.745

100+ parts

$36.691

1k+ parts

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10k+ parts

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5,676

$44.745

$36.691

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IDEA Electronic Components Group

UK . 334 parts In-Stock

1+ parts

$44.745

100+ parts

$42.508

1k+ parts

$40.270

10k+ parts

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334

$44.745

$42.508

$40.270

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Corphita

USA . 4,160 parts In-Stock

1+ parts

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4,160

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Overview

Upgrade your communication systems with the TSB12C01AIPZ by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in the Serial Communication Controllers category. This product offers lightning-fast data transfer rates of up to 50 MBps, making it ideal for a wide range of applications. With its compact design and industrial-grade temperature tolerance, the TSB12C01AIPZ provides exceptional value and performance for all your communication needs. Elevate your projects with this top-of-the-line controller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product suitable for various applications where weight and durability are important factors.

Surface Mount: YES

Surface mount capability makes installation and assembly easier and more efficient, saving time and effort during production.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this product can tolerate voltage fluctuations and variations, providing robust performance and reliability in different power supply conditions.

Address Bus Width: 8

An address bus width of 8 allows for precise and efficient data addressing, improving the overall speed and accuracy of data transfer within the system.

Package Shape: SQUARE

The square package shape is compact and space-saving, making it ideal for applications where board space is limited.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the product can operate reliably in harsh industrial environments without overheating or performance degradation.

Maximum Data Transfer Rate: 50 MBps

The high data transfer rate of 50 MBps allows for fast and efficient communication between devices, making this product suitable for high-speed data transmission applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the efficiency and reliability of the product.

Technical Specifications

Serial Communication Controllers TSB12C01AIPZ attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

8

Boundary Scan:

NO

Maximum Clock Frequency:

24.576 MHz

Maximum Data Transfer Rate:

50 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

NO

No. of Serial I/Os:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

TSB12C01AIPZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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