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TSB12C01APZ

Texas Instruments

TSB12C01APZ by Texas Instruments

TSB12C01APZ by Texas Instruments is a Serial Communication Controller with 8-bit Address Bus Width, 50 MBps Data Transfer Rate, and 24.576 MHz Clock Frequency. It is used in applications requiring high-speed serial communication such as data transfer or networking systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,164 parts In-Stock

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Digiode

USA . 748 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 300 parts In-Stock

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300

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Component Electronics Inc.

Canada . 36 parts In-Stock

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Cyclops Electronics Ltd

UK . 7 parts In-Stock

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Prism Electronics

USA . 6 parts In-Stock

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MRC Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 698 parts In-Stock

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$16.761

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One Stop Electronics

USA . 1,293 parts In-Stock

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$31.000

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Parana Technologies

USA . 1,689 parts In-Stock

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$49.609

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$4,606.911

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$44.648

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DigiPath Technology Company

USA . 1,670 parts In-Stock

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$54.625

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$50.255

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ChromeModa Solutions

Germany . 3,692 parts In-Stock

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$55.740

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$45.707

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IDEA Electronic Components Group

UK . 1,037 parts In-Stock

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$55.740

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$52.953

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$50.166

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Corphita

USA . 1,541 parts In-Stock

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Metaverse IC Inc.

Canada . 131 parts In-Stock

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Perfect Parts

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Overview

Unlock seamless and efficient serial communication with the TSB12C01APZ by Texas Instruments. With a reputation for excellence, Texas Instruments delivers top-quality products that guarantee reliability and performance. Ideal for a wide range of applications, this serial communication controller offers unmatched value to customers seeking high-speed data transfer capabilities. Experience the benefits of superior technology and innovation with the TSB12C01APZ, your solution for seamless connectivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the controller.

Maximum Supply Voltage: 5.25 V

Higher supply voltage allows for increased performance and reliability of the controller.

Maximum Data Transfer Rate: 50 MBps

High data transfer rate enables fast and efficient communication between devices.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures the controller can function in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for the controller.

Technical Specifications

Serial Communication Controllers TSB12C01APZ attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

8

Boundary Scan:

NO

Maximum Clock Frequency:

24.576 MHz

Maximum Data Transfer Rate:

50 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

1

No. of Serial I/Os:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

TSB12C01APZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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