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TPIC2701MJ

Texas Instruments

TPIC2701MJ by Texas Instruments

TPIC2701MJ by Texas Instruments is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 0.8 ohm Max RDS(on). It features 3A IDM, 22mJ EAS, and operates in ENHANCEMENT MODE. Ideal for applications requiring high current handling capabilities in a compact IN-LINE package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,914 parts In-Stock

1+ parts

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5,914

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Digiode

USA . 4,212 parts In-Stock

1+ parts

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4,212

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 750 parts In-Stock

1+ parts

$0.611

100+ parts

-

1k+ parts

$1.687

10k+ parts

-

750

$0.611

-

$1.687

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DigiPath Technology Company

USA . 1,630 parts In-Stock

1+ parts

$0.672

100+ parts

$0.618

1k+ parts

-

10k+ parts

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1,630

$0.672

$0.618

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ChromeModa Solutions

Germany . 4,561 parts In-Stock

1+ parts

$0.686

100+ parts

$0.563

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-

10k+ parts

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4,561

$0.686

$0.563

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IDEA Electronic Components Group

UK . 148 parts In-Stock

1+ parts

$0.686

100+ parts

-

1k+ parts

$0.617

10k+ parts

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148

$0.686

-

$0.617

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Semicontronic

India . 1,029 parts In-Stock

1+ parts

$3.050

100+ parts

$2.974

1k+ parts

$2.958

10k+ parts

-

1,029

$3.050

$2.974

$2.958

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AZTECH Wire

Italy . 600 parts In-Stock

1+ parts

$6.994

100+ parts

-

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600

$6.994

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One Stop Electronics

USA . 1,458 parts In-Stock

1+ parts

$8.050

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1,458

$8.050

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Ampacity Inc.

Singapore . 1,547 parts In-Stock

1+ parts

$22.050

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1,547

$22.050

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Corphita

USA . 3,314 parts In-Stock

1+ parts

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3,314

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Corohmni

South Africa . 292 parts In-Stock

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292

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Overview

Looking to power up your next project with top-quality components? Look no further than the TPIC2701MJ by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers reliable and durable Power Field Effect Transistors like the TPIC2701MJ. This product offers enhanced performance and efficiency, making it ideal for a wide range of applications. Say goodbye to worries about breakdown voltage or drain current - the TPIC2701MJ has got you covered. Upgrade your projects today with this cutting-edge component from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material ensures high durability and protection for the FET, making it suitable for rugged environments.

Minimum DS Breakdown Voltage: 60 V

With a high minimum breakdown voltage of 60V, this FET can handle high voltage applications safely and reliably.

Maximum Pulsed Drain Current (IDM): 3 A

The high maximum pulsed drain current of 3A allows this FET to handle short bursts of high current, making it suitable for applications requiring power surges.

Avalanche Energy Rating (EAS): 22 mJ

The high avalanche energy rating of 22 mJ indicates that this FET can withstand energy spikes and surges, enhancing its reliability in high-stress environments.

Maximum Drain-Source On Resistance: 0.8 ohm

With a low maximum drain-source on resistance of 0.8 ohm, this FET minimizes power loss and heat generation, making it efficient for various power applications.

Technical Specifications

Power Field Effect Transistors (FET) TPIC2701MJ attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Avalanche Energy Rating (EAS):

22 mJ

Configuration:

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

.5 A

Maximum Drain-Source On Resistance:

.8 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-GDIP-T24

No. of Elements:

7

No. of Terminals:

24

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

3 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

TPIC2701MJ Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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