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TPIC1310KTS

Texas Instruments

TPIC1310KTS by Texas Instruments

TPIC1310KTS by Texas Instruments is a N-CHANNEL Power FET with 30V DS Breakdown Voltage and 3A Max ID. It is used for SWITCHING applications, featuring a max IDM of 12A and 0.37 ohm RDS(on). The transistor operates in ENHANCEMENT MODE with a max temp of 150°C, making it suitable for high-power circuit designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,943 parts In-Stock

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2,943

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Vyrian

USA . 1,943 parts In-Stock

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1,943

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,689 parts In-Stock

1+ parts

$1.492

100+ parts

-

1k+ parts

$2.164

10k+ parts

-

1,689

$1.492

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$2.164

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DigiPath Technology Company

USA . 1,333 parts In-Stock

1+ parts

$1.642

100+ parts

$1.511

1k+ parts

-

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1,333

$1.642

$1.511

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ChromeModa Solutions

Germany . 1,181 parts In-Stock

1+ parts

$1.676

100+ parts

$1.374

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1,181

$1.676

$1.374

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IDEA Electronic Components Group

UK . 636 parts In-Stock

1+ parts

$1.676

100+ parts

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$1.508

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636

$1.676

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$1.508

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Semicontronic

India . 520 parts In-Stock

1+ parts

$8.050

100+ parts

$7.849

1k+ parts

$7.808

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520

$8.050

$7.849

$7.808

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AZTECH Wire

Italy . 878 parts In-Stock

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$8.132

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878

$8.132

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Ampacity Inc.

Singapore . 1,199 parts In-Stock

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$16.050

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1,199

$16.050

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One Stop Electronics

USA . 196 parts In-Stock

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$20.050

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196

$20.050

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Corphita

USA . 1,039 parts In-Stock

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1,039

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Corohmni

South Africa . 470 parts In-Stock

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Overview

Upgrade your power systems with the TPIC1310KTS by Texas Instruments, a top-quality Power Field Effect Transistor designed for switching applications. With a durable plastic/epoxy package body and N-channel polarity, this complex transistor offers reliable performance and enhanced efficiency. Perfect for a wide range of industrial and automotive applications, this transistor provides a maximum pulsed drain current of 12A and a maximum power dissipation of 13.9W, ensuring optimal functionality in any setting. Trust Texas Instruments for cutting-edge technology and unparalleled value in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good mechanical strength and excellent thermal stability, contributing to the overall reliability and longevity of the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and higher conductivity, making them efficient for switching applications.

Minimum DS Breakdown Voltage: 30 V

This high breakdown voltage ensures that the FET can handle higher voltages without breakdown, making it suitable for a wide range of applications.

Maximum Drain Current (Abs) (ID): 3 A

With a maximum drain current of 3A, this FET can handle moderate power loads reliably.

Maximum Power Dissipation (Abs): 13.9 W

The high power dissipation capability allows the FET to handle high power levels without overheating, ensuring stable operation.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without performance degradation, making it suitable for a wide range of environments.

Technical Specifications

Power Field Effect Transistors (FET) TPIC1310KTS attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

ESD PROTECTED

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

3 A

Maximum Drain Current (ID):

3 A

Maximum Drain-Source On Resistance:

.37 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T15

No. of Elements:

6

No. of Terminals:

15

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

12 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

TPIC1310KTS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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