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TMX5703137AZWTQQ1

Texas Instruments

TMX5703137AZWTQQ1 by Texas Instruments

TMX5703137AZWTQQ1 by Texas Instruments is a 32-bit microcontroller with 16-bit address and data bus width, operating at up to 80 MHz. It features 262144 bytes of RAM, FLASH ROM programmability, and ADC/DMA channels for industrial applications requiring high-speed processing and control capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 7,672 parts In-Stock

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Digiode

USA . 3,002 parts In-Stock

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Inventory MP

USA . 71 parts In-Stock

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Bristol Electronics

USA . 71 parts In-Stock

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AZTECH Wire

Italy . 734 parts In-Stock

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$11.847

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One Stop Electronics

USA . 1,353 parts In-Stock

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$29.000

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Parana Technologies

USA . 1,177 parts In-Stock

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$39.819

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DigiPath Technology Company

USA . 341 parts In-Stock

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$43.846

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$40.338

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341

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ChromeModa Solutions

Germany . 3,683 parts In-Stock

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$44.741

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$36.688

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IDEA Electronic Components Group

UK . 250 parts In-Stock

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$44.741

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$42.504

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$40.267

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Microchip USA

USA . 4,387 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Overview

Experience unparalleled performance and reliability with the TMX5703137AZWTQQ1 microcontroller by Texas Instruments, a leader in innovative technology. Ideal for a wide range of applications, this cutting-edge device offers customers unmatched value and benefits. With its advanced features and exceptional quality, this microcontroller provides seamless operation and maximum efficiency, making it the perfect choice for all your electronic needs. Trust Texas Instruments to deliver top-of-the-line products that exceed expectations every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers as it provides good insulation and protection for the internal components.

Surface Mount: YES

Surface mount technology provides a compact and space-saving design, making it suitable for small electronic devices.

Maximum Supply Voltage: 1.32 V

With a low maximum supply voltage, this microcontroller is well-suited for low-power applications.

Address Bus Width: 16

A 16-bit address bus allows for efficient memory addressing and access in the microcontroller.

Screening Level: AEC-Q100

This screening level ensures high reliability and quality, making it suitable for automotive applications where reliability is crucial.

Maximum Operating Temperature: 105 °C

The wide temperature range allows for operation in harsh environmental conditions, enhancing the versatility of the microcontroller.

CPU Family: CORTEX-R4F

The Cortex-R4F CPU family is known for its high performance and real-time processing capabilities, making it suitable for applications requiring real-time response.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and signals, expanding its range of applications.

ROM Programmability: FLASH

Flash ROM allows for easy programming and reprogramming of the microcontroller, enabling flexibility in design and development.

RAM Bytes: 262144

With a large RAM capacity, the microcontroller can efficiently handle complex tasks and data processing.

Technical Specifications

Microcontrollers TMX5703137AZWTQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3.3 V NOMINAL I/O SUPPLY

Address Bus Width:

16

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

44

No. of Terminals:

337

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3,3.3/5

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

405 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMX5703137AZWTQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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