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TMS5702135DPGEQQ1

Texas Instruments

TMS5702135DPGEQQ1 by Texas Instruments

TMS5702135DPGEQQ1 by Texas Instruments is a 32-bit microcontroller with 262144 RAM bytes, 24-Ch 12-Bit ADCs, and 51 timers. Ideal for automotive applications, it features CAN(3), I2C, SPI(3), UART(2) connectivity and operates at up to 80 MHz clock frequency.

Median Price

$32.290

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,015 parts In-Stock

1+ parts

$22.780

100+ parts

$19.898

1k+ parts

$13.723

10k+ parts

-

5,015

$22.780

$19.898

$13.723

-

Mouser Electronics

USA . 62 parts In-Stock

1+ parts

$41.800

100+ parts

$32.500

1k+ parts

$30.630

10k+ parts

-

62

$41.800

$32.500

$30.630

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,361 parts In-Stock

1+ parts

$21.641

100+ parts

-

1k+ parts

-

10k+ parts

-

2,361

$21.641

-

-

-

Nova Conductors

Japan . 60 parts In-Stock

1+ parts

$23.870

100+ parts

-

1k+ parts

-

10k+ parts

-

60

$23.870

-

-

-

Vyrian

USA . 4,419 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,419

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,192 parts In-Stock

1+ parts

$19.360

100+ parts

-

1k+ parts

-

10k+ parts

-

2,192

$19.360

-

-

-

Corphita

USA . 1,013 parts In-Stock

1+ parts

$20.502

100+ parts

-

1k+ parts

-

10k+ parts

-

1,013

$20.502

-

-

-

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$23.870

100+ parts

$22.676

1k+ parts

-

10k+ parts

$21.244

300

$23.870

$22.676

-

$21.244

Continental Prestige Electronics

USA . 2,857 parts In-Stock

1+ parts

$23.870

100+ parts

-

1k+ parts

-

10k+ parts

$23.393

2,857

$23.870

-

-

$23.393

Parana Technologies

USA . 407 parts In-Stock

1+ parts

$36.718

100+ parts

-

1k+ parts

-

10k+ parts

-

407

$36.718

-

-

-

DigiPath Technology Company

USA . 2,140 parts In-Stock

1+ parts

$40.431

100+ parts

$37.196

1k+ parts

-

10k+ parts

-

2,140

$40.431

$37.196

-

-

IDEA Electronic Components Group

UK . 1,881 parts In-Stock

1+ parts

$41.256

100+ parts

$39.193

1k+ parts

$37.130

10k+ parts

-

1,881

$41.256

$39.193

$37.130

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ChromeModa Solutions

Germany . 1,220 parts In-Stock

1+ parts

$41.256

100+ parts

$33.830

1k+ parts

-

10k+ parts

-

1,220

$41.256

$33.830

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-

Microchip USA

USA . 2,299 parts In-Stock

1+ parts

$56.340

100+ parts

$55.360

1k+ parts

$54.870

10k+ parts

$54.380

2,299

$56.340

$55.360

$54.870

$54.380

Argo Parts USA

USA . 302 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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302

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Overview

Elevate your automotive electronics with the TMS5702135DPGEQQ1 microcontroller from Texas Instruments. Designed with precision and reliability in mind, this Cortex-R4F CPU family chip offers advanced features like ADC channels, DMA support, and a wide range of connectivity options. Perfect for applications requiring high performance and low power consumption, this microcontroller provides 32-bit processing power and extensive peripheral support. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Choose the TMS5702135DPGEQQ1 for seamless integration and superior performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body offers durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage of 1.32 V allows for stable performance and reliable operation of the microcontroller within specified limits.

CPU Family: CORTEX-R4F

Being part of the CORTEX-R4F CPU family ensures high performance and efficient processing capabilities, making it suitable for demanding applications.

ADC Channels: YES

Having ADC channels enables the microcontroller to convert analog signals to digital data, providing flexibility in interfacing with external sensors and devices.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC-based design of the microcontroller allows for faster data processing and lower power consumption, making it an efficient choice for embedded systems.

Connectivity: CAN(3), I2C, SPI(3), UART(2)

With various connectivity options such as CAN, I2C, SPI, and UART interfaces, the microcontroller can easily communicate with other devices and systems in a networked environment.

Technical Specifications

Microcontrollers TMS5702135DPGEQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

4

No. of I/O Lines:

58

No. of Serial I/Os:

7

No. of Terminals:

144

No. of Timers:

51

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Maximum Supply Current:

700 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, SPI(3), UART(2)

Peripherals:

DMA(16), TIMER(41), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5702135DPGEQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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