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TMS32C6414EGLZA6E3

Texas Instruments

TMS32C6414EGLZA6E3 by Texas Instruments

TMS32C6414EGLZA6E3 by Texas Instruments is a 32-bit DSP with integrated cache, operating at a max clock frequency of 75.18 MHz. Ideal for industrial applications requiring high-speed signal processing, it features an external data bus width of 64 bits and low power mode for efficient performance.

Median Price

$152.214

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Nova Conductors

Japan . 50 parts In-Stock

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$152.214

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Vyrian

USA . 5,843 parts In-Stock

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Digiode

USA . 1,825 parts In-Stock

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Chip Stock

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North Shore Components

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PC Components Company LLC

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Bristol Electronics

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Distributors (Availability)

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AZTECH Wire

Italy . 578 parts In-Stock

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$8.041

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Ampacity Inc.

Singapore . 937 parts In-Stock

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$16.000

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One Stop Electronics

USA . 292 parts In-Stock

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Parana Technologies

USA . 918 parts In-Stock

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$68.819

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ChromeModa Solutions

Germany . 2,438 parts In-Stock

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$77.325

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$63.406

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IDEA Electronic Components Group

UK . 717 parts In-Stock

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$77.325

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$73.459

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$69.592

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Corohmni

South Africa . 50 parts In-Stock

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$167.270

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Microchip USA

USA . 2,080 parts In-Stock

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$170.220

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$165.680

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$163.410

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$161.140

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$161.140

QUARKTWIN TECHNOLOGY LTD

USA . 16,384 parts In-Stock

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Lixinc

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Kepictronics

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A-Z Elektronik GmbH

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Metaverse IC Inc.

Canada . 2,000 parts In-Stock

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Perfect Parts

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Corphita

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Authorized Procurement Solutions

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DigiPath Technology Company

USA . 631 parts In-Stock

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$69.716

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Overview

Experience the power of cutting-edge technology with the TMS32C6414EGLZA6E3 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-quality products that meet the demands of various applications. With integrated cache and low power mode, this DSP offers unparalleled performance and efficiency. Whether you're in telecommunications, audio processing, or industrial control, this product provides the reliability and value you need to take your projects to the next level. Trust Texas Instruments for innovative solutions that make a difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Integrated Cache: YES

Having an integrated cache helps in improving the processing speed and efficiency of the DSP.

Maximum Supply Voltage: 1.44 V

The high maximum supply voltage allows for flexibility in power supply options while ensuring optimal performance.

Address Bus Width: 32

The wider address bus width enhances the memory addressing capabilities of the DSP, enabling it to handle larger data sets efficiently.

Package Shape: SQUARE

The square package shape facilitates easier mounting and integration into electronic systems.

Bit Size: 32

A 32-bit architecture allows for efficient processing of complex algorithms and data sets.

Power Supplies (V): 1.4, 3.3

The availability of multiple power supply options provides flexibility in designing power-efficient systems.

No. of Terminals: 532

Having a high number of terminals allows for connection to a wide range of external devices and peripherals.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

The variety of package styles offered allows for versatility in mounting and heat dissipation options based on specific requirements.

Minimum Supply Voltage: 1.36 V

The low minimum supply voltage helps in reducing power consumption and improving efficiency.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliability and stability in harsh environmental conditions.

No. of External Interrupts: 4

Having multiple external interrupts enables the DSP to respond quickly to external events and optimize real-time processing tasks.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the DSP to function effectively in extreme cold conditions without any performance degradation.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and reliability for robust connections.

Terminal Position: BOTTOM

Bottom terminal position makes it easier for PCB layout and integration into compact devices.

Maximum Seated Height: 3.3 mm

The maximum seated height allows for a compact form factor and easy integration in space-constrained designs.

RAM Words: 16384

The large RAM capacity enables efficient storage and retrieval of data during processing tasks.

Width: 23 mm

The compact width of the DSP promotes space-saving designs in electronic systems.

Boundary Scan: YES

Boundary scan support aids in testing and diagnosing the DSP during manufacturing and maintenance processes.

External Data Bus Width: 64

The wide external data bus width allows for fast data transfer between the DSP and external memory devices.

Maximum Clock Frequency: 75.18 MHz

The high maximum clock frequency enables fast processing of instructions and data, improving overall performance.

Peak Reflow Temperature °C: 220

The high peak reflow temperature ensures reliable solder connections during manufacturing processes.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and communication within the DSP, optimizing performance.

Length: 23 mm

The compact length of the DSP contributes to space efficiency in electronic designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the DSP can operate reliably in tough industrial environments with temperature fluctuations.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The versatile peripheral IC type supports a wide range of digital signal processing applications and peripheral interfacing requirements.

No. of Timers: 3

Having multiple timers aids in time-sensitive operations and scheduling tasks effectively within the DSP.

Technology: CMOS

The CMOS technology offers low power consumption and enhances the performance efficiency of the DSP.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and reliable connections for seamless integration into electronic systems.

Maximum Supply Current: 125 mA

The low maximum supply current requirement helps in energy efficiency and reduces power consumption during operation.

Nominal Supply Voltage: 1.4 V

The nominal supply voltage ensures stable and consistent power supply for optimal DSP performance.

No. of DMA Channels: 64

Having 64 DMA channels allows for efficient data transfer and processing between peripherals and memory, enhancing overall system performance.

Terminal Pitch: 0.8 mm

The small terminal pitch enables high-density mounting and compact PCB designs in electronic systems.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and enhances efficiency in numerical computations within the DSP.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the DSP is suitable for reflow soldering processes and has moderate sensitivity to moisture exposure, ensuring reliability in manufacturing.

Low Power Mode: YES

The availability of a low power mode enables energy-saving operation and extends the battery life in portable electronic devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6414EGLZA6E3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

125 mA

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6414EGLZA6E3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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