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TMS32C6203BZNZA250

Texas Instruments

TMS32C6203BZNZA250 by Texas Instruments

TMS32C6203BZNZA250 by Texas Instruments is a 32-bit DSP with 131072 RAM words, operating at up to 250 MHz clock frequency. Ideal for industrial applications, it features a 22-bit address bus width and supports low power mode for efficient performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,690 parts In-Stock

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4,690

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Digiode

USA . 98 parts In-Stock

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98

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Distributors (Availability)

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Parana Technologies

USA . 295 parts In-Stock

1+ parts

$16.531

100+ parts

-

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$16.812

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295

$16.531

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$16.812

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DigiPath Technology Company

USA . 1,597 parts In-Stock

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$18.203

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1,597

$18.203

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AZTECH Wire

Italy . 475 parts In-Stock

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$18.405

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475

$18.405

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ChromeModa Solutions

Germany . 1,956 parts In-Stock

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$18.574

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$15.231

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1,956

$18.574

$15.231

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IDEA Electronic Components Group

UK . 71 parts In-Stock

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$18.574

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$17.645

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$16.717

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71

$18.574

$17.645

$16.717

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One Stop Electronics

USA . 448 parts In-Stock

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$20.000

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448

$20.000

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Corohmni

South Africa . 1,181 parts In-Stock

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$21.298

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Corphita

USA . 604 parts In-Stock

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Microchip USA

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Overview

Unlock the power of cutting-edge technology with the TMS32C6203BZNZA250 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unparalleled quality and reliability. Designed for a wide range of applications, this DSP offers customers superior performance, efficiency, and versatility. Experience seamless operation and enhanced functionality with the TMS32C6203BZNZA250, making it the perfect choice for your next project. Trust Texas Instruments to provide you with innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this DSP lightweight and durable, ideal for portable applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Maximum Supply Voltage: 1.57 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, making it versatile in different settings.

Address Bus Width: 22

With a 22-bit address bus width, this DSP can access a larger memory space, enabling it to handle complex algorithms and data processing efficiently.

Package Shape: SQUARE

The square package shape helps optimize space utilization on the PCB, especially in compact designs where space is limited.

Bit Size: 32

With a 32-bit architecture, this DSP can perform operations on larger data sets with higher precision and efficiency.

Power Supplies (V): 1.5,3.3

Support for multiple power supply voltages (1.5V and 3.3V) offers flexibility in system design and power management.

No. of Terminals: 352

A higher number of terminals allow for additional connectivity options, enabling the DSP to interface with a variety of components and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style provides a stable and reliable mechanical connection, ensuring secure mounting on the PCB.

Minimum Supply Voltage: 1.43 V

The low minimum supply voltage ensures efficient power utilization and helps in reducing energy consumption for improved battery life.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows this DSP to perform reliably in harsh industrial environments without risk of overheating.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40°C to 105°C ensures the DSP can operate in extreme cold and hot conditions, making it suitable for outdoor or rugged applications.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, improving signal integrity and overall system reliability.

Maximum Seated Height: 2.8 mm

The low seated height allows for a compact overall design, ideal for slim-profile devices or applications with height restrictions.

RAM Words: 131072

With a large RAM capacity of 131,072 words, this DSP can efficiently store and access data needed for processing complex algorithms and calculations.

Width: 27 mm

The compact width of 27mm allows for the DSP to be integrated into space-constrained designs without compromising on performance.

Boundary Scan: YES

Boundary scan capability enables easier testing and debugging processes during manufacturing and maintenance, improving the overall reliability of the final product.

External Data Bus Width: 32

A wide 32-bit external data bus facilitates high-speed data transfer between the DSP and external memory or peripherals, enhancing processing efficiency.

Maximum Clock Frequency: 250 MHz

The high maximum clock frequency of 250 MHz allows for quick execution of instructions, making this DSP suitable for real-time signal processing applications.

Internal Bus Architecture: MULTIPLE

The use of multiple internal bus architectures enhances data flow and parallel processing capabilities, improving overall system performance and throughput.

Length: 27 mm

The compact length of 27mm allows for efficient placement on the PCB and helps in optimizing space utilization in tight layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in challenging industrial environments where temperature fluctuations are common.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of multiple peripheral IC types expands the DSP's compatibility and functionality, enabling it to interface with a wide range of external devices.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and faster operation, making this DSP energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides reliable connections and improves signal transmission capabilities, enhancing overall performance and reliability of the DSP.

Nominal Supply Voltage: 1.5 V

The 1.5V nominal supply voltage is commonly used and ensures compatibility with a wide range of power sources and components.

Terminal Pitch: 1 mm

The small terminal pitch of 1mm allows for dense packing of terminals on the DSP, maximizing connectivity options in a compact space.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and calculations, making it suitable for applications requiring high-speed data processing with less complexity.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption during idle or low activity periods, extending battery life in portable or energy-efficient devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6203BZNZA250 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

250 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B352

Length:

27 mm

Low Power Mode:

YES

No. of Terminals:

352

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA352,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS32C6203BZNZA250 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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