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TMS320VC5510AGBCA1

Texas Instruments

TMS320VC5510AGBCA1 by Texas Instruments

TMS320VC5510AGBCA1 by Texas Instruments is a 16-bit DSP with integrated cache, 32-bit external data bus width, and max clock frequency of 50 MHz. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

$38.880

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 486 parts In-Stock

1+ parts

$25.907

100+ parts

$23.029

1k+ parts

$16.933

10k+ parts

-

486

$25.907

$23.029

$16.933

-

DigiKey

USA . 79 parts In-Stock

1+ parts

$38.880

100+ parts

$29.883

1k+ parts

-

10k+ parts

-

79

$38.880

$29.883

-

-

Mouser Electronics

USA . 47 parts In-Stock

1+ parts

$38.880

100+ parts

$29.880

1k+ parts

$29.120

10k+ parts

-

47

$38.880

$29.880

$29.120

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,888 parts In-Stock

1+ parts

$24.612

100+ parts

-

1k+ parts

-

10k+ parts

-

4,888

$24.612

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-

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Vyrian

USA . 2,271 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,271

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,377 parts In-Stock

1+ parts

$23.316

100+ parts

-

1k+ parts

-

10k+ parts

-

3,377

$23.316

-

-

-

Parana Technologies

USA . 991 parts In-Stock

1+ parts

$30.612

100+ parts

-

1k+ parts

$69.197

10k+ parts

-

991

$30.612

-

$69.197

-

DigiPath Technology Company

USA . 1,040 parts In-Stock

1+ parts

$33.707

100+ parts

$31.011

1k+ parts

-

10k+ parts

-

1,040

$33.707

$31.011

-

-

ChromeModa Solutions

Germany . 5,818 parts In-Stock

1+ parts

$34.395

100+ parts

$28.204

1k+ parts

-

10k+ parts

-

5,818

$34.395

$28.204

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-

IDEA Electronic Components Group

UK . 1,111 parts In-Stock

1+ parts

$34.395

100+ parts

$32.675

1k+ parts

$30.956

10k+ parts

-

1,111

$34.395

$32.675

$30.956

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Corohmni

South Africa . 2,552 parts In-Stock

1+ parts

$51.285

100+ parts

-

1k+ parts

-

10k+ parts

-

2,552

$51.285

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-

-

Overview

Discover the power and precision of the TMS320VC5510AGBCA1 by Texas Instruments, a top-of-the-line Digital Signal Processor designed for cutting-edge applications. With integrated cache and multiple timers, this processor offers unparalleled performance in a compact package. Ideal for industrial use, this DSP boasts low power mode and boundary scan features, ensuring efficiency and reliability. Experience the superior quality and advanced technology of Texas Instruments with the TMS320VC5510AGBCA1 - the perfect solution for your digital processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, making it suitable for various applications.

Integrated Cache: YES

Integrated cache helps in improving the processing speed and efficiency of the DSP.

Maximum Supply Voltage: 1.65 V

Operates efficiently within specified voltage range, ensuring reliable performance.

On Chip Data RAM Width: 16

Wider data RAM width allows for faster data processing and storage capabilities.

Address Bus Width: 22

Larger address bus width enables the DSP to access a larger memory space efficiently.

Package Shape: SQUARE

Square package shape allows for easy mounting and integration into various systems.

Bit Size: 16

16-bit architecture allows for efficient processing of data and instructions.

No. of Terminals: 240

Higher number of terminals provide more connectivity options for interfacing with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers compact size, low profile, and fine pitch for space-saving designs.

Minimum Supply Voltage: 1.55 V

Lower minimum supply voltage helps in reducing power consumption and energy efficiency.

Maximum Operating Temperature: 85 °C

Operates effectively at high temperatures, suitable for industrial applications.

No. of External Interrupts: 6

Multiple external interrupts allow for efficient handling of external events and tasks.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, making it suitable for a wide range of environments.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and reliability for connection with other components.

Terminal Position: BOTTOM

Bottom terminal position makes it easier for mounting on circuit boards and improves heat dissipation.

Maximum Seated Height: 1.4 mm

Low profile design with maximum seated height makes it suitable for compact electronic devices.

RAM Words: 163840

Large RAM capacity allows for efficient data storage and processing capabilities.

Width: 15 mm

Narrow width makes it suitable for applications where space is a constraint.

Boundary Scan: YES

Boundary scan feature helps in testing and debugging the DSP for improved reliability.

External Data Bus Width: 32

Wider external data bus width allows for efficient data transfer between the DSP and external components.

Maximum Clock Frequency: 50 MHz

High clock frequency enables fast processing speed for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 20

Can withstand peak reflow temperature for a specified duration, ensuring reliability during manufacturing.

Peak Reflow Temperature °C: 220

Can endure high reflow temperatures during the manufacturing process without damage.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data processing speed and efficiency.

Length: 15 mm

Compact length makes it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type allows for a wide range of applications and connectivity options.

No. of Timers: 2

Multiple timers provide accurate timing and control functions for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form provides reliable connections and facilitates easy mounting on printed circuit boards.

Nominal Supply Voltage: 1.6 V

Stable nominal supply voltage ensures consistent performance and reliability.

No. of DMA Channels: 6

Multiple DMA channels enable efficient data transfer and processing without CPU intervention.

ROM Programmability: MROM

MROM programmability offers secure and fixed programs for reliable operation.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high-density mounting and compact designs.

Format: FIXED POINT

Fixed-point format provides efficient arithmetic operations and precision in calculations.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the level of protection needed during handling and storage.

Low Power Mode: YES

Low power mode enhances energy efficiency and reduces power consumption during idle periods.

On Chip Program ROM Width: 16

Wider on-chip program ROM width allows for storing and executing programs efficiently.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5510AGBCA1 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B240

JESD-609 Code:

e0

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

6

No. of Terminals:

240

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA240,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

RAM Words:

163840

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5510AGBCA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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