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TMS320F2802ZGMS

Texas Instruments

TMS320F2802ZGMS by Texas Instruments

TMS320F2802ZGMS by Texas Instruments is a 32-bit DSP with 100 terminals, operating at max 100 MHz. Ideal for automotive applications due to AEC-Q100 screening, low power mode, and flash ROM programmability. Features include 1.71-1.89 V supply voltage range, -40 to 125°C temp range, and multiple internal bus architecture for efficient processing.

Median Price

$12.338

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 256 parts In-Stock

1+ parts

$15.840

100+ parts

-

1k+ parts

$10.934

10k+ parts

-

256

$15.840

-

$10.934

-

Rochester

USA . 296 parts In-Stock

1+ parts

-

100+ parts

$9.870

1k+ parts

$8.830

10k+ parts

$8.310

296

-

$9.870

$8.830

$8.310

Verical

USA . 152 parts In-Stock

1+ parts

-

100+ parts

$12.338

1k+ parts

$11.037

10k+ parts

$10.387

152

-

$12.338

$11.037

$10.387

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 556 parts In-Stock

1+ parts

$10.431

100+ parts

-

1k+ parts

-

10k+ parts

-

556

$10.431

-

-

-

Vyrian

USA . 7,159 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,159

-

-

-

-

DigiKey Marketplace

USA . 296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

296

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,152 parts In-Stock

1+ parts

$9.882

100+ parts

-

1k+ parts

-

10k+ parts

-

2,152

$9.882

-

-

-

Corohmni

South Africa . 2,546 parts In-Stock

1+ parts

$50.358

100+ parts

-

1k+ parts

-

10k+ parts

-

2,546

$50.358

-

-

-

Parana Technologies

USA . 1,717 parts In-Stock

1+ parts

$65.501

100+ parts

-

1k+ parts

-

10k+ parts

-

1,717

$65.501

-

-

-

DigiPath Technology Company

USA . 2,180 parts In-Stock

1+ parts

$72.125

100+ parts

-

1k+ parts

-

10k+ parts

-

2,180

$72.125

-

-

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ChromeModa Solutions

Germany . 4,934 parts In-Stock

1+ parts

$73.597

100+ parts

$60.350

1k+ parts

-

10k+ parts

-

4,934

$73.597

$60.350

-

-

IDEA Electronic Components Group

UK . 1,912 parts In-Stock

1+ parts

$73.597

100+ parts

$69.917

1k+ parts

$66.237

10k+ parts

-

1,912

$73.597

$69.917

$66.237

-

Microchip USA

USA . 360 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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360

-

-

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Perfect Parts

USA . 287 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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287

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Overview

Experience the cutting-edge innovation of Texas Instruments with the TMS320F2802ZGMS Digital Signal Processor. This powerful device offers unparalleled performance and reliability, making it ideal for a wide range of applications in the automotive industry, consumer electronics, and more. With its advanced features and high-quality design, this DSP provides customers with exceptional value, efficiency, and flexibility. Trust Texas Instruments to deliver top-notch technology that exceeds expectations. Elevate your projects with the TMS320F2802ZGMS today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.89 V

Efficient power usage and compatibility with a range of power sources.

On Chip Data RAM Width: 16

Offers fast data processing capabilities for demanding applications.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance.

Bit Size: 32

High processing power for handling complex algorithms and calculations.

Power Supplies (V): 1.8,3.3

Supports multiple power options for flexibility in design and implementation.

No. of Terminals: 100

Allows for connectivity with various external devices and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables compact and efficient packaging, suitable for space-constrained applications.

Minimum Supply Voltage: 1.71 V

Ensures stable operation even at low supply voltages.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, ideal for automotive and industrial environments.

CPU Family: C28X

Belongs to a well-established family of processors known for performance and reliability.

No. of External Interrupts: 3

Supports efficient handling of external events for real-time processing.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions without compromising performance.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Facilitates easy integration into the PCB layout for streamlined design.

Maximum Seated Height: 1.4 mm

Low profile design for fitting in compact spaces and reducing overall system height.

RAM Words: 3072

Sufficient memory for storing and processing data in complex applications.

Width: 10 mm

Compact size for space-efficient placement on the PCB.

Boundary Scan: YES

Facilitates testing and debugging of the device during manufacturing.

Maximum Clock Frequency: 100 MHz

High clock speeds for fast data processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

Withstands reflow soldering process without damage to the device.

Peak Reflow Temperature °C: 260

Can endure high reflow temperatures for manufacturing processes.

Internal Bus Architecture: MULTIPLE

Efficient data transfer within the processor for optimized performance.

Length: 10 mm

Balanced dimensions for fitting into various PCB layouts.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications where temperature fluctuations are common.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral integration for expanding the functionality of the device.

No. of Timers: 10

Multiple timers for precise timing control in various applications.

RAM Bytes: 12288

High memory capacity for storing and processing large amounts of data.

Technology: CMOS

Modern CMOS technology for low power consumption and high-speed operation.

Terminal Form: BALL

Ball terminals for easy soldering and reliable electrical connections.

Maximum Supply Current: 230 mA

Efficient power usage with low supply current requirements.

Nominal Supply Voltage: 1.8 V

Stable supply voltage for consistent performance under varying load conditions.

ROM Programmability: FLASH

Programmable ROM for flexibility in firmware updates and customization.

Terminal Pitch: 0.8 mm

Fine pitch terminals for compact design and high-density PCB layouts.

Format: FIXED POINT

Fixed-point arithmetic for efficient computation and reduced processing overhead.

Moisture Sensitivity Level (MSL): 3

Complies with industry standards for moisture sensitivity during manufacturing and storage.

Low Power Mode: YES

Supports low power operation for energy-efficient applications and extended battery life.

On Chip Program ROM Width: 16

Wide program ROM for storing firmware and software for the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2802ZGMS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

100

No. of Timers:

10

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

RAM Words:

3072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320F2802ZGMS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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