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TMS320F2801PZQ

Texas Instruments

TMS320F2801PZQ by Texas Instruments

TMS320F2801PZQ by Texas Instruments is a 32-bit DSP with 100 MHz clock frequency, 6144 RAM words, and 12288 RAM bytes. Ideal for automotive applications due to AEC-Q100 screening level, low power mode, and multiple internal bus architecture. Package style: flatpack, low profile, fine pitch.

Median Price

$12.850

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 72 parts In-Stock

1+ parts

$8.750

100+ parts

$8.570

1k+ parts

$8.400

10k+ parts

-

72

$8.750

$8.570

$8.400

-

Texas Instruments

USA . 1,477 parts In-Stock

1+ parts

$13.079

100+ parts

$11.425

1k+ parts

$7.879

10k+ parts

-

1,477

$13.079

$11.425

$7.879

-

Verical

USA . 72 parts In-Stock

1+ parts

-

100+ parts

$12.850

1k+ parts

$11.625

10k+ parts

-

72

-

$12.850

$11.625

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,400 parts In-Stock

1+ parts

$10.393

100+ parts

-

1k+ parts

-

10k+ parts

-

4,400

$10.393

-

-

-

Vyrian

USA . 4,347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,347

-

-

-

-

DigiKey Marketplace

USA . 72 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

72

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 452 parts In-Stock

1+ parts

$8.420

100+ parts

-

1k+ parts

-

10k+ parts

-

452

$8.420

-

-

-

Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$9.517

100+ parts

$8.660

1k+ parts

$7.804

10k+ parts

-

40

$9.517

$8.660

$7.804

-

Corphita

USA . 765 parts In-Stock

1+ parts

$9.846

100+ parts

-

1k+ parts

-

10k+ parts

-

765

$9.846

-

-

-

Microchip USA

USA . 1,723 parts In-Stock

1+ parts

$31.860

100+ parts

$31.410

1k+ parts

$31.180

10k+ parts

$30.950

1,723

$31.860

$31.410

$31.180

$30.950

Parana Technologies

USA . 2,271 parts In-Stock

1+ parts

$55.645

100+ parts

-

1k+ parts

-

10k+ parts

-

2,271

$55.645

-

-

-

Corohmni

South Africa . 2,652 parts In-Stock

1+ parts

$60.277

100+ parts

-

1k+ parts

-

10k+ parts

-

2,652

$60.277

-

-

-

DigiPath Technology Company

USA . 1,541 parts In-Stock

1+ parts

$61.273

100+ parts

-

1k+ parts

-

10k+ parts

-

1,541

$61.273

-

-

-

ChromeModa Solutions

Germany . 923 parts In-Stock

1+ parts

$62.523

100+ parts

$51.269

1k+ parts

-

10k+ parts

-

923

$62.523

$51.269

-

-

IDEA Electronic Components Group

UK . 495 parts In-Stock

1+ parts

$62.523

100+ parts

$59.397

1k+ parts

$56.271

10k+ parts

-

495

$62.523

$59.397

$56.271

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the Texas Instruments TMS320F2801PZQ Digital Signal Processor. Designed with precision and innovation, this DSP offers unparalleled performance and reliability for a wide range of applications in automotive and industrial sectors. With advanced features like multiple internal bus architecture, flash ROM programmability, and low power mode, this product delivers exceptional value to customers seeking high-quality solutions. Experience seamless integration, superior functionality, and unmatched efficiency with the TMS320F2801PZQ from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the DSP, making it suitable for various operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and reliable mounting on circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.89 V

Operating within a maximum supply voltage of 1.89 V allows for efficient power consumption and safe operation of the DSP.

On Chip Data RAM Width: 16

Having a data RAM width of 16 allows for faster data processing and storage, enhancing the overall performance of the DSP.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures reliability and quality standards are met, making it suitable for automotive applications where high performance is essential.

Package Shape: SQUARE

Square package shape offers a compact form factor, making it suitable for applications requiring space-saving designs.

Bit Size: 32

With a bit size of 32, the DSP can process data with higher precision and accuracy, resulting in improved performance.

Power Supplies (V): 1.8, 3.3

Supporting multiple power supply voltages of 1.8 V and 3.3 V allows flexibility in design and compatibility with various power sources.

No. of Terminals: 100

Having 100 terminals enables versatile connectivity options and integration with other components in the system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package styles of flatpack, low profile, and fine pitch offer different mounting options to meet specific design requirements and enhance usability.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2801PZQ attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of External Interrupts:

3

No. of Terminals:

100

No. of Timers:

10

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

RAM Words:

6144

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320F2801PZQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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