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TMS320DM647CUT7

Texas Instruments

TMS320DM647CUT7 by Texas Instruments

TMS320DM647CUT7 by Texas Instruments is a 32-bit DSP with 8192 RAM words, operating at 1.2V, 1.8V, and 3.3V. It features a grid array package style with 529 terminals and peak reflow temperature of 245°C. Ideal for digital signal processing applications due to its CMOS technology and fixed-point format capabilities.

Median Price

$60.874

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 609 parts In-Stock

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609

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Rochester

USA . 599 parts In-Stock

1+ parts

-

100+ parts

$54.110

1k+ parts

$48.420

10k+ parts

$45.570

599

-

$54.110

$48.420

$45.570

Verical

USA . 599 parts In-Stock

1+ parts

-

100+ parts

$67.638

1k+ parts

$60.525

10k+ parts

$56.962

599

-

$67.638

$60.525

$56.962

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,089 parts In-Stock

1+ parts

$57.124

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1,089

$57.124

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Vyrian

USA . 4,937 parts In-Stock

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4,937

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 490 parts In-Stock

1+ parts

$26.358

100+ parts

$2,447.762

1k+ parts

$23.722

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-

490

$26.358

$2,447.762

$23.722

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DigiPath Technology Company

USA . 653 parts In-Stock

1+ parts

$29.024

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653

$29.024

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IDEA Electronic Components Group

UK . 2,011 parts In-Stock

1+ parts

$29.616

100+ parts

$28.135

1k+ parts

$26.654

10k+ parts

-

2,011

$29.616

$28.135

$26.654

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ChromeModa Solutions

Germany . 807 parts In-Stock

1+ parts

$29.616

100+ parts

$24.285

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807

$29.616

$24.285

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Corohmni

South Africa . 3,142 parts In-Stock

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$43.399

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3,142

$43.399

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Corphita

USA . 3,357 parts In-Stock

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$54.117

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3,357

$54.117

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Microchip USA

USA . 385 parts In-Stock

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385

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Overview

Unlock the power of advanced digital signal processing with the TMS320DM647CUT7 by Texas Instruments. This cutting-edge DSP boasts top-notch quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this DSP offers unparalleled performance and efficiency to meet your needs. Experience the value and benefits of this innovative product, designed to elevate your projects to new heights. Trust in Texas Instruments for superior technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the DSP, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs, making it convenient for compact designs.

Package Shape: SQUARE

Square package shape helps in efficient utilization of PCB space and allows for easier placement and routing of traces.

Bit Size: 32

32-bit processing capability provides high computational power and precision for digital signal processing tasks.

Power Supplies (V): 1.2, 1.8, 3.3

Multiple voltage options enable compatibility with various systems and power requirements, providing flexibility in design.

No. of Terminals: 529

High number of terminals allow for more connections and functionalities, enhancing the versatility and performance of the DSP.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design enables high-density mounting and reliable connections, improving signal integrity and performance.

Terminal Finish: TIN SILVER COPPER

Tin, silver, copper terminal finish offers good conductivity, corrosion resistance, and solderability, enhancing reliability and longevity.

Terminal Position: BOTTOM

Bottom terminal position allows for easier PCB layout and better heat dissipation, improving overall system efficiency and reliability.

RAM Words: 8192

Large RAM capacity of 8192 words enables efficient data processing and storage, enhancing the performance of the DSP for complex algorithms.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures proper soldering of the DSP, reducing the risk of defects and ensuring reliable connections.

Peak Reflow Temperature °C: 245

High peak reflow temperature of 245°C ensures proper soldering and durability of the DSP during assembly, leading to a robust final product.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Peripheral IC type as a digital signal processor and more provides additional functionalities and compatibility for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making the DSP energy-efficient and suitable for various portable devices.

Terminal Form: BALL

Ball terminal form enables reliable connections and facilitates easy mounting, improving the overall performance and durability of the DSP.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm allows for high-density mounting and precise connections, enhancing signal integrity and performance in the system.

Format: FIXED POINT

Fixed-point format provides efficient numerical representation and computation for digital signal processing tasks, ensuring accuracy and speed.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates that the DSP is less sensitive to moisture, reducing the risk of damage during storage and assembly, ensuring reliability.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM647CUT7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TMS320DM647CUT7 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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