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TMS320DM642AZDKA6

Texas Instruments

TMS320DM642AZDKA6 by Texas Instruments

TMS320DM642AZDKA6 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75.19 MHz. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,092 parts In-Stock

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Digiode

USA . 4,006 parts In-Stock

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4,006

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Chip Stock

USA . 345 parts In-Stock

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345

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Speed Components Ltd

Israel . 70 parts In-Stock

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70

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Bristol Electronics

USA . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 249 parts In-Stock

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$12.026

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$12.026

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One Stop Electronics

USA . 911 parts In-Stock

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$26.000

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911

$26.000

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$36.250

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$32.988

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$29.725

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$36.250

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Parana Technologies

USA . 647 parts In-Stock

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$39.130

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$39.130

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ChromeModa Solutions

Germany . 6,125 parts In-Stock

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$43.966

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$36.052

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IDEA Electronic Components Group

UK . 1,734 parts In-Stock

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$43.966

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$41.768

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$39.569

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$41.768

$39.569

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Corohmni

South Africa . 498 parts In-Stock

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$70.384

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Microchip USA

USA . 446 parts In-Stock

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$128.950

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$127.230

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$127.230

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$125.510

446

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$125.510

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 2,943 parts In-Stock

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DigiPath Technology Company

USA . 1,955 parts In-Stock

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$39.640

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GreenTree Electronics

Israel . 680 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TMS320DM642AZDKA6 by Texas Instruments. Crafted by a renowned manufacturer, this Digital Signal Processor (DSP) offers unparalleled performance and reliability for a wide range of applications. From multimedia processing to telecommunications, this innovative product boasts integrated cache, multiple DMA channels, and low power mode, providing exceptional value and benefits to customers. Experience seamless efficiency and precision with the TMS320DM642AZDKA6, setting new standards in digital signal processing technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, making it suitable for a variety of environments.

Integrated Cache: YES

The integrated cache helps improve processing speed and efficiency, making this DSP ideal for tasks that require quick data access.

Maximum Supply Voltage: 1.44 V

With a high maximum supply voltage, this DSP can handle power surges or fluctuations without risking damage.

Address Bus Width: 23

A wider address bus allows for more memory addressing capabilities, enabling the DSP to handle larger datasets and complex algorithms.

Bit Size: 32

A 32-bit architecture allows for higher precision and accuracy in calculations, making this DSP suitable for demanding signal processing tasks.

Power Supplies (V): 1.4,3.3

Support for multiple power supply voltages gives flexibility in different operating scenarios, ensuring reliable performance across varying power environments.

No. of Terminals: 548

Having a high number of terminals allows for connectivity to a wide range of external devices and peripherals, enhancing the versatility of the DSP.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this DSP can withstand heat-intensive environments without performance degradation or damage.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being specifically designed as a digital signal processor signals its specialization in handling signal processing tasks efficiently and accurately compared to general-purpose processors.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM642AZDKA6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

548

No. of Timers:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA548,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

4096

Maximum Seated Height:

2.5 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM642AZDKA6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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