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TMS320C82GGP50

Texas Instruments

TMS320C82GGP50 by Texas Instruments

TMS320C82GGP50 by Texas Instruments is a 32-bit DSP with 64-bit external data bus, operating at 50 MHz. It features 4096 RAM words and supports floating-point format. Ideal for applications requiring high-speed signal processing in digital communication systems.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,965 parts In-Stock

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Digiode

USA . 4,912 parts In-Stock

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4,912

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One Stop Electronics

USA . 1,298 parts In-Stock

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$1.000

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$1.000

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AZTECH Wire

Italy . 654 parts In-Stock

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$9.082

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Parana Technologies

USA . 1,696 parts In-Stock

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$20.739

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$20.875

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DigiPath Technology Company

USA . 1,947 parts In-Stock

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$22.836

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$21.009

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IDEA Electronic Components Group

UK . 1,505 parts In-Stock

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$23.302

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$22.137

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$20.972

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$20.972

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ChromeModa Solutions

Germany . 1,279 parts In-Stock

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$23.302

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$19.108

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Corohmni

South Africa . 1,142 parts In-Stock

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$83.099

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Corphita

USA . 3,333 parts In-Stock

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Microchip USA

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Assy Fe

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Overview

Unleash the power of cutting-edge technology with the TMS320C82GGP50 by Texas Instruments. As a leader in the field of Digital Signal Processors (DSPs), Texas Instruments delivers top-quality products that excel in performance and reliability. The TMS320C82GGP50 is designed to meet the demands of modern applications, offering unparalleled value and benefits to customers. Whether you're working on audio processing, telecommunications, or industrial control systems, this DSP will take your projects to the next level. Experience the advantages of Texas Instruments technology with the TMS320C82GGP50.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and offers good protection for the internal components of the DSP, making it a durable choice.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components, enhancing the overall performance and reliability of the DSP.

Maximum Supply Voltage: 3.465 V

With a higher maximum supply voltage, this DSP can handle a wider range of input voltages, providing versatility and flexibility in various applications.

Address Bus Width: 32

A wider address bus width allows for efficient communication between different components, improving the overall processing speed and performance of the DSP.

Package Shape: SQUARE

The square package shape helps with easy installation and ensures better alignment of the DSP on the circuit board, aiding in overall reliability.

Bit Size: 32

A larger bit size enables the DSP to handle more complex calculations and data processing tasks, making it suitable for demanding applications.

Power Supplies (V): 3.3

A stable power supply of 3.3 V ensures consistent and reliable operation of the DSP, reducing the risk of performance issues or damage.

No. of Terminals: 352

Having a higher number of terminals allows for more connections and functionality, enabling the DSP to interface with a wide range of external devices and systems.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array package style, combined with heat sink/slug design, helps in efficient heat dissipation, ensuring optimal performance and longevity of the DSP.

Minimum Supply Voltage: 3.165 V

With a low minimum supply voltage, the DSP can operate efficiently even in low-power situations, making it suitable for energy-efficient applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures that the DSP can function reliably in a variety of environments, including those with elevated temperatures.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range allows the DSP to work effectively in cold conditions, providing versatility in different operating environments.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the integration of the DSP onto the circuit board, leading to a more compact and space-efficient design.

Maximum Seated Height: 1.7 mm

A low maximum seated height allows for a slimmer profile of the DSP, making it suitable for applications where space is limited.

RAM Words: 4096

With a large number of RAM words, the DSP can store and process a significant amount of data, enabling seamless multitasking and efficient operation.

Width: 35 mm

The compact width of the DSP contributes to a smaller overall footprint on the circuit board, enhancing space efficiency and integration in tight spaces.

Boundary Scan: YES

Boundary scan capability allows for easy testing and debugging of the DSP during production, ensuring consistent quality and reliability in the final product.

External Data Bus Width: 64

A wider external data bus width facilitates faster data transfer between the DSP and external devices, improving overall processing speeds and performance.

Maximum Clock Frequency: 50 MHz

A high maximum clock frequency enables fast data processing and execution of instructions, making the DSP suitable for applications that require real-time operations.

Internal Bus Architecture: MULTIPLE

A multiple internal bus architecture allows for parallel processing of data, improving efficiency and speed in handling complex algorithms and calculations.

Length: 35 mm

The compact length of the DSP contributes to a smaller overall footprint on the circuit board, enabling easier integration in space-constrained applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

With a combination of digital signal processing and mixed-signal capabilities, this DSP can handle a wide range of tasks, making it versatile for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the energy efficiency and reliability of the DSP in different operating conditions.

Terminal Form: BALL

Ball terminal form simplifies the mounting and soldering process of the DSP onto the circuit board, ensuring a secure and reliable connection for optimal performance.

Maximum Supply Current: 2100 mA

A high maximum supply current allows the DSP to handle peak power demands, ensuring stable operation under high-performance requirements.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V ensures consistent and reliable power delivery to the DSP, supporting continuous operation without voltage fluctuations.

Terminal Pitch: 1.27 mm

With a standard terminal pitch, the DSP can easily connect to other components on the circuit board, simplifying the assembly process and ensuring proper functionality.

Format: FLOATING POINT

The floating-point format allows the DSP to perform complex mathematical calculations with high precision and accuracy, making it suitable for scientific and engineering applications.

Barrel Shifter: YES

The presence of a barrel shifter facilitates efficient shifting and rotation of data within the DSP, improving computational performance and flexibility in data processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C82GGP50 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

32

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B352

Length:

35 mm

Low Power Mode:

NO

No. of Terminals:

352

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA352,26X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

4096

Maximum Seated Height:

1.7 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

2100 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.165 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

35 mm

Peripheral IC Type:

Trade Compliance

TMS320C82GGP50 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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