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TMS320C6748BZCEA3

Texas Instruments

TMS320C6748BZCEA3 by Texas Instruments

TMS320C6748BZCEA3 by Texas Instruments is a 32-bit DSP with 24-bit address bus, 64-bit external data bus, and max clock frequency of 50 MHz. Ideal for industrial applications requiring low power consumption and high processing speeds. Features include multiple internal bus architecture, floating-point format, and boundary scan capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,498 parts In-Stock

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Digiode

USA . 3,411 parts In-Stock

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3,411

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Distributors (Availability)

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AZTECH Wire

Italy . 538 parts In-Stock

1+ parts

$11.361

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538

$11.361

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One Stop Electronics

USA . 216 parts In-Stock

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$33.000

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216

$33.000

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Parana Technologies

USA . 788 parts In-Stock

1+ parts

$43.048

100+ parts

$3,997.698

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$38.744

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788

$43.048

$3,997.698

$38.744

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DigiPath Technology Company

USA . 441 parts In-Stock

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$47.402

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$43.609

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441

$47.402

$43.609

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ChromeModa Solutions

Germany . 6,232 parts In-Stock

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$48.369

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$39.663

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6,232

$48.369

$39.663

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IDEA Electronic Components Group

UK . 235 parts In-Stock

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$48.369

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$45.951

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$43.532

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235

$48.369

$45.951

$43.532

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Corohmni

South Africa . 889 parts In-Stock

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$77.784

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Corphita

USA . 250 parts In-Stock

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Futuretech Components

Singapore . 152 parts In-Stock

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Microchip USA

USA . 114 parts In-Stock

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Overview

Unleash the power of innovation with the TMS320C6748BZCEA3 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unmatched quality and reliability. This versatile DSP is perfect for a wide range of applications, offering unparalleled performance and efficiency. With its cutting-edge technology and advanced features, the TMS320C6748BZCEA3 provides exceptional value and benefits to customers looking to elevate their projects to the next level. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection to the DSP, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power requirements, ensuring stable performance under different voltage levels.

Address Bus Width: 24

A wider address bus width allows for efficient handling of memory addresses, enabling faster data processing and access.

Package Shape: SQUARE

The square package shape is space-efficient and allows for compact integration into electronic devices, saving valuable board space.

Bit Size: 32

A 32-bit architecture provides high processing capabilities and precision for complex signal processing tasks.

Power Supplies (V): 1.2, 1.8, 3.3

Support for multiple power supply voltages enables compatibility with various systems and power sources, enhancing versatility.

No. of Terminals: 361

An extensive number of terminals allow for versatile connectivity options and integration with other components in the system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package styles of grid array, low profile, and fine pitch make the DSP suitable for high-density applications and efficient layout designs.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures power efficiency and reliability, maintaining stable operation even under low voltage conditions.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range allows for operation in harsh environments and high-temperature conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature ensures functionality in extreme cold environments, making the DSP suitable for various applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring stable connections and longevity.

Terminal Position: BOTTOM

Bottom terminal position simplifies installation and maintenance processes, enhancing accessibility and ease of use.

Maximum Seated Height: 1.3 mm

The low maximum seated height allows for slim and compact designs, ideal for space-constrained applications.

RAM Words: 8192

With a large RAM capacity of 8192 words, the DSP can efficiently handle and process a significant amount of data, improving overall performance.

Width: 13 mm

The compact width of 13 mm enables easy integration into small form factor devices and PCB layouts.

Boundary Scan: YES

Boundary scan capability facilitates testing, debugging, and troubleshooting of the DSP, simplifying development and maintenance processes.

External Data Bus Width: 64

A wide external data bus width of 64 bits allows for high-speed data transfer and communication, enhancing processing efficiency.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency of 50 MHz enables fast signal processing and computation, making the DSP suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and reliable soldering during manufacturing, improving production efficiency.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure and robust solder joints, enhancing the durability and lifespan of the DSP.

Internal Bus Architecture: MULTIPLE

A multiple internal bus architecture allows for efficient data flow and communication within the DSP, improving overall processing speed and performance.

Length: 13 mm

The compact length of 13 mm enables the DSP to fit in small spaces and integrated into various electronic devices seamlessly.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes the DSP suitable for rugged and demanding industrial environments, ensuring reliable operation under tough conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types enhances compatibility and connectivity options, making the DSP versatile for a wide range of applications.

Technology: CMOS

The CMOS technology used in the DSP offers low power consumption, high speed, and reliability, making it ideal for energy-efficient and high-performance applications.

Terminal Form: BALL

The ball terminal form provides secure and stable connections, ensuring reliable data transmission and robust interconnectivity.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V ensures efficient power consumption and stable performance, maintaining reliability and longevity.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for compact spacing and high-density integration, optimizing board layout and design.

Format: FLOATING POINT

The floating-point format enables precise and accurate numerical calculations, making the DSP suitable for applications requiring high computational accuracy.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring appropriate handling and storage to prevent damage to the DSP.

Low Power Mode: YES

The low power mode feature allows for power-saving operation, extending battery life and reducing energy consumption, making the DSP more efficient and eco-friendly.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6748BZCEA3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320C6748BZCEA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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