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TMS320C6655SCZH

Texas Instruments

TMS320C6655SCZH by Texas Instruments

TMS320C6655SCZH by Texas Instruments is a 32-bit DSP with 8-word data RAM, 24-bit address bus, and 16-bit external data bus. It is used in digital signal processing applications requiring low power consumption and high performance. The package style is grid array with fine pitch, suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,652 parts In-Stock

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Vyrian

USA . 2,493 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 240 parts In-Stock

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$19.615

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One Stop Electronics

USA . 1,297 parts In-Stock

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$21.000

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Corohmni

South Africa . 858 parts In-Stock

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$22.633

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Parana Technologies

USA . 1,321 parts In-Stock

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$57.274

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DigiPath Technology Company

USA . 1,366 parts In-Stock

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$63.066

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IDEA Electronic Components Group

UK . 1,051 parts In-Stock

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$64.353

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$61.135

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$57.918

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$57.918

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ChromeModa Solutions

Germany . 788 parts In-Stock

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$64.353

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$52.769

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QUARKTWIN TECHNOLOGY LTD

USA . 6,093 parts In-Stock

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Corphita

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Microchip USA

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Overview

Unleash the power of cutting-edge technology with the TMS320C6655SCZH by Texas Instruments, a premium Digital Signal Processor that offers unparalleled performance and reliability. Crafted by industry leader Texas Instruments, this DSP is perfect for a wide range of applications, delivering lightning-fast processing speeds and seamless integration. With advanced features like integrated cache and multiple bus architecture, this product provides unbeatable value and benefits to customers seeking top-tier performance. Experience the difference with the TMS320C6655SCZH and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material helps in protecting the internal components of the DSP from external damage, ensuring a longer lifespan.

Integrated Cache: YES

Having integrated cache memory improves the processing speed and efficiency of the DSP, making it suitable for tasks requiring quick data access.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and effort during the manufacturing process.

Address Bus Width: 24

A wider address bus allows the DSP to access a larger amount of memory space, making it suitable for handling complex algorithms and data processing tasks.

Bit Size: 32

With a 32-bit architecture, the DSP can handle larger data sets and perform more complex calculations, making it ideal for demanding applications.

Power Supplies (V): 1, 1.5, 1.8

Having multiple power supply options allows for flexibility in voltage selection based on the specific requirements of the application, ensuring optimal performance.

No. of DMA Channels: 72

The high number of DMA channels enables efficient data transfer between peripherals and memory, improving overall system performance and responsiveness.

Technology: CMOS

The CMOS technology used in the DSP enables low power consumption, making it suitable for battery-operated devices and reducing overall energy costs.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6655SCZH attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B625

JESD-609 Code:

e1

Length:

21 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

625

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA625,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

2.99 mm

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Peripheral IC Type:

Trade Compliance

TMS320C6655SCZH Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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