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TMS320C6472ECTZ

Texas Instruments

TMS320C6472ECTZ by Texas Instruments

TMS320C6472ECTZ by Texas Instruments is a 32-bit DSP with 32-bit external data bus width, operating at max 50 MHz clock frequency. It's used in digital signal processing applications due to its CMOS technology, fixed-point format, and low power mode for efficient performance.

Median Price

$153.059

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4 parts In-Stock

1+ parts

$149.310

100+ parts

$135.130

1k+ parts

-

10k+ parts

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4

$149.310

$135.130

-

-

Verical

USA . 4 parts In-Stock

1+ parts

$149.310

100+ parts

$135.130

1k+ parts

-

10k+ parts

-

4

$149.310

$135.130

-

-

Texas Instruments

USA . 503 parts In-Stock

1+ parts

$153.059

100+ parts

$138.544

1k+ parts

$131.947

10k+ parts

-

503

$153.059

$138.544

$131.947

-

Mouser Electronics

USA . 3 parts In-Stock

1+ parts

$262.560

100+ parts

$216.460

1k+ parts

-

10k+ parts

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3

$262.560

$216.460

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-

Chip1Stop

Japan . 44 parts In-Stock

1+ parts

-

100+ parts

$154.060

1k+ parts

-

10k+ parts

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44

-

$154.060

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 576 parts In-Stock

1+ parts

$115.036

100+ parts

-

1k+ parts

-

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576

$115.036

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Vyrian

USA . 4,209 parts In-Stock

1+ parts

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4,209

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 3,241 parts In-Stock

1+ parts

$46.436

100+ parts

-

1k+ parts

-

10k+ parts

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3,241

$46.436

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-

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Parana Technologies

USA . 928 parts In-Stock

1+ parts

$70.738

100+ parts

-

1k+ parts

-

10k+ parts

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928

$70.738

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DigiPath Technology Company

USA . 2,233 parts In-Stock

1+ parts

$77.891

100+ parts

$71.660

1k+ parts

-

10k+ parts

-

2,233

$77.891

$71.660

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-

ChromeModa Solutions

Germany . 6,870 parts In-Stock

1+ parts

$79.481

100+ parts

$65.174

1k+ parts

-

10k+ parts

-

6,870

$79.481

$65.174

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-

IDEA Electronic Components Group

UK . 1,670 parts In-Stock

1+ parts

$79.481

100+ parts

$75.507

1k+ parts

$71.533

10k+ parts

-

1,670

$79.481

$75.507

$71.533

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Corphita

USA . 2,462 parts In-Stock

1+ parts

$108.981

100+ parts

-

1k+ parts

-

10k+ parts

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2,462

$108.981

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Microchip USA

USA . 1,754 parts In-Stock

1+ parts

$186.110

100+ parts

$181.140

1k+ parts

$178.660

10k+ parts

$176.180

1,754

$186.110

$181.140

$178.660

$176.180

Overview

Experience unparalleled performance and efficiency with the TMS320C6472ECTZ by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers cutting-edge technology that surpasses industry standards. This versatile product is ideal for a wide range of applications, providing customers with value and benefits that go beyond expectations. Invest in quality and reliability with the TMS320C6472ECTZ and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount technology enables easy and efficient PCB assembly, saving space and reducing production costs.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05 V provides stable power delivery, ensuring reliable performance.

Address Bus Width: 14

A wider address bus width of 14 allows for efficient memory addressing and data manipulation.

Package Shape: SQUARE

The square package shape enables easy integration into various system designs, optimizing space utilization.

No. of Terminals: 737

With a high number of terminals, the DSP offers versatile connectivity options for interfacing with other components.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage of 0.95 V helps in reducing power consumption, making the product energy-efficient.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures stable performance even under harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows the DSP to function in a wide range of temperature settings.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and soldering during assembly, enhancing overall manufacturing efficiency.

Maximum Seated Height: 3.242 mm

The low maximum seated height allows for a compact design, making the DSP suitable for space-constrained applications.

Width: 24 mm

The compact width of 24 mm enables the DSP to fit into tight spaces without compromising on performance.

Boundary Scan: YES

The presence of boundary scan capability aids in testing and diagnosing the DSP during production and maintenance, improving reliability.

External Data Bus Width: 32

A wide external data bus width of 32 allows for high-speed data transfer and processing, enhancing overall system performance.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency of 50 MHz enables rapid signal processing and execution of complex algorithms.

Maximum Time At Peak Reflow Temperature: 30 s

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering of the DSP during assembly, preventing damage.

Peak Reflow Temperature: 245 C

The peak reflow temperature of 245°C is ideal for lead-free soldering processes, meeting RoHS compliance requirements.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture allows for efficient data routing and processing, improving overall system performance.

Length: 24 mm

The compact length of 24 mm complements the width and seated height, ensuring a space-saving design for the DSP.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type of digital signal processor, combined with other functionalities, makes the DSP versatile for a wide range of applications.

Technology: CMOS

The CMOS technology used in the DSP offers low power consumption and high integration density, making it suitable for battery-operated devices.

Terminal Form: BALL

The terminal form of ball allows for easy soldering and reliable connections, enhancing the overall durability of the DSP.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V ensures compatibility with standard power sources, simplifying system design and integration.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm enables high-density mounting of the DSP on the PCB, optimizing space utilization.

Format: FIXED POINT

The fixed-point format simplifies signal processing algorithms and calculations, making the DSP suitable for real-time applications.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates that the DSP requires careful handling during storage and assembly to prevent moisture-related damage.

Low Power Mode: YES

The presence of a low-power mode allows the DSP to conserve energy during idle or low-demand periods, extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6472ECTZ attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

14

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B737

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

737

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.242 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6472ECTZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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