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TMS320C6455DCTZA8

Texas Instruments

TMS320C6455DCTZA8 by Texas Instruments

TMS320C6455DCTZA8 by Texas Instruments is a 32-bit DSP with 64-bit external data bus, operating at max 66.6 MHz clock frequency. Ideal for digital signal processing applications, it features 32768 RAM words and low power mode support. Its package style is grid array with fine pitch, suitable for surface mount assembly.

Median Price

$81.360

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$81.360

100+ parts

$69.820

1k+ parts

$67.190

10k+ parts

$64.980

5

$81.360

$69.820

$67.190

$64.980

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 52 parts In-Stock

1+ parts

$77.292

100+ parts

-

1k+ parts

-

10k+ parts

-

52

$77.292

-

-

-

Vyrian

USA . 7,986 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,986

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 2,169 parts In-Stock

1+ parts

$30.350

100+ parts

$29.920

1k+ parts

$29.700

10k+ parts

$29.480

2,169

$30.350

$29.920

$29.700

$29.480

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$31.172

100+ parts

$28.367

1k+ parts

$25.561

10k+ parts

-

500

$31.172

$28.367

$25.561

-

Corohmni

South Africa . 5,223 parts In-Stock

1+ parts

$52.893

100+ parts

-

1k+ parts

-

10k+ parts

-

5,223

$52.893

-

-

-

Parana Technologies

USA . 1,064 parts In-Stock

1+ parts

$66.837

100+ parts

-

1k+ parts

-

10k+ parts

-

1,064

$66.837

-

-

-

Corphita

USA . 2,519 parts In-Stock

1+ parts

$73.224

100+ parts

-

1k+ parts

-

10k+ parts

-

2,519

$73.224

-

-

-

ChromeModa Solutions

Germany . 2,775 parts In-Stock

1+ parts

$75.098

100+ parts

$61.580

1k+ parts

-

10k+ parts

-

2,775

$75.098

$61.580

-

-

IDEA Electronic Components Group

UK . 1,094 parts In-Stock

1+ parts

$75.098

100+ parts

$71.343

1k+ parts

$67.588

10k+ parts

-

1,094

$75.098

$71.343

$67.588

-

Component Stockers USA

USA . 12 parts In-Stock

1+ parts

$75.840

100+ parts

-

1k+ parts

-

10k+ parts

-

12

$75.840

-

-

-

Lixinc

USA . 5,256 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,256

-

-

-

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DigiPath Technology Company

USA . 1,185 parts In-Stock

1+ parts

-

100+ parts

$67.708

1k+ parts

-

10k+ parts

-

1,185

-

$67.708

-

-

Overview

Elevate your digital signal processing projects with the Texas Instruments TMS320C6455DCTZA8. Known for their top-notch quality and innovative solutions, Texas Instruments delivers cutting-edge technology that exceeds industry standards. The TMS320C6455DCTZA8 belongs to the category of Digital Signal Processors, offering unmatched performance and versatility. With its superior power supplies, wide data bus width, and high clock frequency, this DSP empowers you to achieve exceptional results in a variety of applications. Trust Texas Instruments to provide value, reliability, and the competitive edge you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 1.236 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

Address Bus Width: 20

A wider address bus allows for efficient memory addressing and data processing, enhancing overall performance.

Package Shape: SQUARE

The square package shape saves space on the PCB and enables compact designs.

Bit Size: 32

A 32-bit architecture allows for processing larger chunks of data at a time, improving speed and performance.

Power Supplies (V): 1.25, 1.8, 3.3

Multiple power supply options provide flexibility in designing power management systems and compatibility with different power sources.

No. of Terminals: 697

The high number of terminals allows for more connectivity options and interfaces, making the product versatile in its usage.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array style with fine pitch enables high-density packaging, saving board space and improving signal integrity.

Minimum Supply Voltage: 1.164 V

The low minimum supply voltage ensures stable operation even under low power conditions, enhancing reliability.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature range allows the product to function in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can operate in cold environments without performance degradation.

Terminal Finish: TIN SILVER COPPER

The use of multiple terminal finishes improves solderability and component reliability during assembly and operation.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and routing, simplifying the design process.

Maximum Seated Height: 3.242 mm

The low maximum seated height allows for slim and compact product designs, suitable for space-constrained applications.

RAM Words: 32768

The ample RAM capacity enables efficient data storage and processing, enhancing the product's overall performance.

Width: 24 mm

The compact width of the product allows for space-efficient PCB layout and integration into various system designs.

Boundary Scan: YES

Boundary scan feature helps in testing and debugging the product during production and maintenance, ensuring quality and reliability.

External Data Bus Width: 64

A wider external data bus width allows for faster data transfer rates between the processor and external peripherals, improving system efficiency.

Maximum Clock Frequency: 66.6 MHz

The high maximum clock frequency enables fast processing speeds and real-time data handling, essential for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature minimizes thermal stress on the component during assembly, ensuring long-term reliability.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance makes the product suitable for lead-free soldering processes, complying with RoHS regulations.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data communication within the processor, improving overall performance and efficiency.

Length: 24 mm

The compact length of the product allows for space-efficient PCB integration and flexible system designs.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of multiple peripheral IC types enhances the product's versatility and compatibility with different system configurations.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable performance, making the product suitable for various applications.

Terminal Form: BALL

Ball terminal form provides reliable connectivity and solder joints, ensuring long-term durability and performance of the product.

Nominal Supply Voltage: 1.2 V

The stable nominal supply voltage ensures consistent and reliable operation of the product under varying load conditions.

Terminal Pitch: 0.8 mm

The narrow terminal pitch allows for high-density packaging and efficient PCB layout, optimizing the use of space on the board.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and enhances computational efficiency, making the product suitable for DSP applications.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates that the product can withstand exposure to higher moisture levels during storage and assembly without compromising performance.

Low Power Mode: YES

The availability of low power mode allows for power-saving operation when full processing power is not required, extending battery life and reducing energy consumption.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6455DCTZA8 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.6 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

697

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.25,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.242 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.236 V

Minimum Supply Voltage:

1.164 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6455DCTZA8 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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