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TMS320C6421ZDUL

Texas Instruments

TMS320C6421ZDUL by Texas Instruments

TMS320C6421ZDUL by Texas Instruments is a 32-bit DSP with 400 MHz clock frequency, 12288 RAM words, and 22-bit address bus width. Ideal for digital signal processing applications due to its integrated cache, multiple internal bus architecture, and 72 DMA channels for high-speed data transfer.

Median Price

$18.403

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 540 parts In-Stock

1+ parts

$18.403

100+ parts

$16.075

1k+ parts

$11.086

10k+ parts

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540

$18.403

$16.075

$11.086

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 18 parts In-Stock

1+ parts

$15.629

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18

$15.629

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Digiode

USA . 3,483 parts In-Stock

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$17.483

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3,483

$17.483

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Vyrian

USA . 5,512 parts In-Stock

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5,512

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ACDS - Activité Composants Distribution Service

France . 18 parts In-Stock

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18

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Dan-Mar Components

USA . 18 parts In-Stock

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 858 parts In-Stock

1+ parts

$15.296

100+ parts

-

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858

$15.296

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Corphita

USA . 2,373 parts In-Stock

1+ parts

$16.563

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2,373

$16.563

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AZTECH Wire

Italy . 431 parts In-Stock

1+ parts

$18.300

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431

$18.300

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Parana Technologies

USA . 220 parts In-Stock

1+ parts

$49.631

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220

$49.631

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ChromeModa Solutions

Germany . 6,812 parts In-Stock

1+ parts

$55.765

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$45.727

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6,812

$55.765

$45.727

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IDEA Electronic Components Group

UK . 1,623 parts In-Stock

1+ parts

$55.765

100+ parts

$52.977

1k+ parts

$50.188

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1,623

$55.765

$52.977

$50.188

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Component Stockers USA

USA . 462 parts In-Stock

1+ parts

$202.730

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462

$202.730

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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7,500

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DigiPath Technology Company

USA . 2,301 parts In-Stock

1+ parts

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$50.278

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2,301

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$50.278

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Overview

Unlock the power of advanced digital signal processing with the TMS320C6421ZDUL by Texas Instruments. With cutting-edge technology and superior manufacturing quality, this DSP offers unparalleled performance in a wide range of applications. From telecommunications to audio processing, this versatile processor delivers value, efficiency, and reliability to customers seeking top-notch solutions. Experience the advantages of Texas Instruments' expertise and innovation with the TMS320C6421ZDUL.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost, making the product cost-effective.

Integrated Cache: YES

The integrated cache helps improve the overall performance of the DSP by reducing memory access times.

Maximum Supply Voltage: 1.1 V

Operating at a low supply voltage helps in reducing power consumption and heat generation.

Address Bus Width: 22

Having a wide address bus width allows the DSP to access a large memory space efficiently.

Bit Size: 32

With a 32-bit architecture, the DSP can process data in larger chunks, leading to faster computation.

Maximum Clock Frequency: 400 MHz

A high clock frequency enables the DSP to execute instructions at a fast pace, making it suitable for real-time signal processing applications.

Technology: CMOS

Complementary metal-oxide-semiconductor (CMOS) technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6421ZDUL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

LOW-POWER DEVICE

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

400 MHz

External Data Bus Width:

8

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B376

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

376

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA376,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

12288

ROM Programmability:

MROM

Maximum Seated Height:

2.48 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

1 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6421ZDUL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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