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TMS320C6416TZLZ1

Texas Instruments

TMS320C6416TZLZ1 by Texas Instruments

TMS320C6416TZLZ1 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 64-bit external data bus, and max clock frequency of 75 MHz. Ideal for industrial applications requiring fixed-point technology and low power mode.

Median Price

$288.460

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

$288.460

100+ parts

$282.720

1k+ parts

$276.950

10k+ parts

-

1

$288.460

$282.720

$276.950

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,621 parts In-Stock

1+ parts

$326.268

100+ parts

-

1k+ parts

-

10k+ parts

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4,621

$326.268

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-

-

DigiKey Marketplace

USA . 1 parts In-Stock

1+ parts

$340.160

100+ parts

-

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-

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1

$340.160

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-

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Vyrian

USA . 8,052 parts In-Stock

1+ parts

-

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8,052

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-

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Elcom Components

USA . 20 parts In-Stock

1+ parts

-

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-

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20

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

1+ parts

-

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 329 parts In-Stock

1+ parts

$11.500

100+ parts

-

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-

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329

$11.500

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Corohmni

South Africa . 1,074 parts In-Stock

1+ parts

$30.121

100+ parts

-

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1,074

$30.121

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Parana Technologies

USA . 538 parts In-Stock

1+ parts

$52.584

100+ parts

-

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538

$52.584

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DigiPath Technology Company

USA . 420 parts In-Stock

1+ parts

$57.901

100+ parts

$53.269

1k+ parts

-

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420

$57.901

$53.269

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IDEA Electronic Components Group

UK . 2,042 parts In-Stock

1+ parts

$59.083

100+ parts

$56.129

1k+ parts

$53.175

10k+ parts

-

2,042

$59.083

$56.129

$53.175

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ChromeModa Solutions

Germany . 553 parts In-Stock

1+ parts

$59.083

100+ parts

$48.448

1k+ parts

-

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553

$59.083

$48.448

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Corphita

USA . 71 parts In-Stock

1+ parts

$309.096

100+ parts

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71

$309.096

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Microchip USA

USA . 1,462 parts In-Stock

1+ parts

$320.260

100+ parts

$311.720

1k+ parts

$307.450

10k+ parts

$303.180

1,462

$320.260

$311.720

$307.450

$303.180

Perfect Parts

USA . 4 parts In-Stock

1+ parts

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4

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Cyclops Electronics Ltd (Excess)

UK . 2 parts In-Stock

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2

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Overview

Unlock the power of cutting-edge technology with the TMS320C6416TZLZ1 by Texas Instruments. As a leader in the field of Digital Signal Processors, Texas Instruments delivers unmatched quality and reliability. With applications ranging from telecommunications to audio processing, this DSP offers unparalleled performance and efficiency. Experience seamless integration, superior functionality, and optimal value with the TMS320C6416TZLZ1. Elevate your projects to new heights with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external elements, ensuring the longevity of the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into electronic circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.24 V

Operating within a maximum supply voltage of 1.24 V ensures safe and efficient power consumption.

Address Bus Width: 23

A wider address bus width of 23 allows for efficient memory addressing and data processing capabilities.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it suitable for space-constrained applications.

Bit Size: 32

A bit size of 32 enables high-performance processing and calculations for digital signal processing tasks.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages (1.2V and 3.3V) offers flexibility and compatibility with various system requirements.

No. of Terminals: 532

With 532 terminals, the DSP can interface with a wide range of external components and devices, enhancing its connectivity capabilities.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array package style with fine pitch leads to improved signal integrity and reliability in high-density mounting applications.

Minimum Supply Voltage: 1.16 V

Operating at a minimum supply voltage of 1.16 V ensures efficient power utilization and extends the battery life of portable devices.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, the DSP can reliably perform in industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes the DSP suitable for use in harsh or extreme conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and assembly during the manufacturing process.

Maximum Seated Height: 3.25 mm

The compact maximum seated height of 3.25 mm allows for a low-profile design and efficient PCB layout.

RAM Words: 16384

A large RAM capacity of 16,384 words enables extensive data storage and processing capabilities for complex algorithms.

Width: 23 mm

With a width of 23 mm, the DSP occupies minimal space on the PCB, allowing for more efficient board layout and integration.

Boundary Scan: YES

Boundary scan support enables easy testing and debugging of the DSP during manufacturing and maintenance processes.

External Data Bus Width: 64

A wide external data bus width of 64 bits enables rapid data exchange with external peripherals, enhancing system performance.

Maximum Clock Frequency: 75 MHz

Operating at a maximum clock frequency of 75 MHz allows for fast and efficient signal processing and data throughput.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data processing efficiency and parallel computation capabilities.

Length: 23 mm

A length of 23 mm contributes to the overall compactness and space-saving design of the DSP module.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments with wide temperature variations.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types ensures compatibility with different interfaces and expands the DSP's functionality.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable performance, making the DSP suitable for a wide range of applications.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and facilitates efficient heat dissipation during operation.

Nominal Supply Voltage: 1.2 V

Operating at a nominal supply voltage of 1.2 V ensures stable performance and energy efficiency in a variety of applications.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, the DSP offers fine-pitch connections for high-density mounting and reliable signal transmission.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and enhances numerical accuracy for digital signal processing tasks.

Low Power Mode: YES

Low power mode capability allows the DSP to operate efficiently under low-power conditions, extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6416TZLZ1 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

532

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6416TZLZ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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