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TMS320C6413GTSA500

Texas Instruments

TMS320C6413GTSA500 by Texas Instruments

TMS320C6413GTSA500 by Texas Instruments is a 32-bit DSP with integrated cache, operating at max 30 MHz. Ideal for industrial applications, it features 262144 RAM words, 23mm width/length, and supports boundary scan testing.

Median Price

$45.992

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,772 parts In-Stock

1+ parts

$45.992

100+ parts

$40.882

1k+ parts

$30.060

10k+ parts

-

1,772

$45.992

$40.882

$30.060

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Rochester

USA . 508 parts In-Stock

1+ parts

-

100+ parts

$43.220

1k+ parts

$38.670

10k+ parts

$36.390

508

-

$43.220

$38.670

$36.390

DigiKey

USA . 508 parts In-Stock

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508

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Verical

USA . 485 parts In-Stock

1+ parts

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100+ parts

$54.025

1k+ parts

$48.337

10k+ parts

$45.487

485

-

$54.025

$48.337

$45.487

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,387 parts In-Stock

1+ parts

$39.662

100+ parts

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3,387

$39.662

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Vyrian

USA . 7,347 parts In-Stock

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7,347

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 229 parts In-Stock

1+ parts

$21.787

100+ parts

-

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229

$21.787

-

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Ampacity Inc.

Singapore . 561 parts In-Stock

1+ parts

$35.490

100+ parts

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561

$35.490

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Corphita

USA . 4,961 parts In-Stock

1+ parts

$37.575

100+ parts

-

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4,961

$37.575

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Parana Technologies

USA . 99 parts In-Stock

1+ parts

$61.687

100+ parts

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99

$61.687

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DigiPath Technology Company

USA . 1,443 parts In-Stock

1+ parts

$67.925

100+ parts

$62.491

1k+ parts

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1,443

$67.925

$62.491

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ChromeModa Solutions

Germany . 1,601 parts In-Stock

1+ parts

$69.311

100+ parts

$56.835

1k+ parts

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1,601

$69.311

$56.835

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IDEA Electronic Components Group

UK . 1,097 parts In-Stock

1+ parts

$69.311

100+ parts

$65.845

1k+ parts

$62.380

10k+ parts

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1,097

$69.311

$65.845

$62.380

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ChipstoGo Electronic ltd

UK . 18 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the TMS320C6413GTSA500 by Texas Instruments, a leading manufacturer in the industry of Digital Signal Processors (DSPs). This innovative product offers integrated cache, multiple power supply options, and a wide range of operating temperatures, making it ideal for various applications. Whether you're in need of high-speed data processing, efficient signal filtering, or advanced audio/video processing, this DSP delivers exceptional value, benefits, and advantages to meet your specific needs. Upgrade your projects with the TMS320C6413GTSA500 and experience superior quality and performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and resistance to heat and chemicals, making the product reliable for various environments.

Integrated Cache: YES

Having an integrated cache improves the overall performance of the DSP, allowing for faster data processing and reduced latency.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in efficient power management and reduces the risk of overheating or damage to the components.

Address Bus Width: 23

A wider address bus width enables the DSP to access a larger memory space, increasing its processing capabilities and performance.

Package Shape: SQUARE

The square package shape allows for easy handling and installation in a variety of systems where space may be a constraint.

Bit Size: 32

Operating with a 32-bit architecture allows for high precision processing and computation, making the DSP suitable for complex signal processing tasks.

Power Supplies (V): 1.2,3.3

Supporting multiple power supply voltages gives flexibility in design and integration with different systems, ensuring compatibility in various applications.

No. of Terminals: 288

Having a high number of terminals allows for connectivity with numerous external components and peripherals, enhancing the versatility of the DSP.

Package Style (Meter): GRID ARRAY

The grid array package style provides a secure and stable mechanical connection, ensuring reliability and integrity of the DSP during operation.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage allows for efficient power consumption and operation, contributing to energy savings and prolonged device lifespan.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the DSP can withstand harsh environmental conditions and maintain stable performance in demanding applications.

No. of External Interrupts: 4

Having multiple external interrupts enables the DSP to quickly respond to external events or signals, enhancing its real-time processing capabilities.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions, making the DSP suitable for a wide range of environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and reliability in assembly processes, ensuring a secure connection with the external circuitry.

Terminal Position: BOTTOM

Having the terminals positioned at the bottom facilitates easier PCB layout and assembly, simplifying the integration of the DSP into electronic systems.

Maximum Seated Height: 2.8 mm

The low maximum seated height allows for compact and space-saving designs, making the DSP suitable for applications with size constraints.

RAM Words: 262144

With a large RAM capacity, the DSP can efficiently store and process data, enabling complex algorithms and calculations to be performed without performance bottlenecks.

Width: 23 mm

The compact width of the DSP enables it to be easily integrated into tight spaces or slim devices, offering flexibility in design and installation.

Boundary Scan: YES

The boundary scan feature allows for efficient testing and debugging of the DSP, facilitating the development and maintenance of systems incorporating the processor.

External Data Bus Width: 32

Operating with a 32-bit external data bus width enables high-speed data transfer between the DSP and external memory or peripherals, enhancing overall system performance.

Maximum Clock Frequency: 30 MHz

With a high maximum clock frequency, the DSP can execute instructions at a fast rate, enabling real-time processing of signals and data with low latency.

Maximum Time At Peak Reflow Temperature (s): 20

The ability to withstand peak reflow temperatures for up to 20 seconds ensures reliable solder joints and assembly quality during manufacturing processes.

Peak Reflow Temperature °C: 220

The high peak reflow temperature tolerance allows for robust soldering processes, ensuring the integrity and longevity of the DSP in various assembly environments.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures enhances data flow and processing efficiency within the DSP, enabling parallel execution of tasks and optimized performance.

Length: 23 mm

The compact length of the DSP contributes to its overall small form factor, facilitating easy integration into space-constrained applications without compromising functionality.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making the DSP suitable for industrial automation and rugged applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The diverse peripheral IC types supported by the DSP allow for versatile connectivity and compatibility with a wide range of external devices and interfaces.

No. of Timers: 3

Having multiple timers enables the DSP to manage various time-sensitive tasks and operations, enhancing its ability to synchronize events and control system functions.

Technology: CMOS

Operating on CMOS technology offers low power consumption and high noise immunity, ensuring efficient and reliable performance in digital signal processing applications.

Terminal Form: BALL

The ball terminal form provides reliable solder joints and secure connections, facilitating easy integration and maintenance of the DSP in electronic systems.

Nominal Supply Voltage: 1.2 V

The low nominal supply voltage contributes to energy efficiency and extended battery life in portable devices or power-sensitive applications utilizing the DSP.

No. of DMA Channels: 64

Having a high number of DMA channels allows for efficient data transfer and processing, enabling fast and concurrent I/O operations within the DSP.

Terminal Pitch: 1 mm

The narrow terminal pitch facilitates compact PCB design and assembly, enabling high-density integration of the DSP in electronic systems with limited space.

Format: FIXED POINT

Operating in fixed-point format provides deterministic and precise calculations, making the DSP suitable for applications requiring accurate numerical computations and signal processing.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates a low risk of moisture-related damage during soldering or storage, ensuring the reliability and longevity of the DSP.

Low Power Mode: YES

The availability of a low power mode allows for energy-efficient operation and extended battery life in power-sensitive applications, enhancing the versatility of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6413GTSA500 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B288

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

288

No. of Timers:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA288,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6413GTSA500 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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