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TMS320C6412AZDK5

Texas Instruments

TMS320C6412AZDK5 by Texas Instruments

TMS320C6412AZDK5 by Texas Instruments is a 32-bit DSP with 64-bit external data bus, operating at max 75.19 MHz clock frequency. It features 262144 RAM words and low power mode, suitable for digital signal processing applications requiring high-speed computations in a compact package.

Median Price

$46.462

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 859 parts In-Stock

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859

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Rochester

USA . 798 parts In-Stock

1+ parts

-

100+ parts

$41.300

1k+ parts

$36.950

10k+ parts

$34.780

798

-

$41.300

$36.950

$34.780

Verical

USA . 355 parts In-Stock

1+ parts

-

100+ parts

$51.625

1k+ parts

$46.188

10k+ parts

$43.475

355

-

$51.625

$46.188

$43.475

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,725 parts In-Stock

1+ parts

$43.596

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2,725

$43.596

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Vyrian

USA . 5,574 parts In-Stock

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5,574

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DigiKey Marketplace

USA . 859 parts In-Stock

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859

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Speed Components Ltd

Israel . 224 parts In-Stock

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224

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Distributors (Availability)

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$28.544

100+ parts

$25.975

1k+ parts

$23.406

10k+ parts

-

50

$28.544

$25.975

$23.406

-

Corphita

USA . 1,083 parts In-Stock

1+ parts

$41.301

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1,083

$41.301

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Component Stockers USA

USA . 1,195 parts In-Stock

1+ parts

$47.240

100+ parts

$44.400

1k+ parts

-

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1,195

$47.240

$44.400

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Corohmni

South Africa . 229 parts In-Stock

1+ parts

$56.341

100+ parts

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229

$56.341

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Parana Technologies

USA . 966 parts In-Stock

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$59.748

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966

$59.748

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DigiPath Technology Company

USA . 2,018 parts In-Stock

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$65.790

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2,018

$65.790

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IDEA Electronic Components Group

UK . 1,726 parts In-Stock

1+ parts

$67.133

100+ parts

$63.776

1k+ parts

$60.420

10k+ parts

-

1,726

$67.133

$63.776

$60.420

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ChromeModa Solutions

Germany . 812 parts In-Stock

1+ parts

$67.133

100+ parts

$55.049

1k+ parts

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812

$67.133

$55.049

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QUARKTWIN TECHNOLOGY LTD

USA . 10,554 parts In-Stock

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10,554

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Microchip USA

USA . 161 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the TMS320C6412AZDK5 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors (DSPs) that provide unparalleled performance and reliability. With a wide range of applications, this product offers customers exceptional value, benefits, and advantages. Whether you're looking to enhance your audio systems, improve communication networks, or optimize industrial automation, the TMS320C6412AZDK5 is the perfect solution for all your digital signal processing needs. Unlock new possibilities and elevate your projects with this innovative and versatile DSP from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body offers durability and protection for the internal components of the DSP, ensuring longevity and reliability.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation of the DSP onto a circuit board, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26V ensures stable and efficient operation of the DSP within safe voltage limits, preventing any potential damage due to overvoltage.

Address Bus Width: 23

With a wide address bus width of 23, the DSP can efficiently handle and process a large amount of data and instructions, enhancing its overall performance and speed.

Package Shape: SQUARE

The square package shape allows for easy placement and integration of the DSP into different electronic devices, optimizing space utilization and design flexibility.

Bit Size: 32

The 32-bit size of the DSP enables it to perform complex mathematical calculations and signal processing tasks with high precision and accuracy, making it suitable for a wide range of applications.

Power Supplies (V): 1.2,3.3

The availability of multiple power supply options ensures compatibility with a variety of voltage requirements in different electronic systems, offering flexibility and versatility in deployment.

No. of Terminals: 548

The high number of terminals provides ample connectivity options for interfacing the DSP with external components and peripherals, enabling seamless integration and data exchange.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style allows for high-density mounting of the DSP on a circuit board, maximizing space efficiency and promoting a compact design layout.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14V ensures that the DSP can operate within a wide range of voltage levels, offering stability and reliability under varying environmental conditions.

Terminal Finish: TIN SILVER COPPER

The tin silver copper terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections and long-term performance of the DSP in diverse operating environments.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy mounting and soldering of the DSP onto a PCB, simplifying the assembly process and ensuring proper alignment for seamless operation.

Maximum Seated Height: 2.8 mm

The maximum seated height of 2.8mm allows for a compact and low-profile design of the DSP, making it suitable for space-constrained applications where height limitations are a concern.

RAM Words: 262144

The large RAM capacity of 262144 words provides ample storage for temporary data and program instructions, enabling efficient multitasking and data processing capabilities in the DSP.

Width: 23 mm

The compact width of 23mm allows for easy integration of the DSP into various electronic devices with limited space constraints, offering versatility and flexibility in design layouts.

Boundary Scan: YES

The boundary scan feature enables easy testing and debugging of the DSP during production and maintenance, ensuring quick and accurate identification of any potential faults or errors.

External Data Bus Width: 64

The wide external data bus width of 64 facilitates high-speed data transfer between the DSP and external memory devices, optimizing system performance and response times.

Maximum Clock Frequency: 75.19 MHz

The high maximum clock frequency of 75.19MHz allows the DSP to execute complex algorithms and signal processing tasks at a rapid pace, enhancing overall processing speed and efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature of 260°C for 30 seconds ensures proper soldering and reflowing of the DSP during manufacturing, preventing any damage or defects due to overheating.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables efficient soldering of the DSP onto a PCB, ensuring secure and reliable connections for long-term performance and durability.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture allows for parallel processing of data and instructions within the DSP, enhancing computational efficiency and speed for complex signal processing tasks.

Length: 23 mm

The compact length of 23mm enables easy integration of the DSP into various electronic devices with limited space constraints, promoting versatility and flexibility in design layouts.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of digital signal processor and other peripheral IC types expands the functionality and capabilities of the DSP, making it suitable for a wide range of applications in signal processing and data analysis.

Technology: CMOS

The use of CMOS technology in the DSP ensures low power consumption and high noise immunity, resulting in efficient performance and reliability in various operating conditions.

Terminal Form: BALL

The ball terminal form enables reliable and secure connections between the DSP and external devices, ensuring stable electrical contact and preventing signal interference or data loss.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V provides a stable and consistent power source for the DSP, ensuring reliable operation and performance without the risk of overvoltage or power fluctuations.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm allows for high-density mounting of the DSP on a PCB, maximizing space efficiency and promoting a compact design layout for efficient electronic system integration.

Format: FIXED POINT

The fixed-point format used in the DSP ensures accurate and efficient numerical computations, making it suitable for applications that require precision and consistency in data processing and analysis.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates that the DSP is sensitive to moisture but can withstand standard handling and assembly processes, ensuring reliable performance in typical manufacturing environments.

Low Power Mode: YES

The low power mode feature allows the DSP to operate in a power-efficient state when processing tasks with lower computational requirements, conserving energy and extending battery life in portable electronic devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6412AZDK5 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

548

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA548,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6412AZDK5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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