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TMS320C6204ZHK200

Texas Instruments

TMS320C6204ZHK200 by Texas Instruments

TMS320C6204ZHK200 by Texas Instruments is a 32-bit DSP with 200 MHz clock frequency, 288 terminals, and 1.57V max supply voltage. Ideal for digital signal processing applications due to its integrated cache, 65536 RAM words, and low power mode for efficient performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,985 parts In-Stock

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Digiode

USA . 4,979 parts In-Stock

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Bristol Electronics

USA . 69 parts In-Stock

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Ampacity Inc.

Singapore . 263 parts In-Stock

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$7.000

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263

$7.000

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AZTECH Wire

Italy . 224 parts In-Stock

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$10.311

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224

$10.311

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Parana Technologies

USA . 1,740 parts In-Stock

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$25.517

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$26.137

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$25.517

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$26.137

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One Stop Electronics

USA . 1,325 parts In-Stock

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$27.000

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$27.000

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DigiPath Technology Company

USA . 586 parts In-Stock

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$28.098

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586

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ChromeModa Solutions

Germany . 2,760 parts In-Stock

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$28.671

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$23.510

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$28.671

$23.510

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IDEA Electronic Components Group

UK . 1,542 parts In-Stock

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$28.671

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$27.237

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$25.804

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$28.671

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$25.804

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Advanced Electronics

New Zealand . 2,764 parts In-Stock

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$32.685

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$32.358

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$31.051

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2,764

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$32.358

$31.051

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Corohmni

South Africa . 282 parts In-Stock

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$51.045

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Component Stockers USA

USA . 652 parts In-Stock

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$99.990

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Perfect Parts

USA . 10,080 parts In-Stock

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Corphita

USA . 3,256 parts In-Stock

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Microchip USA

USA . 181 parts In-Stock

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A-Z Elektronik GmbH

Germany . 105 parts In-Stock

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Overview

Elevate your digital signal processing capabilities with the TMS320C6204ZHK200 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers cutting-edge technology in a compact package. This DSP offers integrated cache, low power mode, and a maximum clock frequency of 200 MHz, making it ideal for a wide range of applications. From audio processing to telecommunications, this versatile DSP provides unmatched performance and efficiency. Upgrade your projects with the TMS320C6204ZHK200 and experience the value of superior quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it suitable for various environments and applications.

Integrated Cache: YES

Having an integrated cache improves processing efficiency by reducing the need to access external memory constantly, leading to faster data processing.

Maximum Supply Voltage: 1.57 V

The higher maximum supply voltage allows for flexibility in power supply options, catering to different power requirements in various systems.

On Chip Data RAM Width: 8

With a wider data RAM width, the product can handle larger chunks of data simultaneously, enhancing overall performance in data processing tasks.

Address Bus Width: 22

The wider address bus width enables access to a larger memory space, allowing for more efficient handling of memory and data addressing.

Bit Size: 32

Having a 32-bit architecture allows for processing larger chunks of data at once, leading to improved performance in signal processing applications.

No. of Terminals: 288

A higher number of terminals provide greater connectivity options and integration possibilities, enhancing the versatility of the product in different systems.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures reliable performance even in harsh environmental conditions, making it suitable for a wide range of applications.

Maximum Clock Frequency: 200 MHz

The high clock frequency enables fast data processing and real-time signal analysis, making the product ideal for applications requiring high-speed processing.

Technology: CMOS

CMOS technology offers low power consumption and high integration capabilities, making the product energy-efficient and suitable for portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6204ZHK200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B288

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

288

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Words:

65536

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

290 mA

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6204ZHK200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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