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TMS320C6204GLW200

Texas Instruments

TMS320C6204GLW200 by Texas Instruments

TMS320C6204GLW200 by Texas Instruments is a 32-bit DSP with 22-bit address bus, 32-bit external data bus, and max clock frequency of 200 MHz. Ideal for digital signal processing applications requiring high-speed computation in compact devices. Package style: Grid Array, Fine Pitch; Power supplies: 1.5V, 3.3V; Low power mode available.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 7,735 parts In-Stock

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Digiode

USA . 3,124 parts In-Stock

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Electronics Depot

USA . 2 parts In-Stock

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One Stop Electronics

USA . 1,527 parts In-Stock

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$3.000

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AZTECH Wire

Italy . 476 parts In-Stock

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$11.839

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Parana Technologies

USA . 301 parts In-Stock

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$41.498

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DigiPath Technology Company

USA . 490 parts In-Stock

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$45.694

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$42.039

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ChromeModa Solutions

Germany . 4,473 parts In-Stock

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$46.627

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$38.234

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IDEA Electronic Components Group

UK . 100 parts In-Stock

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$46.627

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$44.296

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$41.964

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Corohmni

South Africa . 2,513 parts In-Stock

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Corphita

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Microchip USA

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Perfect Parts

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Overview

Experience the cutting-edge technology of Texas Instruments with the TMS320C6204GLW200 Digital Signal Processor. Unleash the power of high-speed processing with this top-tier product that offers unparalleled performance and reliability. Whether you're in need of advanced signal processing capabilities for audio, video, or telecommunications applications, this DSP is the perfect solution. Trust in Texas Instruments to deliver quality products that meet your needs and exceed your expectations. Upgrade your systems today and take advantage of the benefits this exceptional processor has to offer.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the components inside, making it a reliable choice for electronic devices.

Surface Mount - YES

Surface mount technology allows for compact and efficient assembly, saving space and reducing production costs.

Maximum Supply Voltage - 1.57 V

Operating within a safe voltage range ensures stability and longevity of the DSP, preventing damage from overvoltage.

Address Bus Width - 22

A wider address bus allows for larger memory addressing capability, enabling more complex signal processing tasks.

Bit Size - 32

A larger bit size allows for higher precision and accuracy in signal processing calculations, resulting in improved performance.

Power Supplies (V) - 1.5, 3.3

Support for multiple power supply voltages adds flexibility in system design and compatibility with different power sources.

No. of Terminals - 340

Having a high number of terminals allows for connectivity to various external devices and components, expanding the functionality of the DSP.

Package Style (Meter) - GRID ARRAY, FINE PITCH

Grid array and fine pitch package style facilitate high-density mounting on circuit boards, enabling a compact and efficient design.

Minimum Supply Voltage - 1.43 V

A low minimum supply voltage ensures efficient power consumption and extends the battery life of portable electronic devices.

Terminal Finish - TIN LEAD

Tin lead terminal finish provides good solderability and conductivity, ensuring reliable connections during assembly.

RAM Words - 16384

A large RAM capacity allows for storing and processing a significant amount of data, improving the efficiency of signal processing operations.

Peripheral IC Type - DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with additional peripheral ICs enhances the versatility and functionality of the device for diverse applications.

Technology - CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, resulting in energy-efficient operation and reliable performance.

Low Power Mode - YES

Low power mode capability allows for energy-saving operation, making the DSP suitable for battery-powered devices and applications requiring power efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6204GLW200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B340

JESD-609 Code:

e0

Length:

18 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

340

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA340,22X22,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.095 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

18 mm

Peripheral IC Type:

Trade Compliance

TMS320C6204GLW200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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