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TMS320C54V90AGGU

Texas Instruments

TMS320C54V90AGGU by Texas Instruments

TMS320C54V90AGGU by Texas Instruments is a 16-bit DSP with 23-bit address bus, 40960 RAM words, and max clock freq of 14.7456 MHz. Ideal for digital signal processing applications requiring low power consumption and fixed-point format calculations.

Median Price

$9.070

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 336 parts In-Stock

1+ parts

-

100+ parts

$7.850

1k+ parts

$7.020

10k+ parts

$6.610

336

-

$7.850

$7.020

$6.610

DigiKey

USA . 336 parts In-Stock

1+ parts

-

100+ parts

$9.070

1k+ parts

-

10k+ parts

-

336

-

$9.070

-

-

Verical

USA . 336 parts In-Stock

1+ parts

-

100+ parts

$9.813

1k+ parts

$8.775

10k+ parts

$8.262

336

-

$9.813

$8.775

$8.262

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,091 parts In-Stock

1+ parts

$8.284

100+ parts

-

1k+ parts

-

10k+ parts

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2,091

$8.284

-

-

-

Vyrian

USA . 8,387 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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8,387

-

-

-

-

DigiKey Marketplace

USA . 336 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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336

-

-

-

-

LWI Electronics Inc

India . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1

-

-

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Mentor Electronics Marketing, LLC

USA . 1 parts In-Stock

1+ parts

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-

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1

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 336 parts In-Stock

1+ parts

$7.410

100+ parts

-

1k+ parts

-

10k+ parts

-

336

$7.410

-

-

-

Corphita

USA . 342 parts In-Stock

1+ parts

$7.848

100+ parts

-

1k+ parts

-

10k+ parts

-

342

$7.848

-

-

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Corohmni

South Africa . 3,117 parts In-Stock

1+ parts

$30.066

100+ parts

-

1k+ parts

-

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3,117

$30.066

-

-

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Parana Technologies

USA . 1,714 parts In-Stock

1+ parts

$64.634

100+ parts

-

1k+ parts

-

10k+ parts

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1,714

$64.634

-

-

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DigiPath Technology Company

USA . 264 parts In-Stock

1+ parts

$71.171

100+ parts

$65.477

1k+ parts

-

10k+ parts

-

264

$71.171

$65.477

-

-

IDEA Electronic Components Group

UK . 2,245 parts In-Stock

1+ parts

$72.623

100+ parts

$68.992

1k+ parts

$65.361

10k+ parts

-

2,245

$72.623

$68.992

$65.361

-

ChromeModa Solutions

Germany . 1,123 parts In-Stock

1+ parts

$72.623

100+ parts

$59.551

1k+ parts

-

10k+ parts

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1,123

$72.623

$59.551

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Microchip USA

USA . 307 parts In-Stock

1+ parts

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100+ parts

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307

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Overview

Unleash the power of cutting-edge technology with the TMS320C54V90AGGU by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality digital signal processors that are perfect for a wide range of applications. This DSP offers unmatched value, benefits, and advantages to customers looking to elevate their projects to new heights. Whether you're working on audio processing, telecommunications, or industrial control systems, this product ensures optimal performance and efficiency. Upgrade your design with the TMS320C54V90AGGU and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the DSP, making it suitable for various environments and applications.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 1.65 V

Operates at a low voltage, which can help in reducing power consumption and heat generation.

Address Bus Width: 23

The wide address bus enables efficient communication with external memory devices, improving overall performance.

Bit Size: 16

Offers sufficient processing power for handling complex digital signal processing tasks effectively.

Power Supplies (V): 1.5,3/3.3,5

Supports a range of power supply options, providing flexibility in system design and compatibility with different voltage levels.

No. of Terminals: 144

Provides a sufficient number of connection points for interfacing with other components and peripherals in a system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style offers high density mounting, low profile design for space-constrained applications, and fine pitch for efficient signal routing.

Minimum Supply Voltage: 1.42 V

Ensures reliable operation even at low voltages, enhancing the device's efficiency and performance.

Terminal Position: BOTTOM

Facilitates easier PCB layout and assembly, improving overall system integration and reliability.

Maximum Seated Height: 1.4 mm

Low profile design enables compact system layout and minimizes overall system height, making it suitable for space-constrained applications.

RAM Words: 40960

The ample RAM capacity allows for efficient data storage and processing, enabling the DSP to handle a wide range of signal processing tasks.

Width: 12 mm

Compact width dimensions make it suitable for applications where space is limited, without compromising on performance.

Boundary Scan: YES

Supports boundary-scan testing for easier debugging, verification, and testing of the DSP during production and maintenance.

External Data Bus Width: 16

Wide external data bus allows for faster data transfer rates and enhanced system performance.

Maximum Clock Frequency: 14.7456 MHz

Operates at a high clock frequency, enabling fast processing and response times for real-time signal processing applications.

Internal Bus Architecture: MULTIPLE

Multiple internal buses facilitate efficient data transfer within the DSP, improving overall performance and flexibility in data handling.

Length: 12 mm

Compact length dimensions make it suitable for applications where space is limited, without compromising on performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports various peripheral type ICs for interfacing with different devices, enhancing versatility and compatibility in system designs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides secure connections and facilitates reliable soldering, ensuring robust electrical connections.

Nominal Supply Voltage: 1.5 V

Stable nominal supply voltage ensures consistent performance and reliability of the DSP in various operating conditions.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for compact mounting and efficient signal routing on PCBs, enhancing system performance and reliability.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and optimizes processing efficiency in DSP applications.

Low Power Mode: YES

Supports low power mode for energy-efficient operation, prolonging battery life and reducing overall power consumption.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C54V90AGGU attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

14.7456 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

Length:

12 mm

Low Power Mode:

YES

No. of Terminals:

144

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.5,3/3.3,5

Qualification:

Not Qualified

RAM Words:

40960

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320C54V90AGGU Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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