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TMS320C30GEL

Texas Instruments

TMS320C30GEL by Texas Instruments

TMS320C30GEL by Texas Instruments is a 32-bit DSP with 24-bit address bus, operating at 5V. It features 2048 RAM words, CMOS technology, and a barrel shifter. Ideal for digital signal processing applications requiring high-speed data processing and precision calculations within a temperature range of 0-85°C.

Median Price

$629.865

Lifecycle Status

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In-Stock Inventory

1k+

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Rochester

USA . 736 parts In-Stock

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DigiKey

USA . 778 parts In-Stock

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Nova Conductors

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Digiode

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MRC Electronics

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Chip Stock

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Classic Components Corporation

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4 Star Electronics, Inc.

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Bristol Electronics

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Manoshevitz Elec. Sales

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Parana Technologies

USA . 1,902 parts In-Stock

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$15.563

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$15.937

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DigiPath Technology Company

USA . 1,648 parts In-Stock

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$17.136

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$15.765

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ChromeModa Solutions

Germany . 2,223 parts In-Stock

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$17.486

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$14.339

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IDEA Electronic Components Group

UK . 1,639 parts In-Stock

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Corohmni

South Africa . 186 parts In-Stock

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Ampacity Inc.

Singapore . 319 parts In-Stock

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Continental Prestige Electronics

USA . 4,120 parts In-Stock

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Argo Parts USA

USA . 2,833 parts In-Stock

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Corphita

USA . 4,608 parts In-Stock

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Microchip USA

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Overview

Unlock the power of digital signal processing with the TMS320C30GEL by Texas Instruments. Designed with precision and reliability in mind, Texas Instruments is a trusted manufacturer known for delivering top-quality products. Perfect for a wide range of applications in industries such as telecommunications, audio processing, and automotive systems, this DSP offers unparalleled value and performance. Experience the benefits of seamless data processing, improved efficiency, and advanced features that will take your projects to the next level. Upgrade to the TMS320C30GEL and elevate your designs today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and protection for the DSP, ensuring long-term reliability in various environments.

Maximum Supply Voltage: 5.25 V

Allows for a higher voltage input which can be beneficial in applications that require a wider voltage range for operation.

Address Bus Width: 24

With a wider address bus width, the DSP can handle larger amounts of data simultaneously, improving its processing capabilities.

Package Shape: SQUARE

The square shape allows for easier placement and alignment on circuit boards, saving space and simplifying the design layout.

Bit Size: 32

A larger bit size enables the DSP to perform more complex calculations and process data with higher precision.

Power Supplies (V): 5

A standard power supply voltage of 5V ensures compatibility with common power sources and simplifies the power management of the system.

No. of Terminals: 181

Having a higher number of terminals allows for more connectivity options and integration with other components in the circuit.

Package Style (Meter): GRID ARRAY

The grid array package style provides better thermal dissipation and electrical performance, enhancing the overall functionality of the DSP.

Minimum Supply Voltage: 4.75 V

The lower minimum supply voltage ensures the DSP can operate efficiently even when the power supply fluctuates slightly below the nominal voltage.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this DSP can withstand elevated temperatures without compromising its performance or longevity.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the DSP is capable of functioning in cold environments without any issues.

Terminal Position: PERPENDICULAR

The perpendicular terminal layout allows for easier soldering and better mechanical stability, improving the overall durability of the connection.

Maximum Seated Height: 6.22 mm

A relatively low maximum seated height helps in keeping the overall profile of the system compact and allows for more flexible placement within devices.

RAM Words: 2048

Having a larger RAM capacity enables the DSP to store and process more data, enhancing its performance in memory-intensive applications.

Width: 39 mm

A moderate width allows for efficient placement on circuit boards and compatibility with standard board sizes.

External Data Bus Width: 32

A wider external data bus width enables faster data transfer rates and improved overall system performance.

Internal Bus Architecture: MULTIPLE

Utilizing multiple internal bus architectures enhances data flow efficiency and enables simultaneous processing of multiple instructions, improving overall performance.

Length: 39 mm

The length of the DSP is matched with its width, providing a symmetric form factor that simplifies integration into various electronic systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The DSP's peripheral IC type ensures compatibility with various digital signal processing applications, expanding its potential use cases.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable in noisy environments.

Terminal Form: PIN/PEG

The use of pin/peg terminal form simplifies the installation process and ensures secure connections for uninterrupted data flow.

Maximum Supply Current: 600 mA

With a relatively high maximum supply current, the DSP can handle power fluctuations and high-demand scenarios without risk of overload.

Nominal Supply Voltage: 5 V

Having a stable nominal supply voltage of 5V simplifies power management and ensures consistent performance of the DSP.

Terminal Pitch: 2.54 mm

The standard terminal pitch allows for compatibility with common connectors and facilitates easy integration into existing electronic systems.

Format: FLOATING POINT

Utilizing floating-point format improves the accuracy of calculations and enables the DSP to handle complex mathematical operations with precision.

Barrel Shifter: YES

The presence of a barrel shifter enhances the DSP's ability to perform complex arithmetic and logical operations efficiently, improving overall processing speed.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C30GEL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CPGA-P181

Length:

39 mm

Low Power Mode:

NO

No. of Terminals:

181

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA181M,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

2048

Maximum Seated Height:

6.22 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

600 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

39 mm

Peripheral IC Type:

Trade Compliance

TMS320C30GEL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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