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TLV809K33DBVT

Texas Instruments

TLV809K33DBVT by Texas Instruments

TLV809K33DBVT by Texas Instruments is a Power Management IC with 3.3V nominal voltage, suitable for industrial applications. It features small outline package style, dual terminal position, and 2-6 power supplies. With a temperature range of -40 to 85°C, it supports power supply circuits efficiently.

Median Price

$0.964

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,040 parts In-Stock

1+ parts

$0.918

100+ parts

$0.624

1k+ parts

$0.320

10k+ parts

-

2,040

$0.918

$0.624

$0.320

-

DigiKey

USA . 416 parts In-Stock

1+ parts

$1.010

100+ parts

$0.577

1k+ parts

$0.506

10k+ parts

$0.465

416

$1.010

$0.577

$0.506

$0.465

Mouser Electronics

USA . 326 parts In-Stock

1+ parts

$1.010

100+ parts

$0.578

1k+ parts

$0.486

10k+ parts

$0.464

326

$1.010

$0.578

$0.486

$0.464

Rochester

USA . 125 parts In-Stock

1+ parts

-

100+ parts

$0.576

1k+ parts

$0.478

10k+ parts

$0.426

125

-

$0.576

$0.478

$0.426

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 241 parts In-Stock

1+ parts

$0.422

100+ parts

-

1k+ parts

-

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241

$0.422

-

-

-

Chip Stock

USA . 204,600 parts In-Stock

1+ parts

-

100+ parts

-

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204,600

-

-

-

-

Vyrian

USA . 7,291 parts In-Stock

1+ parts

-

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7,291

-

-

-

-

LWI Electronics Inc

India . 15 parts In-Stock

1+ parts

-

100+ parts

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15

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,104 parts In-Stock

1+ parts

$0.400

100+ parts

-

1k+ parts

-

10k+ parts

-

3,104

$0.400

-

-

-

Parana Technologies

USA . 2,246 parts In-Stock

1+ parts

$4.842

100+ parts

-

1k+ parts

$5.360

10k+ parts

-

2,246

$4.842

-

$5.360

-

DigiPath Technology Company

USA . 22 parts In-Stock

1+ parts

$5.331

100+ parts

-

1k+ parts

-

10k+ parts

-

22

$5.331

-

-

-

ChromeModa Solutions

Germany . 3,466 parts In-Stock

1+ parts

$5.440

100+ parts

$4.461

1k+ parts

-

10k+ parts

-

3,466

$5.440

$4.461

-

-

IDEA Electronic Components Group

UK . 72 parts In-Stock

1+ parts

$5.440

100+ parts

-

1k+ parts

$4.896

10k+ parts

-

72

$5.440

-

$4.896

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$28.551

100+ parts

$25.981

1k+ parts

$23.412

10k+ parts

-

5,000

$28.551

$25.981

$23.412

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Lixinc

USA . 13,241 parts In-Stock

1+ parts

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13,241

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A-Z Elektronik GmbH

Germany . 10,398 parts In-Stock

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10,398

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Perfect Parts

USA . 4,395 parts In-Stock

1+ parts

-

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4,395

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Kepictronics

USA . 145 parts In-Stock

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-

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145

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Overview

Enhance the performance of your power management systems with the TLV809K33DBVT by Texas Instruments. Known for their top-notch manufacturing quality, Texas Instruments delivers reliable and efficient Power Management ICs like this one. With a nominal supply voltage of 3.3V, this small outline and low profile package offers benefits such as precise power supply support and industrial-grade temperature tolerance, making it ideal for a wide range of applications. Upgrade your power systems today and experience the superior value and advantages that Texas Instruments products have to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and helps in protecting the internal components of the IC, making it suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V ensures stable performance and compatibility with a wide range of devices that operate on this voltage.

No. of Terminals: 3

Having a low number of terminals simplifies the installation process and reduces the chances of errors during connections.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand harsh operating conditions and environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extremely cold environments.

Width (mm): 1.6 mm

The small width of 1.6mm allows for compact and space-saving design implementations in various applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures consistent performance in demanding industrial environments.

Maximum Supply Current (Isup): 0.025 mA

Low maximum supply current consumption of 0.025mA helps in reducing power usage and increasing efficiency.

Technical Specifications

Power Management ICs TLV809K33DBVT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

TLV809K33DBVT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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