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TLV809J25DBZT

Texas Instruments

TLV809J25DBZT by Texas Instruments

TLV809J25DBZT by Texas Instruments is a Power Management IC with 3.3V nominal voltage, suitable for industrial applications. It has a small outline package style, matte tin terminal finish, and operates b/w -40 to 85°C temperature range. Ideal for power supply support circuits in compact designs requiring low supply current.

Median Price

$0.542

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 49,358 parts In-Stock

1+ parts

$0.662

100+ parts

$0.509

1k+ parts

$0.268

10k+ parts

-

49,358

$0.662

$0.509

$0.268

-

Rochester

USA . 20,585 parts In-Stock

1+ parts

-

100+ parts

$0.475

1k+ parts

$0.395

10k+ parts

$0.352

20,585

-

$0.475

$0.395

$0.352

DigiKey

USA . 20,585 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.590

10k+ parts

-

20,585

-

-

$0.590

-

Verical

USA . 19,835 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.493

10k+ parts

$0.440

19,835

-

-

$0.493

$0.440

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,544 parts In-Stock

1+ parts

$0.353

100+ parts

-

1k+ parts

-

10k+ parts

-

3,544

$0.353

-

-

-

Vyrian

USA . 3,326 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,326

-

-

-

-

Sunrise Surplus Inc.

USA . 9 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 29,911 parts In-Stock

1+ parts

$0.316

100+ parts

$0.308

1k+ parts

$0.307

10k+ parts

-

29,911

$0.316

$0.308

$0.307

-

Corphita

USA . 628 parts In-Stock

1+ parts

$0.335

100+ parts

-

1k+ parts

-

10k+ parts

-

628

$0.335

-

-

-

Corohmni

South Africa . 429 parts In-Stock

1+ parts

$0.372

100+ parts

-

1k+ parts

-

10k+ parts

-

429

$0.372

-

-

-

Parana Technologies

USA . 436 parts In-Stock

1+ parts

$15.806

100+ parts

-

1k+ parts

$16.167

10k+ parts

-

436

$15.806

-

$16.167

-

ChromeModa Solutions

Germany . 4,929 parts In-Stock

1+ parts

$17.760

100+ parts

$14.563

1k+ parts

-

10k+ parts

-

4,929

$17.760

$14.563

-

-

IDEA Electronic Components Group

UK . 2,194 parts In-Stock

1+ parts

$17.760

100+ parts

$16.872

1k+ parts

$15.984

10k+ parts

-

2,194

$17.760

$16.872

$15.984

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A-Z Elektronik GmbH

Germany . 5,858 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,858

-

-

-

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DigiPath Technology Company

USA . 1,427 parts In-Stock

1+ parts

-

100+ parts

$16.012

1k+ parts

-

10k+ parts

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1,427

-

$16.012

-

-

Overview

Elevate your power management solutions with the TLV809J25DBZT from Texas Instruments. Designed with precision and reliability in mind, this small outline, thin profile IC offers unparalleled performance for a wide range of applications. Whether you're looking to enhance efficiency in industrial settings or optimize power supplies in consumer electronics, this product delivers the quality and value that customers expect from Texas Instruments. Experience seamless operation and peace of mind with the TLV809J25DBZT - the perfect choice for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and resistance to heat, making the product reliable for long-term use.

Surface Mount: YES

The surface mount feature makes installation easy and efficient, saving time during assembly.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage ensures compatibility with a wide range of devices and systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in cold environments, offering versatility in usage.

Maximum Seated Height: 1.12 mm

The compact size of the product with a low seated height enables easy integration into space-constrained applications.

Technical Specifications

Power Management ICs TLV809J25DBZT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.12 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.25V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

TLV809J25DBZT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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