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TLV5625CDR

Texas Instruments

TLV5625CDR by Texas Instruments

TLV5625CDR by Texas Instruments is an 8-bit DAC with max output voltage of 2.6V, settling time of 10us, and linearity error of 0.1953%. Ideal for applications requiring precise analog signal generation in commercial temperature range.

Median Price

$3.850

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$2.981

2,500

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-

$2.981

Rochester

USA . 57 parts In-Stock

1+ parts

-

100+ parts

$3.850

1k+ parts

$3.440

10k+ parts

$3.240

57

-

$3.850

$3.440

$3.240

DigiKey

USA . 57 parts In-Stock

1+ parts

-

100+ parts

$5.260

1k+ parts

-

10k+ parts

-

57

-

$5.260

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,889 parts In-Stock

1+ parts

$3.068

100+ parts

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1,889

$3.068

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Vyrian

USA . 5,581 parts In-Stock

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5,581

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Sensible Micro Corp

USA . 1,558 parts In-Stock

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1,558

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DigiKey Marketplace

USA . 407 parts In-Stock

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407

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Electronics Depot

USA . 69 parts In-Stock

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69

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,157 parts In-Stock

1+ parts

$2.907

100+ parts

-

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3,157

$2.907

-

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$10.854

100+ parts

$9.877

1k+ parts

$8.900

10k+ parts

-

350

$10.854

$9.877

$8.900

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Parana Technologies

USA . 569 parts In-Stock

1+ parts

$11.152

100+ parts

-

1k+ parts

$11.600

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569

$11.152

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$11.600

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DigiPath Technology Company

USA . 1,076 parts In-Stock

1+ parts

$12.279

100+ parts

$11.297

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1,076

$12.279

$11.297

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ChromeModa Solutions

Germany . 5,102 parts In-Stock

1+ parts

$12.530

100+ parts

$10.275

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5,102

$12.530

$10.275

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IDEA Electronic Components Group

UK . 538 parts In-Stock

1+ parts

$12.530

100+ parts

$11.904

1k+ parts

$11.277

10k+ parts

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538

$12.530

$11.904

$11.277

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AZTECH Wire

Italy . 683 parts In-Stock

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$15.350

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683

$15.350

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Microchip USA

USA . 1,932 parts In-Stock

1+ parts

$17.950

100+ parts

$17.840

1k+ parts

$17.790

10k+ parts

$17.730

1,932

$17.950

$17.840

$17.790

$17.730

Kepictronics

USA . 4,255 parts In-Stock

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XScomponents

USA . 1,558 parts In-Stock

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1,558

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Perfect Parts

USA . 224 parts In-Stock

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224

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Overview

Discover the unparalleled quality and reliability of the TLV5625CDR by Texas Instruments, a cutting-edge Digital-to-Analog Converter that offers exceptional performance in a compact package. Designed with precision and innovation in mind, this converter is perfect for a wide range of applications where accuracy and efficiency are paramount. Experience seamless integration, fast settling time, and superior linearity, all while enjoying the peace of mind that comes with choosing a product from a trusted industry leader like Texas Instruments. Elevate your projects with the TLV5625CDR and unlock a world of possibilities.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.6 V

The high maximum analog output voltage allows for accurate and reliable conversion of digital signals to analog, making it suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easy integration into electronic circuits and saves space, making this product convenient for compact designs.

No. of Bits: 8

The 8-bit resolution provides a good balance between accuracy and complexity, making this digital-to-analog converter suitable for a variety of applications.

Maximum Settling Time: 10 us

The fast settling time ensures that the output voltage stabilizes quickly after a digital input change, improving overall performance and reliability.

Power Supplies (V): 3/5

Having multiple power supply options allows for flexibility in system design and compatibility with different voltage requirements.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it an efficient and reliable choice for digital-to-analog conversion.

Input Format: SERIAL

The serial input format simplifies data transmission and allows for easy interfacing with microcontrollers and other digital devices, enhancing the overall usability of this digital-to-analog converter.

Technical Specifications

Digital-to-Analog Converters TLV5625CDR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.1953 %

Nominal Settling Time (tstl):

3 µs

Maximum Supply Current:

2.3 mA

Maximum Settling Time:

10 µs

Sample Rate:

93 kHz

No. of Bits:

8

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

2.6 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

TLV5625CDR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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