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TLV5636IDGKR

Texas Instruments

TLV5636IDGKR by Texas Instruments

TLV5636IDGKR by Texas Instruments is a 12-bit DAC with max output voltage of 2.9V, settling time of 7us, and linearity error of 0.0977%. Ideal for industrial applications requiring precise analog signal generation in compact spaces due to its small outline package and low power consumption.

Median Price

$15.661

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 31 parts In-Stock

1+ parts

$9.582

100+ parts

$7.898

1k+ parts

-

10k+ parts

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31

$9.582

$7.898

-

-

Mouser Electronics

USA . 1,703 parts In-Stock

1+ parts

$21.740

100+ parts

$15.370

1k+ parts

$14.280

10k+ parts

$13.000

1,703

$21.740

$15.370

$14.280

$13.000

DigiKey

USA . 131 parts In-Stock

1+ parts

$21.740

100+ parts

$15.096

1k+ parts

$14.182

10k+ parts

-

131

$21.740

$15.096

$14.182

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Avnet

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$7.718

5,000

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-

-

$7.718

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$8.850

100+ parts

-

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-

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700

$8.850

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Digiode

USA . 1,714 parts In-Stock

1+ parts

$9.103

100+ parts

-

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1,714

$9.103

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Vyrian

USA . 370 parts In-Stock

1+ parts

-

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-

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370

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 271 parts In-Stock

1+ parts

$8.140

100+ parts

-

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-

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271

$8.140

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-

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Corphita

USA . 3,844 parts In-Stock

1+ parts

$8.624

100+ parts

-

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3,844

$8.624

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$8.673

100+ parts

-

1k+ parts

$8.326

10k+ parts

-

100

$8.673

-

$8.326

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Continental Prestige Electronics

USA . 5,097 parts In-Stock

1+ parts

$8.850

100+ parts

-

1k+ parts

-

10k+ parts

$8.673

5,097

$8.850

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-

$8.673

Parana Technologies

USA . 329 parts In-Stock

1+ parts

$15.555

100+ parts

-

1k+ parts

$15.931

10k+ parts

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329

$15.555

-

$15.931

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$16.158

100+ parts

$14.704

1k+ parts

$13.250

10k+ parts

-

1,000

$16.158

$14.704

$13.250

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DigiPath Technology Company

USA . 1,938 parts In-Stock

1+ parts

$17.128

100+ parts

-

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1,938

$17.128

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ChromeModa Solutions

Germany . 3,265 parts In-Stock

1+ parts

$17.478

100+ parts

$14.332

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-

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3,265

$17.478

$14.332

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IDEA Electronic Components Group

UK . 1,955 parts In-Stock

1+ parts

$17.478

100+ parts

$16.604

1k+ parts

$15.730

10k+ parts

-

1,955

$17.478

$16.604

$15.730

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Microchip USA

USA . 1,218 parts In-Stock

1+ parts

$22.090

100+ parts

$21.770

1k+ parts

$21.610

10k+ parts

$21.460

1,218

$22.090

$21.770

$21.610

$21.460

Perfect Parts

USA . 8,466 parts In-Stock

1+ parts

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8,466

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Lixinc

USA . 5,077 parts In-Stock

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5,077

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Argo Parts USA

USA . 4,672 parts In-Stock

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4,672

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Kepictronics

USA . 2,265 parts In-Stock

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2,265

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Overview

Enhance your electronic designs with the TLV5636IDGKR by Texas Instruments, a high-quality Digital-to-Analog Converter that offers precision and reliability. Manufactured by the trusted brand Texas Instruments, this versatile component is ideal for a wide range of applications in industries such as industrial automation, automotive electronics, and consumer electronics. With its compact design and fast settling time, the TLV5636IDGKR provides exceptional value and performance, making it the perfect choice for your next project. Elevate your designs with the innovative technology and superior quality of Texas Instruments.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.9 V

Provides a high maximum analog output voltage, allowing for a wide range of output signals.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection for the internal components.

Surface Mount: YES

Enables easy and secure mounting onto circuit boards, saving space and simplifying assembly.

No. of Bits: 12

Utilizes a high number of bits for accurate and precise digital-to-analog conversion.

Maximum Settling Time: 7 us

Fast settling time ensures quick response and accurate output voltage stabilization.

Power Supplies (V): 3/5

Provides flexibility in power supply options, accommodating both 3V and 5V requirements.

No. of Terminals: 8

Optimal number of terminals for easy connection and integration into a circuit.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in various industrial environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures functionality in harsh temperature conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Digital-to-Analog Converters TLV5636IDGKR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0977 %

Nominal Settling Time (tstl):

1 µs

Maximum Supply Current:

3.3 mA

Maximum Settling Time:

7 µs

Sample Rate:

233 kHz

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

2.9 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold Silver

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP8,.19

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

TLV5636IDGKR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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