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TLV5618AQDR

Texas Instruments

TLV5618AQDR by Texas Instruments

TLV5618AQDR by Texas Instruments is a 12-bit DAC with max output voltage of 2.9V and settling time of 10us. Ideal for automotive applications, it operates at -40 to 125°C, consumes 2.3mA supply current, and uses serial input format for binary code conversion.

Median Price

$14.434

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 42,806 parts In-Stock

1+ parts

-

100+ parts

$12.830

1k+ parts

$11.480

10k+ parts

$10.800

42,806

-

$12.830

$11.480

$10.800

DigiKey

USA . 42,806 parts In-Stock

1+ parts

-

100+ parts

$16.880

1k+ parts

-

10k+ parts

-

42,806

-

$16.880

-

-

Verical

USA . 38,755 parts In-Stock

1+ parts

-

100+ parts

$16.038

1k+ parts

$14.350

10k+ parts

$13.500

38,755

-

$16.038

$14.350

$13.500

Arrow

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$9.688

2,500

-

-

-

$9.688

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$8.762

100+ parts

-

1k+ parts

-

10k+ parts

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100

$8.762

-

-

-

Digiode

USA . 3,212 parts In-Stock

1+ parts

$11.191

100+ parts

-

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3,212

$11.191

-

-

-

Vyrian

USA . 31,356 parts In-Stock

1+ parts

-

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31,356

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Bristol Electronics

USA . 1,282 parts In-Stock

1+ parts

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1,282

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-

-

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EPE Components Inc.

USA . 1,263 parts In-Stock

1+ parts

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1,263

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 31,501 parts In-Stock

1+ parts

$8.230

100+ parts

-

1k+ parts

-

10k+ parts

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31,501

$8.230

-

-

-

Bastille Electronics

Australia . 67 parts In-Stock

1+ parts

$8.762

100+ parts

$8.324

1k+ parts

-

10k+ parts

$7.798

67

$8.762

$8.324

-

$7.798

Continental Prestige Electronics

USA . 3,858 parts In-Stock

1+ parts

$8.762

100+ parts

-

1k+ parts

-

10k+ parts

$8.587

3,858

$8.762

-

-

$8.587

Corphita

USA . 1,841 parts In-Stock

1+ parts

$10.602

100+ parts

-

1k+ parts

-

10k+ parts

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1,841

$10.602

-

-

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Parana Technologies

USA . 95 parts In-Stock

1+ parts

$14.453

100+ parts

-

1k+ parts

$14.896

10k+ parts

-

95

$14.453

-

$14.896

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ChromeModa Solutions

Germany . 6,350 parts In-Stock

1+ parts

$16.239

100+ parts

$13.316

1k+ parts

-

10k+ parts

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6,350

$16.239

$13.316

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IDEA Electronic Components Group

UK . 18 parts In-Stock

1+ parts

$16.239

100+ parts

$15.427

1k+ parts

$14.615

10k+ parts

-

18

$16.239

$15.427

$14.615

-

Microchip USA

USA . 2,971 parts In-Stock

1+ parts

$26.740

100+ parts

$26.360

1k+ parts

$26.170

10k+ parts

$25.980

2,971

$26.740

$26.360

$26.170

$25.980

A-Z Elektronik GmbH

Germany . 5,094 parts In-Stock

1+ parts

-

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5,094

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-

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Argo Parts USA

USA . 3,439 parts In-Stock

1+ parts

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3,439

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DigiPath Technology Company

USA . 1,750 parts In-Stock

1+ parts

-

100+ parts

$14.641

1k+ parts

-

10k+ parts

-

1,750

-

$14.641

-

-

Overview

Experience unparalleled precision and reliability with the TLV5618AQDR digital-to-analog converter by Texas Instruments. Crafted with cutting-edge technology, this small outline package offers a wide range of applications in automotive systems, industrial control, and more. With fast settling times and low linearity error, this converter ensures accurate outputs with minimal power consumption. Elevate your designs with the high-quality performance and versatility that only Texas Instruments can deliver.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.9 V

Provides a high maximum output voltage for versatile applications.

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective package material for good overall product reliability.

No. of Bits: 12

Higher number of bits allows for finer resolution in analog-to-digital conversion.

Nominal Settling Time (tstl): 2.5 us

Fast settling time ensures quick and accurate output response.

Maximum Operating Temperature: 125 °C

Wide operating temperature range suitable for various environments.

Sample Rate: 0.093 MHz

Provides a high sample rate for precise analog conversions.

Technical Specifications

Digital-to-Analog Converters TLV5618AQDR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0977 %

Nominal Settling Time (tstl):

2.5 µs

Maximum Supply Current:

2.3 mA

Maximum Settling Time:

10 µs

Sample Rate:

93 kHz

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

2.9 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

TLV5618AQDR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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