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TLV5620IDRG4

Texas Instruments

TLV5620IDRG4 by Texas Instruments

TLV5620IDRG4 by Texas Instruments is an 8-bit D/A converter with 3.3V supply, 10us settling time, and 0.3906% linearity error. Ideal for industrial applications requiring precise analog signal generation in a compact SMD package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 31,140 parts In-Stock

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Vyrian

USA . 2,638 parts In-Stock

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2,638

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Digiode

USA . 1,225 parts In-Stock

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1,225

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 548 parts In-Stock

1+ parts

$14.532

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548

$14.532

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One Stop Electronics

USA . 1,582 parts In-Stock

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$15.000

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$15.000

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Semicontronic

India . 1,146 parts In-Stock

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$19.000

100+ parts

$18.525

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$18.430

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1,146

$19.000

$18.525

$18.430

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Corohmni

South Africa . 969 parts In-Stock

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$20.557

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969

$20.557

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Parana Technologies

USA . 1,975 parts In-Stock

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$24.532

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$25.197

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$24.532

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$25.197

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DigiPath Technology Company

USA . 2,305 parts In-Stock

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$27.013

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$24.852

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2,305

$27.013

$24.852

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ChromeModa Solutions

Germany . 1,547 parts In-Stock

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$27.564

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$22.602

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$27.564

$22.602

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IDEA Electronic Components Group

UK . 882 parts In-Stock

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$27.564

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$26.186

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$24.808

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882

$27.564

$26.186

$24.808

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Ampacity Inc.

Singapore . 880 parts In-Stock

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$28.000

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Corphita

USA . 3,963 parts In-Stock

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Continental Prestige Electronics

USA . 2,380 parts In-Stock

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Argo Parts USA

USA . 1,195 parts In-Stock

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Assy Fe

Spain . 1,038 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Robosynatics

Brazil . 250 parts In-Stock

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250

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Lucentia Tech

USA . 250 parts In-Stock

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250

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Overview

Elevate your projects with the TLV5620IDRG4 by Texas Instruments, a top-tier manufacturer known for quality and reliability. As a Digital-to-Analog Converter, this product offers unparalleled precision and performance in various applications. Whether you're working on industrial automation or audio equipment, this converter's small outline package and low power consumption make it an ideal choice. Experience the value of seamless integration and superior output with the TLV5620IDRG4 - setting new standards in analog signal processing.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material is durable and cost-effective, making it a good choice for a wide range of applications.

Surface Mount:

YES - Allows for easy and secure installation on PCBs, saving space and reducing assembly time.

Package Shape:

RECTANGULAR - Provides a standardized form factor for easy integration into existing designs.

No. of Bits:

8 - Offers sufficient resolution for many applications while keeping costs low.

Maximum Linearity Error (EL):

0.3906% - Ensures high accuracy in analog signal conversion, making it suitable for precision applications.

Power Supplies (V):

3.3 - Operates efficiently within standard power supply ranges.

No. of Terminals:

14 - Provides flexibility in interfacing with other components.

Package Style (Meter):

SMALL OUTLINE - Compact design saves space in crowded PCB layouts.

Nominal Settling Time (tstl):

10 us - Provides fast response time for rapidly changing input signals.

Maximum Operating Temperature:

85 °C - Can withstand high temperatures, making it suitable for industrial environments.

Minimum Operating Temperature:

40 °C - Ensures reliable performance in cold conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - Offers excellent conductivity and corrosion resistance, increasing product lifespan.

Terminal Position:

DUAL - Provides multiple options for connecting to the circuit, offering design flexibility.

Maximum Seated Height:

1.75 mm - Low profile design allows for compact system integration.

Width:

3.905 mm - Space-saving dimensions allow for efficient use of PCB real estate.

Maximum Time At Peak Reflow Temperature (s):

30 - Allows for reliable soldering during manufacturing processes.

Peak Reflow Temperature °C:

260 - Handles high-temperature soldering processes without damage.

Length:

8.65 mm - Compact size facilitates placement in small electronic devices.

Temperature Grade:

INDUSTRIAL - Designed to operate reliably in harsh industrial environments.

Terminal Form:

GULL WING - Facilitates easy soldering and secure connections.

Maximum Supply Current:

2 mA - Low power consumption for energy-efficient operation.

Input Format:

SERIAL - Convenient input format for seamless integration with digital systems.

Converter Type:

D/A CONVERTER - Digital-to-analog conversion functionality for diverse signal processing applications.

Nominal Supply Voltage:

3.3 V - Compatible with standard supply voltages for easy integration.

Terminal Pitch:

1.27 mm - Standard pitch spacing allows for easy PCB layout.

Input Bit Code:

BINARY - Standard input format for straightforward signal processing.

Technical Specifications

Digital-to-Analog Converters TLV5620IDRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.3906 %

Nominal Settling Time (tstl):

10 µs

Maximum Supply Current:

2 mA

No. of Bits:

8

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Power Supplies:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

14

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.154 in (3.905 mm)

Length:

0.341 in (8.65 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Trade Compliance

TLV5620IDRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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