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DAC8811ICDGKR

Texas Instruments

DAC8811ICDGKR by Texas Instruments

DAC8811ICDGKR by Texas Instruments is a 16-bit D/A converter with 0.0015% linearity error, settling time of 0.5 us, and operates on 3/5 V supplies. Ideal for industrial applications, it features a small outline package with gull wing terminals and supports a 2 MHz sample rate.

Median Price

$12.409

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 268,711 parts In-Stock

1+ parts

$12.409

100+ parts

$10.839

1k+ parts

$7.475

10k+ parts

-

268,711

$12.409

$10.839

$7.475

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$11.000

100+ parts

-

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-

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150

$11.000

-

-

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Digiode

USA . 3,956 parts In-Stock

1+ parts

$11.789

100+ parts

-

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-

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-

3,956

$11.789

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-

-

Chip Stock

USA . 18,500 parts In-Stock

1+ parts

-

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18,500

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Vyrian

USA . 8,793 parts In-Stock

1+ parts

-

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8,793

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 268,668 parts In-Stock

1+ parts

$10.550

100+ parts

-

1k+ parts

-

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268,668

$10.550

-

-

-

Semicontronic

India . 268,462 parts In-Stock

1+ parts

$10.550

100+ parts

$10.286

1k+ parts

$10.234

10k+ parts

-

268,462

$10.550

$10.286

$10.234

-

Continental Prestige Electronics

USA . 539 parts In-Stock

1+ parts

$11.000

100+ parts

-

1k+ parts

-

10k+ parts

$10.780

539

$11.000

-

-

$10.780

Corphita

USA . 2,501 parts In-Stock

1+ parts

$11.168

100+ parts

-

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-

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-

2,501

$11.168

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-

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Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$14.867

100+ parts

$14.124

1k+ parts

$14.124

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-

10

$14.867

$14.124

$14.124

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AZTECH Wire

Italy . 828 parts In-Stock

1+ parts

$19.070

100+ parts

-

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828

$19.070

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Corohmni

South Africa . 142 parts In-Stock

1+ parts

$21.805

100+ parts

-

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142

$21.805

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Parana Technologies

USA . 736 parts In-Stock

1+ parts

$23.823

100+ parts

-

1k+ parts

$24.458

10k+ parts

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736

$23.823

-

$24.458

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ChromeModa Solutions

Germany . 3,704 parts In-Stock

1+ parts

$26.767

100+ parts

$21.949

1k+ parts

-

10k+ parts

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3,704

$26.767

$21.949

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IDEA Electronic Components Group

UK . 2,210 parts In-Stock

1+ parts

$26.767

100+ parts

$25.429

1k+ parts

$24.090

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-

2,210

$26.767

$25.429

$24.090

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Argo Parts USA

USA . 4,748 parts In-Stock

1+ parts

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4,748

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Kepictronics

USA . 2,500 parts In-Stock

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2,500

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Robosynatics

Brazil . 950 parts In-Stock

1+ parts

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950

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Lucentia Tech

USA . 950 parts In-Stock

1+ parts

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950

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DigiPath Technology Company

USA . 836 parts In-Stock

1+ parts

-

100+ parts

$24.133

1k+ parts

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836

-

$24.133

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Lixinc

USA . 264 parts In-Stock

1+ parts

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264

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Overview

Elevate your digital-to-analog conversion experience with the DAC8811ICDGKR by Texas Instruments. Crafted with precision and expertise, this cutting-edge product offers unparalleled quality and reliability. Ideal for a wide range of applications, this converter ensures seamless performance and accuracy. Unlock a world of possibilities with its innovative features and advanced technology. Trust Texas Instruments to deliver excellence in every aspect. Choose the DAC8811ICDGKR and experience the ultimate value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to impact, making it a reliable choice for long-term use.

Surface Mount: YES

Enables easy installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Compact shape allows for efficient use of space on the circuit board.

No. of Bits: 16

Provides high resolution and accuracy for precise digital-to-analog conversion.

Maximum Settling Time: 0.5 us

Offers fast response time, ideal for real-time applications requiring quick signal conversion.

Maximum Linearity Error (EL): 0.0015%

Ensures minimal distortion or inaccuracies in the analog output signal.

Power Supplies (V): 3/5

Compatibility with multiple voltage inputs allows versatility in system design.

No. of Terminals: 8

Provides sufficient connectivity options for easy integration with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Streamlined design enhances space efficiency and reduces overall size of the product.

Nominal Settling Time (tstl): 0.5 us

Consistent settling time ensures stable and reliable analog output signals.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, making it suitable for a wide range of operating environments.

Minimum Operating Temperature: -40 °C

Performs reliably even in cold conditions, ensuring consistent performance across varying temperatures.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

High-quality finish enhances conductivity and corrosion resistance for long-lasting performance.

Terminal Position: DUAL

Dual terminal arrangement allows for better heat dissipation and electrical connection.

Maximum Seated Height: 1.1 mm

Low profile design minimizes space requirements and allows for compact system integration.

Width: 3 mm

Narrow width facilitates placement in tight spaces and crowded circuit boards.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for safe and efficient reflow soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

Withstands high temperature soldering processes without compromising performance.

Length: 3 mm

Compact length allows for flexible placement options in system designs.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications requiring reliable performance in demanding environments.

Sample Rate: 2 MHz

High sampling rate ensures accurate and real-time conversion of digital signals to analog output.

Terminal Form: GULL WING

Gull wing terminals provide secure mechanical and electrical connections for stable performance.

Maximum Supply Current: 0.005 mA

Low power consumption minimizes energy usage and extends battery life.

Input Format: SERIAL

Serial input format allows for easy interfacing with digital systems for seamless signal conversion.

Converter Type: D/A CONVERTER

Dedicated digital-to-analog converter ensures accurate and precise conversion of digital signals to analog output.

Nominal Supply Voltage: 5 V

Compatible with standard 5V power supplies for easy integration into existing systems.

Terminal Pitch: 0.65 mm

Precise terminal pitch enables secure connection and alignment during installation.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates resistance to moisture, enhancing reliability in humid environments.

Input Bit Code: BINARY

Binary input bit code simplifies digital signal processing and ensures compatibility with various systems.

Technical Specifications

Digital-to-Analog Converters DAC8811ICDGKR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0015 %

Nominal Settling Time (tstl):

500 ns

Maximum Supply Current:

5 μA

Maximum Settling Time:

500 ns

Sample Rate:

2 MHz

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold Silver

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP8,.19

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

DAC8811ICDGKR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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