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DAC8812ICPWRG4

Texas Instruments

DAC8812ICPWRG4 by Texas Instruments

DAC8812ICPWRG4 by Texas Instruments is a 16-bit D/A converter with 0.0015% linearity error, settling time of 0.5 us, and operates on 2.7/5 V supplies. Ideal for industrial applications requiring precise analog signal generation in compact spaces due to its small outline package and low power consumption of 0.005 mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,765 parts In-Stock

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9,765

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Digiode

USA . 589 parts In-Stock

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Nova Conductors

Japan . 72 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 853 parts In-Stock

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$5.129

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853

$5.129

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Ampacity Inc.

Singapore . 1,494 parts In-Stock

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$11.000

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$11.000

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Corohmni

South Africa . 10 parts In-Stock

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$14.336

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10

$14.336

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Parana Technologies

USA . 142 parts In-Stock

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$22.264

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$2,067.572

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$20.038

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142

$22.264

$2,067.572

$20.038

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Advanced Electronics

New Zealand . 96 parts In-Stock

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$22.365

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$21.247

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$21.247

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96

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$21.247

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DigiPath Technology Company

USA . 1,953 parts In-Stock

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$24.516

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One Stop Electronics

USA . 363 parts In-Stock

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$25.000

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$25.000

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ChromeModa Solutions

Germany . 3,621 parts In-Stock

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$25.016

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$20.513

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IDEA Electronic Components Group

UK . 2,026 parts In-Stock

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$25.016

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$23.765

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$22.514

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Semicontronic

India . 1,304 parts In-Stock

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$37.000

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$36.075

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$35.890

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Continental Prestige Electronics

USA . 5,680 parts In-Stock

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Robosynatics

Brazil . 5,000 parts In-Stock

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Lucentia Tech

USA . 5,000 parts In-Stock

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$1.812

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$1.812

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$1.812

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$1.812

$1.812

Argo Parts USA

USA . 2,345 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Corphita

USA . 500 parts In-Stock

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Modulus Dynamics

Lithuania . 68 parts In-Stock

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Overview

Experience the superior quality and precision of Texas Instruments with the DAC8812ICPWRG4 Digital-to-Analog Converter. This versatile component offers unmatched performance and reliability, making it ideal for a wide range of applications. From industrial automation to telecommunications, this compact converter provides fast settling times and exceptional linearity, ensuring accurate output every time. Trust Texas Instruments to deliver cutting-edge technology that meets your needs with the DAC8812ICPWRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

No. of Bits: 16

With 16 bits, this converter offers high resolution and accuracy in converting digital signals to analog, making it suitable for precise applications.

Maximum Linearity Error (EL): 0.0015 %

The low linearity error ensures that the output closely matches the input signal, resulting in accurate analog conversion.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this converter can withstand harsh environmental conditions, making it reliable for various industrial applications.

Input Format: SERIAL

The serial input format allows for easy integration with digital systems, providing a seamless interface for analog signal conversion.

Technical Specifications

Digital-to-Analog Converters DAC8812ICPWRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0015 %

Nominal Settling Time (tstl):

500 ns

Maximum Supply Current:

5 μA

Maximum Settling Time:

500 ns

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Power Supplies:

2.7/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

16

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP16,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Trade Compliance

DAC8812ICPWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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