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DAC8560IADGKTG4

Texas Instruments

DAC8560IADGKTG4 by Texas Instruments

DAC8560IADGKTG4 by Texas Instruments is a 16-bit D/A converter with max analog output voltage of 2.5V and settling time of 10us. Ideal for industrial applications, it operates b/w -40 to 105°C, consuming only 0.85mA at nominal voltage of 3V.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 15,997 parts In-Stock

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Digiode

USA . 2,114 parts In-Stock

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Vyrian

USA . 1,578 parts In-Stock

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Nova Conductors

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AZTECH Wire

Italy . 895 parts In-Stock

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$6.485

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Parana Technologies

USA . 1,995 parts In-Stock

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$6.516

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$7.258

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DigiPath Technology Company

USA . 1,829 parts In-Stock

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$7.175

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$6.601

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ChromeModa Solutions

Germany . 1,092 parts In-Stock

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$7.321

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IDEA Electronic Components Group

UK . 477 parts In-Stock

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$6.589

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Corohmni

South Africa . 371 parts In-Stock

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Ampacity Inc.

Singapore . 782 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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One Stop Electronics

USA . 1,579 parts In-Stock

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Semicontronic

India . 467 parts In-Stock

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Corphita

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Argo Parts USA

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Continental Prestige Electronics

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Bastille Electronics

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Overview

Unlock the power of precision with the DAC8560IADGKTG4 by Texas Instruments. Crafted with excellence, this Digital-to-Analog Converter delivers unparalleled performance in a compact form factor. Ideal for industrial applications, this innovative product ensures seamless integration and reliable operation. Experience the superior quality and reliability of Texas Instruments, setting new standards in the industry. Elevate your projects with the DAC8560IADGKTG4, delivering exceptional value and unmatched benefits to customers seeking top-tier solutions.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.5005 V

High maximum analog output voltage allows for a wide range of output signals, making this product suitable for various applications that require precise voltage control.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection to the internal components, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability makes installation and integration of this product easy and convenient, especially in compact electronic designs.

No. of Bits: 16

With 16 bits of resolution, this product offers high precision and accuracy in converting digital signals to analog, perfect for demanding applications.

Maximum Settling Time: 10 us

Fast settling time ensures quick response and stable output, making this product suitable for dynamic control systems that require rapid adjustments.

Power Supplies (V): 3/5

Compatibility with multiple power supply voltages (3V/5V) offers flexibility in system design and integration, allowing for versatile application scenarios.

Maximum Operating Temperature: 105 °C

High maximum operating temperature tolerance enables this product to perform reliably in harsh environmental conditions, making it suitable for industrial and automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Terminal finish with nickel, palladium, and gold provides excellent conductivity and corrosion resistance, ensuring long-term reliability and stable performance.

Technical Specifications

Digital-to-Analog Converters DAC8560IADGKTG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0183 %

Nominal Settling Time (tstl):

12 µs

Maximum Supply Current:

850 μA

Maximum Settling Time:

10 µs

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

2.5005 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP8,.19

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

DAC8560IADGKTG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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