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TLV5630IDWRG4

Texas Instruments

TLV5630IDWRG4 by Texas Instruments

TLV5630IDWRG4 by Texas Instruments is a 12-bit digital-to-analog converter (DAC) with a max analog output voltage of 5.1 V. It has a small outline package style and is suitable for industrial applications requiring precise voltage conversion.

Median Price

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3

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1k+

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Vyrian

USA . 8,584 parts In-Stock

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Digiode

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Nova Conductors

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$11.312

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$10.747

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$10.747

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AZTECH Wire

Italy . 411 parts In-Stock

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$15.771

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Parana Technologies

USA . 2,138 parts In-Stock

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One Stop Electronics

USA . 1,112 parts In-Stock

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$24.000

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ChromeModa Solutions

Germany . 3,234 parts In-Stock

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$24.992

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$20.493

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IDEA Electronic Components Group

UK . 720 parts In-Stock

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$24.992

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$23.742

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$22.493

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Corohmni

South Africa . 77 parts In-Stock

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$26.484

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Ampacity Inc.

Singapore . 1,541 parts In-Stock

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Semicontronic

India . 522 parts In-Stock

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$37.050

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QUARKTWIN TECHNOLOGY LTD

USA . 26,205 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

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DigiPath Technology Company

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Microchip USA

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Bastille Electronics

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Overview

Experience the ultimate in audio quality with the TLV5630IDWRG4 by Texas Instruments. As a leader in manufacturing digital-to-analog converters, Texas Instruments delivers unmatched precision and reliability. The TLV5630IDWRG4 is perfect for a range of applications, offering a maximum analog output voltage of 5.1V and a nominal settling time of just 3 microseconds. With its compact design and industrial-grade temperature tolerance, this converter is ideal for any project. Upgrade your audio experience and unlock endless possibilities with the TLV5630IDWRG4 from Texas Instruments.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.1 V

With a high maximum analog output voltage, this digital-to-analog converter (DAC) allows for a wide range of output signals, making it suitable for various applications.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability, making this DAC suitable for demanding environments.

Surface Mount: YES

The surface mount capability of this DAC allows for easy installation on circuit boards, saving space and enhancing overall system integration.

Package Shape: RECTANGULAR

The rectangular package shape enables straightforward placement and installation, enhancing compatibility and ease of use.

No. of Bits: 12

With a high number of bits, this DAC provides precise and accurate conversion of digital signals to analog, ensuring high-quality output and optimal performance.

Maximum Settling Time: 7 us

The quick settling time of 7 microseconds enables fast and efficient signal conversion, minimizing delays and improving overall system responsiveness.

Maximum Linearity Error (EL): 0.1465 %

The low linearity error ensures accurate and reliable conversion, resulting in faithful reproduction of analog signals.

Power Supplies (V): 3/5

This DAC can be powered by both 3V and 5V power supplies, providing flexibility and compatibility with different systems and designs.

No. of Terminals: 20

With a sufficient number of terminals, this DAC enables easy connection and integration into complex circuitry, facilitating streamlined operation.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for space-saving installation, making this DAC suitable for applications with limited board space.

Nominal Settling Time (tstl): 3 us

The nominal settling time of 3 microseconds ensures rapid and efficient conversion, improving overall system performance and responsiveness.

Maximum Operating Temperature: 85 °C

This DAC can withstand high temperatures up to 85°C, making it suitable for industrial applications where elevated temperatures are common.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range starting from -40°C, this DAC can function reliably in harsh environments and extreme temperature conditions.

Terminal Position: DUAL

The dual terminal position allows for flexible placement and connection options, facilitating easy integration into existing systems and designs.

Maximum Seated Height: 2.65 mm

With a low maximum seated height, this DAC can be installed in compact spaces, making it suitable for applications with space constraints.

Width: 7.5 mm

The compact width of 7.5 mm ensures efficient use of board space, enabling easy integration with other components and circuits.

Minimum Analog Output Voltage: 0 V

This DAC can generate an analog output voltage as low as 0V, allowing for the creation of accurate and precise zero-level signals.

Length: 12.8 mm

The length of 12.8 mm ensures a compact form factor, making this DAC suitable for applications where space is at a premium.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this DAC meets the necessary standards and specifications to function reliably in demanding industrial environments.

Technology: CMOS

Built with CMOS technology, this DAC offers low power consumption, high noise immunity, and compatibility with a wide range of devices and systems.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, ensuring proper signal transmission and reducing the risk of disconnection.

Maximum Supply Current: 21 mA

With a maximum supply current of 21 mA, this DAC operates efficiently, minimizing power consumption and enhancing energy efficiency.

Input Format: SERIAL

This DAC accepts serial input format, making it compatible with devices and systems that utilize serial communication protocols.

Converter Type: D/A CONVERTER

As a digital-to-analog converter, this product is specifically designed to accurately convert digital signals to analog, enabling compatibility with analog-based systems and devices.

Nominal Supply Voltage: 3 V

With a nominal supply voltage of 3V, this DAC offers compatibility with systems and designs that operate on a 3V power supply.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm ensures proper spacing and alignment for reliable connections, facilitating efficient integration into circuit boards.

Input Bit Code: BINARY, 2'S COMPLEMENT BINARY

This DAC supports both binary and 2's complement binary input bit codes, providing flexibility and compatibility with various digital signal sources.

Technical Specifications

Digital-to-Analog Converters TLV5630IDWRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary, 2's Complement Binary

Maximum Linearity Error (EL):

0.1465 %

Nominal Settling Time (tstl):

3 µs

Maximum Supply Current:

21 mA

Maximum Settling Time:

7 µs

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.1 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

20

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G20

Trade Compliance

TLV5630IDWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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