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TLV5630IDWR

Texas Instruments

TLV5630IDWR by Texas Instruments

TLV5630IDWR by Texas Instruments is a 12-bit DAC with max output voltage of 5.1V, settling time of 7us, and linearity error of 0.1465%. Ideal for industrial applications requiring precise analog signal conversion in compact spaces due to its small outline package and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,269 parts In-Stock

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Digiode

USA . 3,730 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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AZTECH Wire

Italy . 784 parts In-Stock

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$6.554

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$6.554

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Parana Technologies

USA . 1,087 parts In-Stock

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$7.035

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$7.582

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1,087

$7.035

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$7.582

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ChromeModa Solutions

Germany . 5,394 parts In-Stock

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$7.905

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$6.482

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IDEA Electronic Components Group

UK . 1,925 parts In-Stock

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$7.905

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$7.114

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Corohmni

South Africa . 621 parts In-Stock

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$16.809

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Ampacity Inc.

Singapore . 1,320 parts In-Stock

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$22.000

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$22.387

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$21.268

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$21.268

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$22.387

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One Stop Electronics

USA . 139 parts In-Stock

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$24.000

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Semicontronic

India . 266 parts In-Stock

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$28.275

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$28.130

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S.R.D Solutions

India . 30,000 parts In-Stock

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Lixinc

USA . 15,285 parts In-Stock

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Continental Prestige Electronics

USA . 3,308 parts In-Stock

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Argo Parts USA

USA . 2,798 parts In-Stock

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Corphita

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DigiPath Technology Company

USA . 1,100 parts In-Stock

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$7.127

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Microchip USA

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Bastille Electronics

Australia . 78 parts In-Stock

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Overview

Unlock the power of precision with the TLV5630IDWR by Texas Instruments. This high-quality digital-to-analog converter offers seamless conversion for a wide range of applications. With a quick settling time, low linearity error, and compact design, this product delivers unmatched performance. Whether you're in industrial automation, telecommunications, or consumer electronics, the TLV5630IDWR provides superior value and reliability. Trust Texas Instruments to bring innovation to life.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.1 V

This high maximum analog output voltage allows for greater flexibility and precision in signal processing applications.

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material offers a good balance of durability and cost-effectiveness.

Surface Mount: YES

The surface mount feature makes the product easier to integrate into circuit boards, saving valuable space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular package shape is a common and convenient design that is easy to work with during installation.

No. of Bits: 12

The 12-bit resolution ensures accurate and detailed conversion of digital signals to analog output.

Maximum Settling Time: 7 us

The fast settling time minimizes signal distortion and ensures reliable performance in time-sensitive applications.

Maximum Linearity Error (EL): 0.1465 %

The low linearity error percentage indicates high accuracy and consistency in analog output.

Power Supplies (V): 3/5

The dual power supply options provide flexibility in voltage selection based on specific application requirements.

No. of Terminals: 20

The ample number of terminals allows for easy connectivity and integration into complex circuitry.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and facilitates compact designs in electronic systems.

Nominal Settling Time (tstl): 3 us

The nominal settling time ensures rapid response and stable performance in dynamic operating conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for reliable operation in a variety of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures reliability in extreme cold environments.

Terminal Position: DUAL

The dual terminal position offers flexibility in installation and accommodates different circuit board layouts.

Maximum Seated Height: 2.65 mm

The low maximum seated height helps conserve space and allows for compact designs in electronic systems.

Width: 7.5 mm

The moderate width size makes the product versatile and compatible with various circuit board configurations.

Minimum Analog Output Voltage: 0 V

The ability to reach a minimum analog output voltage of 0 V ensures a wide output range for different signal processing needs.

Length: 12.8 mm

The moderate length size offers a good balance between compactness and ease of handling during installation.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in demanding industrial environments.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making it suitable for various applications.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical stability and easy soldering for secure connections.

Maximum Supply Current: 21 mA

The low maximum supply current helps conserve energy and reduces heat dissipation for efficient operation.

Input Format: SERIAL

The serial input format offers a convenient and efficient way to interface with digital systems.

Converter Type: D/A CONVERTER

The digital-to-analog converter type enables seamless conversion of digital signals to analog output for a wide range of applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V provides a standardized power source for consistent performance.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for easy placement and connection of the product on circuit boards.

Input Bit Code: BINARY, 2'S COMPLEMENT BINARY

The versatile input bit code options support multiple signal processing formats for increased compatibility and functionality.

Technical Specifications

Digital-to-Analog Converters TLV5630IDWR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary, 2's Complement Binary

Maximum Linearity Error (EL):

0.1465 %

Nominal Settling Time (tstl):

3 µs

Maximum Supply Current:

21 mA

Maximum Settling Time:

7 µs

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.1 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

20

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G20

Trade Compliance

TLV5630IDWR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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