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DAC7611UG4

Texas Instruments

DAC7611UG4 by Texas Instruments

DAC7611UG4 by Texas Instruments is a 12-bit D/A converter with max analog output voltage of 4.111 V and linearity error of 0.0488%. Ideal for industrial applications, it operates b/w -40 to 85 °C with low power consumption at 1 mA. Its small outline package makes it suitable for space-constrained designs requiring fast settling time of 7 us.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Chip Stock

USA . 8,000 parts In-Stock

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Vyrian

USA . 5,248 parts In-Stock

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Digiode

USA . 4,179 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Cogito LLC

Ukraine . 57 parts In-Stock

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Ampacity Inc.

Singapore . 161 parts In-Stock

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$3.000

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One Stop Electronics

USA . 679 parts In-Stock

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$8.000

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Parana Technologies

USA . 1,725 parts In-Stock

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$10.869

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$11.347

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DigiPath Technology Company

USA . 1,778 parts In-Stock

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$11.968

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IDEA Electronic Components Group

UK . 268 parts In-Stock

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$12.212

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$11.601

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$10.991

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ChromeModa Solutions

Germany . 52 parts In-Stock

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Semicontronic

India . 401 parts In-Stock

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AZTECH Wire

Italy . 91 parts In-Stock

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Corohmni

South Africa . 956 parts In-Stock

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Advanced Electronics

New Zealand . 2,841 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

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Bastille Electronics

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Overview

Experience unparalleled precision and reliability with the Texas Instruments DAC7611UG4 Digital-to-Analog Converter. Crafted with the highest quality materials and cutting-edge technology, this product offers exceptional performance in a wide range of applications. Whether you're designing industrial automation systems or audio equipment, the DAC7611UG4 delivers unmatched value, accuracy, and efficiency. Trust Texas Instruments to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Maximum Analog Output Voltage: 4.111 V

This high maximum analog output voltage allows for accurate and precise conversion of digital signals into analog output.

No. of Bits: 12

Having 12 bits ensures a higher resolution and accuracy in converting digital signals into analog output signals.

Maximum Linearity Error (EL): 0.0488%

The low linearity error ensures that the output closely follows the input signal, providing accurate and reliable analog output.

Technology: BICMOS

The BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high speed and low power consumption for efficient operation.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on the PCB and makes it suitable for compact designs and applications where size is a concern.

Input Format: SERIAL

The serial input format allows for easy interfacing with microcontrollers and digital systems, making it versatile and compatible with a wide range of devices.

Technical Specifications

Digital-to-Analog Converters DAC7611UG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

BICMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0488 %

Nominal Settling Time (tstl):

7 µs

Maximum Supply Current:

1 mA

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

4.079 V

Maximum Analog Output Voltage:

4.111 V

Power Supplies:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

DAC7611UG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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