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DAC7644EBG4

Texas Instruments

DAC7644EBG4 by Texas Instruments

DAC7644EBG4 by Texas Instruments is a 16-bit D/A converter with a max analog output voltage of ±2.5 V and settling time of 10 us. Ideal for industrial applications, it operates at temperatures ranging from -40 to 85 °C and has a sample rate of 0.1 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,085 parts In-Stock

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Digiode

USA . 889 parts In-Stock

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889

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Euro-Tech

UK . 17 parts In-Stock

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Ampacity Inc.

Singapore . 1,111 parts In-Stock

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$8.000

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$8.000

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AZTECH Wire

Italy . 701 parts In-Stock

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$8.364

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$8.364

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Corohmni

South Africa . 169 parts In-Stock

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$11.323

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Parana Technologies

USA . 1,886 parts In-Stock

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$18.649

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$18.741

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Semicontronic

India . 621 parts In-Stock

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$20.000

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$19.500

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$19.400

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DigiPath Technology Company

USA . 1,484 parts In-Stock

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$20.535

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$18.892

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ChromeModa Solutions

Germany . 2,541 parts In-Stock

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$20.954

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$17.182

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IDEA Electronic Components Group

UK . 724 parts In-Stock

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$19.906

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One Stop Electronics

USA . 1,194 parts In-Stock

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Component Stockers USA

USA . 317 parts In-Stock

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$99.990

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Continental Prestige Electronics

USA . 3,763 parts In-Stock

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Microchip USA

USA . 2,440 parts In-Stock

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Argo Parts USA

USA . 1,490 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 38 parts In-Stock

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Overview

Unlock a world of precision and reliability with the DAC7644EBG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and innovation. This Digital-to-Analog Converter boasts unparalleled performance and versatility, making it ideal for a wide range of applications. Experience the value of seamless integration, superior accuracy, and high efficiency with the DAC7644EBG4. Elevate your projects to new heights with this cutting-edge solution from Texas Instruments.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.5 V

High maximum analog output voltage allows for a wide range of output signals, providing flexibility in the application of this digital-to-analog converter.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, suitable for various electronic applications.

Surface Mount: YES

Surface mount capability makes it easy to integrate this digital-to-analog converter onto PCBs, saving space and simplifying the manufacturing process.

No. of Bits: 16

With a high number of bits, this converter can provide a high level of precision and accuracy in converting digital signals to analog voltage.

Maximum Settling Time: 10 us

Fast settling time ensures quick and accurate conversion of digital signals to analog voltage, making this converter suitable for real-time applications.

Power Supplies (V): 5/+-5

Wide power supply range allows for flexibility in powering this converter, making it compatible with a variety of electronic systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows this converter to be used in a wide range of environmental conditions without any loss in performance.

Sample Rate: 0.1 MHz

High sample rate ensures that this converter can handle high-frequency signals, making it suitable for applications requiring fast conversion speeds.

Technical Specifications

Digital-to-Analog Converters DAC7644EBG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0046 %

Nominal Settling Time (tstl):

10 µs

Maximum Supply Current:

2 mA

Maximum Settling Time:

10 µs

Sample Rate:

100 kHz

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

-2.5 V

Maximum Analog Output Voltage:

2.5 V

Power Supplies:

5/±5 V

Nominal Negative Supply Voltage:

-5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

48

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.025 in (0.635 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.295 in (7.49 mm)

Length:

0.625 in (15.875 mm)

Maximum Seated Height:

0.11 in (2.79 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Shrink Pitch

Package Code:

Package Equivalence Code:

SSOP48,.4

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Trade Compliance

DAC7644EBG4 Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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