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DAC8560IBDGKTG4

Texas Instruments

DAC8560IBDGKTG4 by Texas Instruments

DAC8560IBDGKTG4 by Texas Instruments is a 16-bit D/A converter with max analog output voltage of 2.5V and settling time of 10us. Ideal for industrial applications, it operates b/w -40 to 105°C, features serial input format, and consumes only 0.85mA supply current.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,410 parts In-Stock

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Digiode

USA . 3,485 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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Ampacity Inc.

Singapore . 630 parts In-Stock

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$4.000

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630

$4.000

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AZTECH Wire

Italy . 283 parts In-Stock

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$7.245

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$7.245

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Advanced Electronics

New Zealand . 64 parts In-Stock

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$14.196

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$13.487

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$13.487

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$14.196

$13.487

$13.487

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One Stop Electronics

USA . 596 parts In-Stock

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$16.000

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$16.000

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Parana Technologies

USA . 1,282 parts In-Stock

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$18.569

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$18.673

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$18.673

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Corohmni

South Africa . 255 parts In-Stock

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$18.789

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$18.789

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IDEA Electronic Components Group

UK . 1,562 parts In-Stock

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$20.864

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$19.821

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$18.778

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ChromeModa Solutions

Germany . 1,330 parts In-Stock

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$20.864

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$17.108

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Semicontronic

India . 640 parts In-Stock

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$21.000

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$20.475

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$20.370

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$21.000

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QUARKTWIN TECHNOLOGY LTD

USA . 16,615 parts In-Stock

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Continental Prestige Electronics

USA . 6,190 parts In-Stock

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Argo Parts USA

USA . 4,125 parts In-Stock

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DigiPath Technology Company

USA . 2,343 parts In-Stock

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$18.811

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Microchip USA

USA . 1,515 parts In-Stock

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Corphita

USA . 1,440 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Experience superior quality and precision with the Texas Instruments DAC8560IBDGKTG4 Digital-to-Analog Converter. Perfect for a wide range of applications, this innovative product offers unmatched value and benefits to customers. From its high-quality manufacturing to its reliable performance, the DAC8560IBDGKTG4 ensures maximum efficiency and accuracy in every use. Upgrade your projects with this cutting-edge solution and unlock new possibilities in digital-to-analog conversion technology.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.5005 V

High maximum analog output voltage allows for accurate and precise voltage output, making this product suitable for applications requiring high resolution.

No. of Bits: 16

With 16 bits, this digital-to-analog converter provides high resolution and accuracy in converting digital signals to analog outputs.

Maximum Settling Time: 10 us

Fast settling time ensures quick and accurate output response, making this product ideal for time-sensitive applications.

Power Supplies (V): 3/5

Support for multiple power supply voltages gives flexibility in powering the device, making it suitable for a variety of systems.

Maximum Operating Temperature: 105 °C

High maximum operating temperature allows this product to be used in industrial environments where temperature variations are common.

Sample Rate: 0.2 MHz

High sample rate enables fast and accurate conversion of digital signals to analog outputs, making this product suitable for high-speed applications.

Technical Specifications

Digital-to-Analog Converters DAC8560IBDGKTG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0122 %

Nominal Settling Time (tstl):

12 µs

Maximum Supply Current:

850 μA

Maximum Settling Time:

10 µs

Sample Rate:

200 kHz

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

2.5005 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold Silver

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP8,.19

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

DAC8560IBDGKTG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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