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DAC8551IDGK

Texas Instruments

DAC8551IDGK by Texas Instruments

DAC8551IDGK by Texas Instruments is a 16-bit D/A converter with max analog output voltage of 5.5V and settling time of 10us. Ideal for industrial applications, it operates b/w -40 to 105°C, with low supply current of 0.3mA making it suitable for compact designs requiring precise analog outputs.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 7,453 parts In-Stock

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7,453

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Digiode

USA . 4,763 parts In-Stock

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4,763

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Vyrian

USA . 2,339 parts In-Stock

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2,339

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Cyclops Electronics Ltd

UK . 2,000 parts In-Stock

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2,000

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 410 parts In-Stock

1+ parts

$7.177

100+ parts

-

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$7.684

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410

$7.177

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$7.684

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DigiPath Technology Company

USA . 688 parts In-Stock

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$7.903

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688

$7.903

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IDEA Electronic Components Group

UK . 2,058 parts In-Stock

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$8.064

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$7.258

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$8.064

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$7.258

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ChromeModa Solutions

Germany . 1,294 parts In-Stock

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$8.064

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$6.612

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$8.064

$6.612

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Aztec Data Supply Inc.

USA . 110 parts In-Stock

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$9.120

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$9.120

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One Stop Electronics

USA . 1,429 parts In-Stock

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$12.000

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$12.000

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AZTECH Wire

Italy . 674 parts In-Stock

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$15.948

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674

$15.948

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Corohmni

South Africa . 8 parts In-Stock

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$22.538

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$22.538

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Semicontronic

India . 918 parts In-Stock

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$23.000

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$22.425

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$22.310

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918

$23.000

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$22.310

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Ampacity Inc.

Singapore . 730 parts In-Stock

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$28.000

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$28.000

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Lixinc

USA . 12,017 parts In-Stock

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Continental Prestige Electronics

USA . 2,728 parts In-Stock

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Corphita

USA . 2,242 parts In-Stock

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Argo Parts USA

USA . 1,628 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Unlock the power of precision with the DAC8551IDGK by Texas Instruments. Crafted with excellence, this digital-to-analog converter offers unparalleled quality and reliability. Ideal for a wide range of applications, from industrial automation to audio equipment, this compact device delivers an analog output voltage of up to 5.5V with exceptional linearity and fast settling time. Trust in Texas Instruments to provide cutting-edge technology that meets your needs. Elevate your projects with the DAC8551IDGK and experience the value of top-tier performance.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.5 V

Provides a high maximum analog output voltage, allowing for a wide range of output levels, making it versatile for various applications.

No. of Bits: 16

With a high number of bits, this product offers high precision and accuracy in converting digital signals to analog, resulting in high-quality output.

Maximum Settling Time: 10 us

Fast settling time ensures quick response and stability in output, making it suitable for applications requiring rapid signal conversion.

Power Supplies (V): 3/5

Supports multiple power supply options, allowing flexibility in system design and compatibility with different power sources.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can withstand harsh environments and high temperatures, ensuring reliable performance in various conditions.

Technical Specifications

Digital-to-Analog Converters DAC8551IDGK attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary, 2's Complement Binary

Maximum Linearity Error (EL):

0.0122 %

Nominal Settling Time (tstl):

12 µs

Maximum Supply Current:

300 μA

Maximum Settling Time:

10 µs

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP8,.19

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PDSO-G8

Trade Compliance

DAC8551IDGK Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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