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TLK2208GPV

Texas Instruments

TLK2208GPV by Texas Instruments

TLK2208GPV by Texas Instruments is an Ethernet transceiver with 8 channels, operating at a data rate of 1300 Mbps. It features a package style of grid array, with a terminal pitch of 1 mm and nominal voltage of 1.8 V. Ideal for network interfaces in commercial-grade applications due to its CMOS technology and compact square package shape.

Median Price

$31.646

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 37 parts In-Stock

1+ parts

-

100+ parts

$28.130

1k+ parts

$25.170

10k+ parts

$23.690

37

-

$28.130

$25.170

$23.690

DigiKey

USA . 37 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

37

-

-

-

-

Verical

USA . 37 parts In-Stock

1+ parts

-

100+ parts

$35.163

1k+ parts

$31.462

10k+ parts

$29.613

37

-

$35.163

$31.462

$29.613

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,509 parts In-Stock

1+ parts

$29.688

100+ parts

-

1k+ parts

-

10k+ parts

-

3,509

$29.688

-

-

-

Vyrian

USA . 6,102 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,102

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,039 parts In-Stock

1+ parts

$9.786

100+ parts

-

1k+ parts

$10.359

10k+ parts

-

2,039

$9.786

-

$10.359

-

ChromeModa Solutions

Germany . 5,784 parts In-Stock

1+ parts

$10.995

100+ parts

$9.016

1k+ parts

-

10k+ parts

-

5,784

$10.995

$9.016

-

-

IDEA Electronic Components Group

UK . 130 parts In-Stock

1+ parts

$10.995

100+ parts

$10.445

1k+ parts

$9.896

10k+ parts

-

130

$10.995

$10.445

$9.896

-

Corphita

USA . 135 parts In-Stock

1+ parts

$28.125

100+ parts

-

1k+ parts

-

10k+ parts

-

135

$28.125

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-

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Microchip USA

USA . 203 parts In-Stock

1+ parts

$68.980

100+ parts

$67.780

1k+ parts

$67.180

10k+ parts

$66.580

203

$68.980

$67.780

$67.180

$66.580

DigiPath Technology Company

USA . 1,829 parts In-Stock

1+ parts

-

100+ parts

$9.913

1k+ parts

-

10k+ parts

-

1,829

-

$9.913

-

-

Overview

Unlock seamless and reliable network connectivity with the TLK2208GPV by Texas Instruments. Crafted with precision and expertise, this Ethernet transceiver offers unparalleled performance in a compact package. From fast data rates to low power consumption, this innovative solution sets new standards in network interfaces. Whether you're designing telecommunications equipment or industrial applications, this product delivers exceptional value and benefits, ensuring optimal connectivity and efficiency for your projects. Elevate your network solutions with Texas Instruments' TLK2208GPV and experience a new level of performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or long-term use.

Surface Mount: YES

Surface mount capability simplifies installation and reduces the need for additional mounting hardware, making it easy to integrate into existing systems.

Power Supplies (V): 1.8,1.8/2.5

Multiple power supply options provide flexibility in powering the device, allowing compatibility with various systems and environments.

No. of Terminals: 289

The high number of terminals allows for efficient data transfer and connectivity, enhancing the performance of the network interface.

Package Style (Meter): GRID ARRAY

The grid array package style offers a compact design and efficient use of space, suitable for tight layouts and high-density installations.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in challenging thermal conditions, making it suitable for a wide range of environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function in cold environments, providing versatility in deployment options.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy connectivity and integration into systems, allowing for efficient installation and maintenance.

Maximum Seated Height: 2 mm

The low maximum seated height enables a slim and compact design, suitable for space-constrained applications and systems.

Width: 19 mm

The compact width of the product allows for efficient use of space and easy integration into systems with limited space availability.

Length: 19 mm

The compact length of the product offers a space-saving solution and easy installation in various setups and configurations.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating conditions, making it suitable for most commercial applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of systems, ensuring optimal performance and efficiency.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections, ensuring stable data transmission and preventing signal disruptions.

No. of Transceivers: 8

The high number of transceivers allows for efficient data exchange and communication, enhancing the overall performance of the network interface.

Telecom IC Type: ETHERNET TRANSCEIVER

The use of Ethernet transceiver technology ensures high-speed and reliable data transmission over Ethernet networks, making it a suitable choice for network connectivity.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8V provides stable and efficient power supply to the device, ensuring consistent performance and reliability.

Terminal Pitch: 1 mm

The small terminal pitch of 1mm allows for compact design and efficient use of space, making it suitable for high-density installations and tight layouts.

Data Rate: 1300 Mbps

With a high data rate of 1300 Mbps, the product offers fast and efficient data transfer, ideal for high-bandwidth applications and demanding network environments.

Technical Specifications

Network Interfaces TLK2208GPV attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1300 Mbps

JESD-30 Code:

S-PBGA-B289

Length:

19 mm

No. of Functions:

1

No. of Terminals:

289

No. of Transceivers:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA289,17X17,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,1.8/2.5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

19 mm

Trade Compliance

TLK2208GPV Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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