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TLK1201AIRCPR

Texas Instruments

TLK1201AIRCPR by Texas Instruments

TLK1201AIRCPR by Texas Instruments is an Ethernet transceiver with a data rate of 1250 Mbps. It operates at temperatures ranging from -40 to 85 °C and requires a nominal voltage of 2.5 V. This network interface IC comes in a square-shaped package with 64 terminals, suitable for industrial applications.

Median Price

$6.100

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,538 parts In-Stock

1+ parts

-

100+ parts

$6.100

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1,538

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$6.100

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Rochester

USA . 476 parts In-Stock

1+ parts

-

100+ parts

$5.290

1k+ parts

$4.730

10k+ parts

$4.460

476

-

$5.290

$4.730

$4.460

Verical

USA . 448 parts In-Stock

1+ parts

-

100+ parts

$6.612

1k+ parts

$5.912

10k+ parts

$5.575

448

-

$6.612

$5.912

$5.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,443 parts In-Stock

1+ parts

$5.576

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-

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3,443

$5.576

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Vyrian

USA . 140 parts In-Stock

1+ parts

$5.870

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140

$5.870

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DigiKey Marketplace

USA . 1,566 parts In-Stock

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1,566

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Cyclops Electronics Ltd

UK . 993 parts In-Stock

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993

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Distributors (Availability)

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Corphita

USA . 4,903 parts In-Stock

1+ parts

$5.283

100+ parts

-

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4,903

$5.283

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Component Stockers USA

USA . 3,471 parts In-Stock

1+ parts

$5.920

100+ parts

$5.570

1k+ parts

$5.030

10k+ parts

-

3,471

$5.920

$5.570

$5.030

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Parana Technologies

USA . 1,930 parts In-Stock

1+ parts

$9.034

100+ parts

-

1k+ parts

$9.699

10k+ parts

-

1,930

$9.034

-

$9.699

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ChromeModa Solutions

Germany . 4,118 parts In-Stock

1+ parts

$10.151

100+ parts

$8.324

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4,118

$10.151

$8.324

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IDEA Electronic Components Group

UK . 1,624 parts In-Stock

1+ parts

$10.151

100+ parts

$9.643

1k+ parts

$9.136

10k+ parts

-

1,624

$10.151

$9.643

$9.136

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A-Z Elektronik GmbH

Germany . 6,492 parts In-Stock

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6,492

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Microchip USA

USA . 4,661 parts In-Stock

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4,661

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GreenTree Electronics

Israel . 993 parts In-Stock

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993

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DigiPath Technology Company

USA . 705 parts In-Stock

1+ parts

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100+ parts

$9.152

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705

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$9.152

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Kepictronics

USA . 585 parts In-Stock

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585

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Overview

Upgrade your network interfaces with the TLK1201AIRCPR by Texas Instruments, a top-quality Ethernet transceiver designed for industrial applications. With a reliable manufacturer like Texas Instruments backing it up, this product offers unparalleled value and benefits to customers. Say goodbye to slow connections and hello to lightning-fast data rates of up to 1250 Mbps. Trust the TLK1201AIRCPR to deliver seamless performance in any temperature conditions, making it the perfect choice for your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for long-term use in networking applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 2.5

Operating at 2.5 volts is energy-efficient and ensures optimal performance without consuming excessive power.

Data Rate: 1250 Mbps

With a high data rate of 1250 Mbps, this network interface provides fast and reliable data transmission, suitable for demanding networking tasks.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high performance, making it a cost-effective and efficient choice for network interfaces.

Technical Specifications

Network Interfaces TLK1201AIRCPR attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1250 Mbps

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.09 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK1201AIRCPR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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